1. A plug for a hydraulic line having a leak, the plug comprising:
a main body for fluid driven advancement through an inner channel defined by the line to a resting location adjacent the leak; and
a substantially sealable biasing outer surface of said body for guided interfacing of said body relative an inner wall of the line during the advancement.
2. The plug of claim 1 wherein said outer surface comprises at least one circumferential fin about said body.
3. The plug of claim 1 wherein the line is one of a hydraulic control line and a chemical injection line for use in a well at an oilfield, the plug further comprising a tether coupled thereto, said tether running from a surface of the oilfield adjacent the well to reflect a depth of the resting location.
4. The plug of claim 3 wherein said body comprises at least one vent channel therethrough to promote withdrawal thereof from the line via said tether.
5. The plug of claim 1 further comprising a seal element about said body for hydraulically sealing the line with the plug at the resting location.
6. The plug of claim 5 wherein said seal element is a first seal element distanced above said biasing outer surface, the plug further comprising:
an exposable fluid bypass channel through said body; and
a second seal element about said body and below said biasing outer surface.
7. The plug of claim 5 wherein said seal element is an elongated seal element extending from said biasing outer surface to a distanced location so as to exceed vertical dimensions of the leak, the plug further comprising an exposable fluid bypass channel through said body.
8. The plug of claim 1 further comprising an anchor element extending from said body for stably securing the plug in the line at the resting location.
9. A method of managing a hydraulic control line with a leak therein, the method comprising:
inserting a self-seeking leak plug into the control line from an oilfield surface location adjacent a well accommodating the line; and
circulating the plug through the line to a resting location adjacent the leak.
10. The method of claim 9 wherein said monitoring comprises:
spooling a tether coupled to the plug from the surface location; and
establishing a location of the leak in the line by reading the tether at the surface location after ceasing of said spooling due to the plug reaching the resting location.
11. The method of claim 9 further comprising sealing the line at a location therein at least as high as the leak location.
12. The method of claim 11 wherein said sealing comprises one of expanding a seal element of the plug, cement plugging, and pumping a curable seal fluid to the leak location.
13. The method of claim 11 further comprising actuating a hydraulic well feature coupled to the line at a location above the leak.
14. The method of claim 9 wherein said circulating comprises:
pumping a fluid through the line from the surface location; and
guiding the plug in the line with a substantially sealable biasing outer surface of the plug for interfacing an inner surface of the line.
15. The method of claim 9 further comprising removing the plug from the line by withdrawing the tether therefrom.
16. The method of claim 15 further comprising exposing vent channels through the body during said removing to promote the withdrawing.
17. A method of repairing a leak in a hydraulic line, the method comprising:
inserting a self-seeking leak plug into the line;
circulating the plug through the line to a resting location adjacent the leak; and
sealing the line at a location above the leak.
18. The method of claim 17 wherein said sealing comprises expanding a first seal element of the plug, said method further comprising:
expanding a second seal element of the plug for sealing the line at a location below the leak for isolation thereof; and
exposing a bypass channel through a body of the plug to restore hydraulic flow to the line.
19. The method of claim 18 further comprising triggering said exposing by manipulating a tether coupled to the plug from a remote location relative thereto.
20. The method of claim 18 further comprising actuating a hydraulically controlled feature coupled to the line at one of a location above the leak and a location below the leak.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A wired circuit board, comprising:
an insulating layer; and
a conductive layer including a wire covered with the insulating layer and a terminal, which is continued to the wire, for being electrically connected to an electronic element,
wherein the insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction so as to form a plurality of indented lower walls and at least one upper wall joined to the lower walls by connecting walls, to thereby increase a contact area between the terminal and a connecting medium for connecting the electronic element to the terminal,
wherein the connecting medium comprises a conductive adhesive,
wherein the terminal is used by electrically connecting to a terminal of the electronic element via the conductive adhesive, and
wherein the terminal of the wired circuit board is completely physically separated from the terminal of the electronic element by the conductive adhesive interposed therebetween.
2. The wired circuit board according to claim 1, wherein
the insulating layer includes an insulating base layer formed at one side of the wire in the thickness direction, and
the insulating opening is formed so as to expose one-side surface of the terminal in the thickness direction in the insulating base layer.
3. The wired circuit board according to claim 2, further comprising:
a metal supporting board formed at one side of the insulating base layer in the thickness direction, and supported on a support plate to which the electronic element is attached,
wherein the metal supporting board is formed with a support opening exposing the one-side surface of the terminal in the thickness direction.
4. The wired circuit board according to claim 1, wherein the insulating layer includes an insulating cover layer formed at the other side of the wire in the thickness direction, and the insulating opening is formed so as to expose the other-side surface of the terminal in the insulating cover layer.
5. The wired circuit board according to claim 1, wherein the electronic element is a piezoelectric element.
6. The wired circuit board according to claim 1, wherein the pattern comprises a generally meandering shape in cross-section.
7. A method of producing a wired circuit board, comprising the steps of:
preparing a metal supporting board;
forming an insulating base layer at one side of the metal supporting board in a thickness direction thereof such that a terminal formation region including a pattern opening exposing the metal supporting board with a pattern shape and a pattern insulating portion defined by the pattern opening is formed therein;
forming a conductive layer such that the conductive layer includes a wire formed at side of the insulating base layer in the thickness direction and a terminal formed in the terminal formation region to be continued to the wire; and
forming a support opening and a base opening each corresponding to the terminal formation region respectively in the metal supporting board and the insulating layer to form the terminal into a pattern which is exposed from each of the support opening and the base opening and indented in the thickness direction so as to form a plurality of indented lower walls and at least one upper wall joined to the lower walls by connecting walls, to thereby increase a contact area between the terminal and a connecting medium for connecting an electronic element to the terminal,
wherein the connecting medium comprises a conductive adhesive,
wherein the terminal is used by electrically connecting to a terminal of the electronic element via the conductive adhesive, and
wherein the terminal of the wired circuit board is completely physically separated from the terminal of the electronic element by the conductive adhesive interposed therebetween.