1. A cooling apparatus comprising:
a high thermal conductivity electronics drawer cover;
a plurality of high thermal conductivity cooling fins in thermal contact with an underside of said cover;
a fluid cooling loop including:
a plurality of high heat transfer fluid channels in thermal contact with said cover underside, said channels located in proximity to said fins;
a flexible vapor conduit, a first end of said vapor conduit being in fluid flow communication with a first end of said channels;
a high heat transfer boiling chamber in fluid flow communication with a second end of said vapor conduit;
at least one flexible condensate return conduit in fluid flow communication with a second end of said fluid channels, said return conduit also in fluid flow communication with said boiling chamber; and
a mechanical biasing component in mechanical contact with said underside of said cover, and with an upper side of said boiling chamber.
2. The apparatus of claim 1, wherein said flexible vapor conduit is a metallic bellows, and said mechanical biasing component is also said metallic bellows.
3. The apparatus of claim 1, wherein said mechanical biasing component is a spring.
4. The apparatus of claim 1, further comprising a cooling fluid.
5. The apparatus of claim 4, wherein said cooling fluid is at a pressure below atmospheric pressure.
6. The apparatus of claim 5, wherein said cooling fluid boils at a temperature no higher than 60C.
7. The apparatus of claim 4, wherein said cooling fluid is selected from the group consisting of water, brine, refrigerant, and fluorocarbons.
8. The apparatus of claim 1, wherein said boiling chamber is constructed of a material selected from the group consisting of copper, aluminum, stainless steel, and nickel.
9. The apparatus of claim 1, said fluid flow channels further comprising:
an inlet plenum at said channel first end, said inlet plenum distributing fluid from said vapor conduit to said plurality of channels; and
an outlet plenum at said channel second end, said outlet plenum collecting fluid from said plurality of channels.
10. The apparatus of claim 1, wherein said flexible return conduit includes at least one inflexible portion and at least one flexible portion.
11. The apparatus of claim 1, wherein said channels and said fins are interdigitated.
12. A cooled electronic drawer apparatus comprising:
a drawer frame, said drawer frame including a bottom, side components, a front air inlet component, and a rear air outlet component;
an electronics board assembly connected to said drawer frame, said board assembly including a plurality of electronic components, said plurality of components including at least one high power component;
at least one air moving device connected to said drawer frame;
a cooling assembly disengagably connected to said drawer frame, said cooling assembly including:
a high thermal conductivity drawer cover;
a plurality of high thermal conductivity cooling fins in thermal contact with an underside of said cover;
a fluid cooling loop including:
a plurality of high heat transfer fluid channels in thermal contact with said cover underside, said channels located in proximity to said fins;
a flexible vapor conduit, a first end of said vapor conduit being in fluid flow communication with a first end of said channels;
a high heat transfer boiling chamber in fluid flow communication with a second end of said vapor conduit;
at least one flexible condensate return conduit in fluid flow communication with a second end of said fluid channels, said return conduit also in fluid flow communication with said boiling chamber; and
a mechanical biasing component in mechanical contact with said underside of said cover, and with an upper side of said boiling chamber, and
wherein said boiling chamber is in thermal contact with said at least one high power component when said cover is in a closed position.
13. The apparatus of claim 12, wherein said mechanical biasing component is compressed when said cover is in a closed position, said mechanical biasing component exerting a compressive force between said boiling chamber and said high power component.
14. The apparatus of claim 12, wherein said flexible vapor conduit is a metallic bellows, and said mechanical biasing component is also said metallic bellows.
15. The apparatus of claim 12, wherein said mechanical biasing component is a spring.
16. The apparatus of claim 12, wherein said electronics board assembly includes a plurality of high power components.
17. The apparatus of claim 12, further comprising a cooling fluid.
18. The apparatus of claim 12, wherein said cover is detachable from said drawer frame.
19. The apparatus of claim 18, wherein said cover is pivotally mounted to one of said frame components.
20. The apparatus of claim 12, wherein said cover is hingably mounted to one of said frame components.
21. A cooled electronic rack system comprising:
a rack frame;
at least one electronic drawer slidably mounted within said frame, said drawer including:
a drawer frame, said drawer frame including a bottom, side components, a front air inlet component, and a rear air outlet component;
an electronics board assembly connected to said drawer frame, said board assembly including a plurality of electronic components, said plurality of components including at least one high power component;
at least one air moving device connected to said drawer frame;
a cooling assembly disengagably connected to said drawer frame, said cooling assembly including:
a high thermal conductivity drawer cover;
a plurality of cooling fins in thermal contact with an underside of said cover;
a fluid cooling loop including:
a plurality of high heat transfer fluid channels in thermal contact with said cover underside, said channels located in proximity to said fins;
a flexible vapor conduit, a first end of said vapor conduit being in fluid flow communication with a first end of said channels;
a high heat transfer boiling chamber in fluid flow communication with a second end of said vapor conduit;
at least one flexible condensate return conduit in fluid flow communication with a second end of said fluid channels, said return conduit also in fluid flow communication with said boiling chamber;
a mechanical biasing component in mechanical contact with said underside of said cover, and with an upper side of said boiling chamber, and
wherein said boiling chamber is in thermal contact with said at least one high power component when said cover is in a closed position.
22. The system of claim 21, including a plurality of said electronic drawers.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of designing an integrated circuit, said method comprising:
defining a preliminary design of said integrated circuit;
identifying, by using a computer, critical vertical interconnects in said preliminary design;
defining vertical transmission line model to represent each critical vertical interconnect, said transmission line model based on a closed environment;
defining a layout design of the integrated circuit, comprising circuit components and parameters thereof, using said preliminary design and said transmission line model for each critical vertical interconnect; and
extracting circuit component parameters from the layout design for simulation of the design using the extracted circuit component parameters; wherein said closed environment of a design structure comprises a design fragment including the core structure itself and one or more additional design elements which affect its electrical behavior such that the whole fragment is represented and simulated by a standalone, independent model of the core structure in a real design environment.
2. The method according to claim 1, wherein said transmission line model represents frequency dependent behavior of said vertical interconnects utilizing multi-segment RLC scalable filter networks.
3. The method according to claim 1, wherein said transmission line model comprises a signal TSV model.
4. The method according to claim 1, wherein said transmission line model comprises a signal micro-bump model.
5. The method according to claim 1, wherein a modeling methodology of said design method is based on dividing an electromagnetic problem into at least a serial magnetic problem for calculating a Z-element including resistance R and inductance L components.
6. The method according to claim 5, wherein said Z element is modeled using a multi-segment filter RL network.
7. The method according to claim 1, wherein a modeling methodology of said design method is based on dividing an electromagnetic problem into at least a parallel electric problem for calculating a Y-element including capacitance C and conductance G components.
8. The method according to claim 7, wherein said Y element is modeled using a multi-segment CG network.
9. The method according to claim 1, wherein the diameter of a TSV and micro-bump is significantly smaller than the shortest wavelength in a given signal bandwidth.
10. An integrated circuit design system, comprising a memory in communication with a processor device configured for:
defining a preliminary design of said integrated circuit;
identifying critical vertical interconnects in said preliminary design;
defining a vertical transmission line model to represent each critical vertical interconnect, said transmission line model based on a closed environment;
defining a layout design of the integrated circuit, comprising circuit components and parameters thereof, using said preliminary design and said transmission line model for each critical vertical interconnect; and
extracting circuit component parameters from the layout design for simulation of the design using the extracted circuit component parameters; wherein said closed environment of a design structure comprises a design fragment including the core structure itself and one or more additional design elements which affect its electrical behavior such that the whole fragment is represented and simulated by a standalone, independent model of the core structure in a real design environment.
11. The system according to claim 10, wherein said transmission line model represents frequency dependent behavior of said vertical interconnects utilizing multi-segment RLC scalable filter networks.
12. The system according to claim 10, wherein said transmission line model comprises a signal TSV model.
13. The system according to claim 10, wherein said transmission line model comprises a signal micro-bump model.
14. The system according to claim 10, wherein a modeling methodology of said design method is based on dividing an electromagnetic problem into at least a serial magnetic problem for calculating a Z-element including resistance R and inductance L components.
15. The system according to claim 14, wherein said Z element is modeled using a multi-segment filter RL network.
16. The system according to claim 10, wherein a modeling methodology of said design method is based on dividing an electromagnetic problem into at least a parallel electric problem for calculating a Y-element including capacitance C and conductance G components.
17. The system according to claim 16, wherein said Y element is modeled using a multi-segment CG network.
18. The system according to claim 10, wherein the diameter of a TSV and micro-bump is significantly smaller than the shortest wavelength in a given signal bandwidth.
19. A computer program product comprising a non-transitory computer readable medium having embodied therein computer readable program code means for causing a computer to implement an integrated circuit design system, comprising:
defining a preliminary design of said integrated circuit;
identifying critical vertical interconnects in said preliminary design;
defining a vertical transmission line model to represent each critical vertical interconnect, said transmission line model based on a closed environment;
defining a layout design of the integrated circuit, comprising circuit components and parameters thereof, using said preliminary design and said transmission line model for each critical vertical interconnect; and
extracting circuit component parameters from the layout design for simulation of the design using the extracted circuit component parameters; wherein said closed environment of a design structure comprises a design fragment including the core structure itself and one or more additional design elements which affect its electrical behavior such that the whole fragment is represented and simulated by a standalone, independent model of the core structure in a real design environment.