1. A flexible printed circuit board, comprising:
a substrate comprising a first surface and a second surface opposite to the first surface, wherein a layout zone and a reinforcing zone disposed nearby the layout zone are on the first surface;
a plurality of signal lines disposed on the layout zone;
a first reinforcing layer disposed on the reinforcing zone; and
a second reinforcing layer disposed on the second surface of the substrate.
2. The flexible printed circuit board of claim 1 further comprising a first connection layer covering the plurality of signal lines, the first reinforcing layer, and the substrate.
3. The flexible printed circuit board of claim 2 further comprising a second connection layer disposed on the second surface of the substrate for covering the second reinforcing layer.
4. The flexible printed circuit board of claim 3 further comprising a first structure layer disposed on the first connection layer and a second structure layer disposed on the second connection layer, the first structure layer and the second structure layer are polyimide structure layer.
5. The flexible printed circuit board of claim 1 wherein the substrate comprises a third structure layer being a polyimide structure layer.
6. The flexible printed circuit board of claim 3 wherein the substrate further comprises a third connection layer on the first surface and a fourth connection layer on the second surface, the first connection layer, the plurality of signal lines and the first reinforcing layer are disposed on the third connection layer, and the second reinforcing layer and the second connection layer are disposed on the fourth connection layer.
7. The flexible printed circuit board of claim 1 wherein the plurality of signal lines, the first reinforcing layer, and the second reinforcing layer are made of the same material.
8. The flexible printed circuit board of claim 1 wherein the first reinforcing layer are parallel to the plurality of signal lines.
9. The flexible printed circuit board of claim 1 wherein the first reinforcing layer and the second reinforcing layer are made of metal.
10. The flexible printed circuit board of claim 1 wherein an area of the second reinforcing layer is larger than a layout area of the plurality of signal lines.
11. The flexible printed circuit board of claim 1 wherein the substrate comprises a first portion, a second portion, and a bent portion therebetween, and part of the first reinforcing layer and part of the second reinforcing layer are disposed on the bent portion.
12. The flexible printed circuit board of claim 1 wherein the first reinforcing layer and the second reinforcing layer are closer to the edge of the substrate than the plurality of signal lines are.
13. The flexible printed circuit board of claim 12 wherein the first reinforcing layer comprises a first edge adjacent to the edge of the substrate, the second reinforcing layer comprises a second edge adjacent to the edge of the substrate, and the first edge is flush with the second edge.
14. The flexible printed circuit board of claim 12 wherein the first reinforcing layer comprises a first edge adjacent to the edge of the substrate, the second reinforcing layer comprises a second edge adjacent to the edge of the substrate, and the second edge is closer to the edge of the substrate than the first edge is.
15. The flexible printed circuit board of claim 1 wherein the second reinforcing layer is disposed correspondingly to the layout area and the reinforcing area.
16. The flexible printed circuit board of claim 1 wherein the second reinforcing layer is disposed correspondingly to the reinforcing area.
17. The flexible printed circuit board of claim 1 wherein the second reinforcing layer is a continuous metal film with a plurality of holes.
18. The flexible printed circuit board of claim 17 wherein a metal coverage ratio of the first surface substantially equals to that of the second surface.
19. The flexible printed circuit board of claim 1 further comprising a ground wire disposed on the layout zone, the second reinforcing layer electrically connects to the ground wire through a first via.
20. The flexible printed circuit board of claim 19 wherein the first reinforcing layer electrically connects to the second reinforcing layer through a second via.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for face recognition comprising the steps of:
(a) collecting a match facial image and a reference image;
(b) selecting one or more facial features from each of the match facial image and the reference image;
(c) obtaining at least one match facial feature and a match deviation of the reference image corresponding to the facial features of the match facial image;
(d) creating a match geometric model and a reference geometric model;
(e) obtaining a model deviation by comparing the match geometric model and the reference geometric model; and
(f) employing a match deviation and a model deviation to obtain a recognition score based on a predetermined model.
2. The method of claim 1, wherein step (c) is performed using a local binary pattern (LBP) or speed-up robust feature (SURF) which is a feature point or corner point detection algorithm
3. The method of claim 1, further comprising the steps of:
(1) calculating a coordinate value of the left eye and a coordinate value of the right eye of the match facial image;
(2) calculating an angle of a virtual straight line from the left eye to the right eye with respect to a virtual horizontal line;
(3) rotating the match facial image an angle equal to the calculated angle in order to dispose the virtual straight line to be parallel to the virtual horizontal line;
(4) calculating a distance between the left eye and the right eye based on the coordinate values thereof; and
(5) either zooming in the match facial image if the distance is less than a predetermined distance or zooming out the match facial image if the distance is greater than the predetermined distance.
4. The method of claim 3, wherein the predetermined distance is size of 30 pixels.
5. The method of claim 1, wherein step (c) is done by employing a block matching.
6. The method of claim 5, wherein the block matching is selected from the group consisting of sum of squared distance (SSD), sum of absolute differences (SAD), and normalized cross correlation (NCC).
7. The method of claim 1, wherein steps (d) and (e) comprise the sub-steps of:
(i) obtaining a (x, y) coordinate from each of the match facial features of the match facial image and the facial feature points of the reference image;
(ii) creating a match geometric model and a reference geometric model based on the (x, y) coordinates of the match facial feature points of the match facial image and the facial feature point of the reference image respectively according to a predetermined model; and
(iii) obtaining a model deviation by calculating the match geometric model and the reference geometric model according to the predetermined model.
8. The method of claim 1, wherein the recognition score comprises a positive recognition score and a negative recognition score.
9. The method of claim 8, wherein the match facial image is taken from a person and the reference image is an image record stored in the database when the recognition score is defined as the positive recognition score, and the match facial image is an image record stored in the database and the reference image is taken from a person when the recognition score is defined as the negative recognition score.
10. The method of claim 8, wherein the recognition score is a sum of the positive recognition score and the negative recognition score.