1. A method for dicing a semiconductor wafer having:
a plurality of chip areas in which a number of semiconductor elements are formed;
a dicing area provided at the outside of each chip area;
a characteristic evaluating element formed in the dicing area; and
a metal wiring formed in the dicing area and electrically connected to the characteristic evaluating element;
this method including a step of relatively moving a blade along a longitudinal direction of the dicing area for cutting a portion of the dicing area out,
wherein a coordinate axis Y is defined by a dicing center line, a coordinate axis X is defined by a direction perpendicular to the dicing center line, D is defined by a thickness of a cutting edge of the blade and \xb1\u03c3 is defined by a relative positioning error between the dicing blade and the semiconductor wafer in the direction of X and, in case where the dicing area is demarcated into five areas that are an area A (\u2212D2+\u03c3<x<D2\u2212\u03c3), an area B1 (\u2212D2\u2212\u03c3<x<\u2212D2+\u03c3), an area B2 (D2\u2212\u03c3<x<D2+\u03c3), an area C1 (x<\u2212D2\u2212\u03c3) and an area C2 (D2+\u03c3<x) the metal wiring is exposed in any one of areas of A, Cl and C2 while the metal wiring is not exposed in the areas B1 and B2.
2. The method according to claim 1, wherein the metal wirings of plural layers is formed in the dicing area and the metal wiring of the uppermost layer is arranged in any one of areas A, C1 and C2 and the metal wiring of the inner layer is arranged so as to cross any one of the areas B1 and B2.
3. The method according to claim 1, wherein the metal wirings of plural layers is formed in the dicing area and the metal wiring for bridging is exposed at the cross-point in the overlapped area of both the area A relating to the dicing area in the X-direction and the area A relating to the dicing area in the Y-direction.
4. The method according to claim 1, wherein a passivation film is formed on the metal wiring exposed in the area C1 or C2.
5. The method according to claim 1, wherein the metal wiring includes plural layers, and one inner layer of the plural layers is arranged in any one of the areas of A, C1 and C2 while the one inner layer is not arranged in the areas B1 and B2.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for raising funding for a public company through the issuance of a derivative-related security, comprising:
placing the derivative-related security into at least a first public market;
an underwriter borrowing an amount of an issuer’s shares at least one of prior to, in conjunction with, shortly after and sometime after the placing of the derivative-related security;
at least one of offering and selling the borrowed shares in at least one public market to create a short position;
transferring the short position to a purchaser of the derivative-related security.
2. The method according to claim 1, wherein the transfer of the short position to a purchaser of the derivative-related security is accomplished by transferring the economics of the short position to the purchaser of the derivative-related security.
3. The method according to claim 2, wherein the economics of the short position are transferred to the purchaser of the derivative-related security by a synthetic swap.
4. The method according to claim 3, wherein the synthetic swap is a total return swap.
5. The method according to claim 2, wherein the economics of the short position are transferred to the purchaser of the derivative-related security by a physical short.
6. The method according to claim 1, wherein the transferring of the short position to the purchaser of the derivative-related security comprises:
the underwriter borrowing additional shares from the issuer equal to a percentage of the shares previously borrowed and sold to equity investors;
the underwriter lending the additional shares to a first hedge investor;
the underwriter purchasing the loaned additional shares from the first hedge investor to establish a short position for the first hedge investor.
7. The method according to claim 6, further comprising:
the underwriter lending the re-purchased additional shares to a second hedge investor;
the underwriter purchasing the loaned re-purchased additional shares from the second hedge investor to establish a short position for the second hedge investor.
8. The method according to claim 1, wherein the derivative-related security is a convertible bond.
9. The method according to claim 1, wherein the at least a first public market is a fixed income market.
10. The method according to claim 1, wherein the at least a second public market is an equities market.
11. The method according to claim 1, wherein the purchaser of the derivative-related security is a hedge investor.
12. A method for raising funding for a public company through the issuance of a derivative-related security, comprising:
placing the derivative-related security into at least one public market;
an issuer lending an amount of the issuer’s shares to an underwriter at least one of prior to, in conjunction with, shortly after and sometime after the placing of the derivative-related security;
the underwriter at least one of offering and selling the borrowed shares in at least one public market to create a short position;
transferring the short position to a purchaser of the derivative-related security.
13. The method according to claim 12, wherein the transfer of the short position to a purchaser of the derivative-related security is accomplished by transferring the economics of the short position to the purchaser of the derivative-related security.
14. The method according to claim 13, wherein the economics of the short position are transferred to the purchaser of the derivative-related security by a synthetic swap.
15. The method according to claim 14, wherein the synthetic swap is a total return swap.
16. The method according to claim 13, wherein the economics of the short position are transferred to the purchaser of the derivative-related security by a physical short.
17. The method according to claim 12, wherein the transferring of the short position to the purchaser of the derivative-related security comprises:
the issuer lending additional shares to the underwriter equal to a percentage of the shares previously lent and sold to equity investors;
the underwriter lending the additional shares to a first hedge investor;
the underwriter purchasing the loaned additional shares from the first hedge investor to establish a short position for the first hedge investor.
18. The method according to claim 17, further comprising:
the underwriter lending the re-purchased additional shares to a second hedge investor;
the underwriter purchasing the loaned re-purchased additional shares from the second hedge investor to establish a short position for the second hedge investor.
19. The method according to claim 12, wherein the derivative-related security is a convertible bond.
20. The method according to claim 12, wherein the at least a first public market is a fixed income market.
21. The method according to claim 12, wherein the at least a second public market is an equities market.
22. The method according to claim 12, wherein the purchaser of the derivative-related security is a hedge investor.
23. A structure for raising funding for a public company through the issuance of a derivative-related security, comprising:
entering into a first agreement with an underwriter to place a derivative-related security into at least one public market;
entering into a second agreement with the underwriter for the borrowing of an amount of an issuer’s shares at least one of prior to, in conjunction with, shortly after and sometime after the placing of the derivative-related security;
entering into a third agreement to sell the borrowed shares in at least one public market to create a short position;
entering into an agreement to transfer the short position to a purchaser of the derivative-related security.
24. A structure for raising funding for a public company through the issuance of a derivative-related security, comprising:
entering into a first agreement with an issuer to place a derivative-related security into at least one public market;
entering into a second agreement with the issuer for the lending of an amount of an issuer’s shares at least one of prior to, in conjunction with, shortly after and sometime after the placing of the derivative-related security;
entering into a third agreement with an investor to sell the loaned shares in at least one public market to create a short position;
entering into an agreement with a purchaser of the derivative-related security to transfer the short position to the purchaser of the derivative-related security.
25. A structure for raising funding for a public company through the issuance of a derivative-related security, comprising:
underwriting a derivative-related security offering;
establishing a borrow facility for issuer shares;
creating a short position for issuer shares;
entering into a short position exchange with a derivative-related security purchaser.
26. The structure according to claim 25, wherein the short position exchange is accomplished with a synthetic swap.
27. The structure according to claim 26, wherein the synthetic swap comprises a total return swap.
28. The structure according to claim 25, wherein the short position exchange is accomplished with a physical short.
29. The structure according to claim 28, wherein the physical short comprises:
entering into a loan agreement with the derivative-related security purchaser; and
purchasing loaned shares from the derivative-related security purchaser.