What is claimed is:
1. (Amended) An apparatus for totaling and analyzing replies, which comprises a center apparatus and a plurality of replying units carrying identification codes, the center apparatus comprising:
a primary controlling apparatus possessing input means for data and instructions input, ordering sending of command signals to the plurality of replying units, and totaling and analyzing the replying signals from the plurality of replying units responded to the command signals;
a center relaying and light signal emitting-receiving apparatus, outputting the command signals to the plurality of replying units requesting reply according to the direction of the primary controlling apparatus, converting the command signals to infrared light, and emitting, receiving light signals from the plurality of replying units responded to the command signals requesting replying signals in the plurality of replying windows placed in an replying sections of an replying period designated to each of the plurality of replying section identified by identification codes, detecting replying signals from the light signals identifying respective replying units according to the identification codes, and inputting the replying signals to the primary controlling apparatus;
the plurality of replying units, each comprising;
an reply inputting portion inputting an reply;
a light-receiving portion receiving light signals and detecting the command signals;
a control portion outputting a replying signal by a replying method pointed by the command signals to the replying unit, and to windows selected from the plurality of windows placed in the replying sections of the replying period designated by the command signal for the replying section; and
light signal emitting portion converting the replying signals to infrared light and emitting to the center relaying and light signal emitting-receiving apparatus.
2. The apparatus for totaling and analyzing replies as in claim 1, wherein the center relaying and light emitting-receiving apparatus comprises a center light emitting-receiving apparatus emitting the command for requesting reply converting to infrared light, and receiving and detecting the infrared light replying signals from the plurality of replying units, and relaying apparatus signal processing and relaying between the primary controlling apparatus and center light emitting-receiving apparatus.
3. The apparatus for totaling and analyzing replies as in claim 2, wherein the apparatus for totaling and analyzing replies comprises the center light emitting-receiving apparatus plurally and a transmitting time controlling device controlling each transmitting time between the center light emitting-receiving apparatus and the relaying apparatus to keep substantially equal.
4. The apparatus for totaling and analyzing replies as in claim 1, wherein the center apparatus comprises a display device displaying a question and a result of totaling and analyzing.
5. The apparatus for totaling and analyzing replies as in claim 1, wherein the command signal directing replies emitted by the center apparatus comprises a replying unit exciting signal, a frame-synchronizing signal, a mode command signal designating kind of response and a replying period designating signal designating replying period for each identifying code, and the replying units are g excited by the replying unit exciting signal, synchronize with the frame synchronizing signal, and reply at the replying period of each identifying code designated by the replying period designating signal following the mode command signal.
6. The apparatus for totaling and analyzing replies as in claim 5, wherein the center apparatus emits command signals of pulse array having substantially equal pulse width and being distinguished by pulse interval, and the replying unit respond distinguishing the kinds of signals by the interval of pulses.
7. The apparatus for totaling and analyzing replies as in claim 6, wherein the replying unit places replying signal windows in a period designated by the command directing replies according to the identification code and outputs replying signals in the replying signal windows, and the center light emitting-receiving apparatus of the center apparatus recognizes and distinguishes the signals at the replying signal windows in the period designated according to the identification code as the signals from the replying unit.
8. The apparatus for totaling and analyzing replies as in claim 7, wherein the replying signal windows are set at the later half of the replying period.
9. The apparatus for totaling and analyzing replies as in claim 1, wherein the replying unit stops the sending by a command to the replying units accompanying command for stop sending.
10. The apparatus for totaling and analyzing replies as in claim 1, wherein at least either one of the replying unit and the center apparatus comprises an amplifier possessing an amplification circuit employing an electronic device in which a transition of the output voltage occurs when an input voltage exceeds a fixed value, and a feedback resistors connecting between the input and the output of the electronic device, the amplifier having high sensitivity to a weak signal from a distant place and having limiting function for a large signal from short distance.
11. The apparatus for totaling and analyzing replies as in claim 10, wherein the amplifier comprises the amplification circuit connected in cascade.
12. The apparatus for totaling and analyzing replies as in claim 11, wherein the amplifier comprises an amplification stage in which the input bias voltage is set around the starting voltage and an amplification stage in which the input bias voltage is set around the finishing voltage are connected alternately, amplifying an input pulse in one direction.
13. (Amended) The apparatus for totaling and analyzing replies as in claim 11, wherein the amplifier comprises a diode at input stage amplifying an input pulse in one direction.
14. The apparatus for totaling and analyzing replies as in claim 11, wherein input terminal and the output terminal are connected by a diode at each of the first stage amplification circuit and the second stage amplification circuit, and the diode in one stage is directed the direction of the input to the output as forward, and the diode in the other stage is directed the direction of the output to the input as forward, and amplifies an input pulse in one direction.
15. The apparatus for totaling and analyzing replies as in claim 10, wherein the amplifier comprises the amplification circuit plurally and connected in parallel increasing amplification stability.
16. The apparatus for totaling and analyzing replies as in claim 1, wherein the center light emitting-receiving apparatus comprises a light receiving portion having a combination of a plurality of light receiving elements with different directional sensitivity, being able to receive both signals from replying units distributed at short distances in wide angle and very weak signals from replying units at long distances.
17. The apparatus for totaling and analyzing replies as in claim 1, wherein the replying unit comprises a light emitting portion a plurality of light emitting elements with angular distribution and a light distribution correcting plate correcting a distribution of lights from the plurality of light emitting elements, facilitating the sending of lights from the replying unit by emitting light through the light distribution correcting plate.
18. The apparatus for totaling and analyzing replies as in claim 1, wherein the center light emitting-receiving apparatus comprises a light emitting-receiving head carrying light emitting elements and light receiving elements on a concave surface.
19. The apparatus for totaling and analyzing replies as in claim 1, wherein the apparatus for totaling and analyzing replies comprises an infrared light reflecting substance, and the center apparatus and the replying unit communicate infrared light space transmitting communication through the reflecting substance.
20. The apparatus for totaling and analyzing replies as in claim 1, wherein apparatus for totaling and analyzing replies comprises a lighting substance showing an replier a target of light emitting.
21. A totaling and analyzing apparatus supervising system comprising:
a plurality of the totaling and analyzing apparatus having replying units emitting a replying signals replying to question by infrared lights and center apparatus detecting, totaling, and analyzing the replying signals, described in claim 1,
connecting the plurality of the totaling and analyzing apparatus by a communication system, and totaling and analyzing by combining results of the plurality of the totaling and analyzing apparatus.
22. (Amended) A method for counting and analyzing a plurality of replies to a question using a plurality of replying units carried by a plurality of repliers and a center apparatus, comprising:
a step of replying units being input an reply by an replier replying to a question presented by a questioner;
a step of the center apparatus being directed to order counting and analyzing;
a step of the center apparatus generating a command directing replies designating an replying period possessing a plurality of replying section in which a plurality of replying signal windows for each of identification codes of the replying units;
a step of the center apparatus sending the command signals directing replies by infrared light to the plurality of replying units;
a step of the plurality of replying units receiving infrared light from the center apparatus;
a step of the replying units outputting replying signals during replying period designated by identification code for each of the replying units;
a step of the replying units sending the replying signals by infrared light;
a step of the center apparatus receiving the infrared light replying signals from the replying units;
a step of the center apparatus signal processing and discriminating the replying signals for each replying period of the replying signals; and
a step of the center apparatus obtaining a totaling and analyzing result by totaling and analyzing replies from the signal processed replying signals.
23. An amplifier comprising an amplifying circuit, the amplifying circuit possessing:
an electronic device in which e a transition of the output voltage occurs when an input voltage exceeds a fixed value; and
a feedback resistor connecting between the input and the output of the electronic device, having high sensitivity to a weak signal from a distant place and having limiting function for a large signal from short distance.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A package comprising:
a chip comprising a substrate and a contact pad on the substrate;
a molding compound laterally encapsulating the chip;
a first dielectric layer overlying the molding compound and the chip and having a first opening exposing the contact pad;
a first metallization layer overlying the first dielectric layer, wherein the first metallization layer fills the first opening and laterally extends over the molding compound;
a second dielectric layer overlying the first metallization layer and the first dielectric layer and having a second opening over the first opening; and
a second metallization layer overlying the second dielectric layer and electrically coupled to the first metallization layer through the second opening and laterally extends over the molding compound.
2. The package of claim 1, wherein the second metallization layer is formed in the second opening and physically contacts the first metallization layer.
3. The package of claim 1, wherein the second metallization layer lines a sidewall and a bottom of the second opening.
4. The package of claim 1, wherein the first metallization layer comprises a first seed layer and a first conductive layer formed on the first seed layer.
5. The package of claim 4, wherein the first seed layer comprises titanium and the first conductive layer comprises copper.
6. The package of claim 1, wherein the second metallization layer comprises a second seed layer and a second conductive layer formed on the second seed layer.
7. The package of claim 6, wherein the second seed layer comprises titanium and the second conductive layer comprises copper.
8. The package of claim 1, further comprising a bump on the second metallization layer.
9. The package of claim 9, further comprising a protection layer overlying the second metallization layer and the second dielectric layer and around a portion of the bump.
10. The package of claim 1, wherein the chip comprises a passivation layer on the substrate and covering a portion of the contact pad, and the first dielectric layer is formed overlying the passivation layer.
11. A package comprising:
a chip comprising a substrate and a contact pad on the substrate;
a molding compound laterally encapsulating the chip;
a first dielectric layer overlying the molding compound and the chip and having a first opening exposing the contact pad;
a first seed layer overlying the first dielectric layer and lining a sidewall and a bottom of the first opening;
a first conductive layer overlying the first seed layer and filling the first opening;
a second dielectric layer overlying the first conductive layer and having a second opening directly over the first opening; and
a second seed layer overlying the second dielectric layer and lining a sidewall and a bottom of the second opening; and
a second conductive layer overlying the second seed layer.
12. The package of claim 11, wherein the second conductive layer is formed along the sidewall and the bottom of the second opening.
13. The package of claim 11, wherein the first seed layer comprises titanium and the first conductive layer comprises copper.
14. The package of claim 11, wherein the second seed layer comprises titanium and the second conductive layer comprises copper.
15. The package of claim 11, further comprising a bump on the second conductive layer.
16. The package of claim 15, further comprising a protection layer overlying the second conductive layer and the second dielectric layer and around a portion of the bump.
17. A method comprising:
providing a chip with a contact pad;
forming a molding compound laterally encapsulating the chip, the contact pad being exposed through the molding compound;
forming a first dielectric layer over the molding compound and the chip;
forming a first opening in the first dielectric layer, exposing the contact pad;
forming a first conductive layer overlying the first dielectric layer and filling the first opening, wherein the first conductive layer in the first opening has a flat surface;
forming a second dielectric layer over the first conductive layer and the first dielectric layer;
forming a second opening in the second dielectric layer exposing the first conductive layer over the first opening; and
forming a second conductive layer overlying the second dielectric layer and physically contacting the first conductive layer through the second opening.
18. The method of claim 17, wherein the first conductive layer is formed by a copper plating process with a plating rate greater than 1 \u03bcmmin.
19. The method of claim 17, wherein the first conductive layer formed in the first opening has a width (W) and a height (H), and the ratio of WH is less than 20.
20. The method of claim 17, wherein the first conductive layer formed in the first opening has a width (W) and a height (H), and the ratio of WH is greater than 2.