1. A wiring substrate, comprising:
a wiring substrate main body having a semiconductor element mounting area in which a semiconductor element is mounted;
a wiring pattern provided on a first surface of the wiring substrate main body at a portion corresponding to the semiconductor element mounting area, and having connection portions to which the semiconductor element is flip-chip bonded;
a solder resist provided on the first surface of the wiring substrate main body, and having an opening portion whose size is substantially equal to the semiconductor element mounting area, when viewed from a top; and
a dam provided on an upper surface of the solder resist so as to surround the semiconductor element mounting area, for blocking an underfill resin provided in a clearance between the semiconductor element and the wiring substrate main body,
wherein a distance between an inner wall of the opening portion of the solder resist and an inner wall of the dam is partially varied.
2. The wiring substrate according to claim 1, wherein
an underfill resin feeding area, from which the underfill resin is fed, is defined at a portion of a clearance between the semiconductor element and the wiring substrate main body,
a first distance is defined between the inner wall of the opening portion of the solder resist and the inner wall of the dam in the underfill resin feeding area,
a second distance is defined between the inner wall of the opening portion of the solder resist and the inner wall of the dam in are area other than the underfill resin feeding area,
the first distance is larger than the second distance.
3. The wiring substrate according to claim 2, wherein the second distance is decreased stepwisely or continuously.
4. The wiring substrate according to claim 1, further comprising:
a pad to which another wiring substrate is mounted and which is provided on the wiring substrate main body at a position outside the dam.
5. The wiring substrate according to claim 4, further comprising:
an external connection pad which is electrically connected to the wiring pattern and is provided on a second surface of the wiring substrate main body, wherein
the second surface is positioned on an opposite side to the first surface.
6. A semiconductor device, comprising: a wiring substrate, comprising:
a wiring substrate main body having a semiconductor element mounting area in which a semiconductor element is mounted;
a wiring pattern provided on a first surface of the wiring substrate main body at a portion corresponding to the semiconductor element mounting area, and having connection portions to which the semiconductor element is flip-chip bonded;
a solder resist provided on the first surface of the wiring substrate main body and having an opening portion whose size is substantially equal to the semiconductor element mounting area, when viewed from a top; and
a dam provided on an upper surface of the solder resist so as to surround the semiconductor element mounting area, for blocking an underfill resin provided in a clearance between the semiconductor element and the wiring substrate main body,
wherein a distance between an inner wall of the opening portion of the solder resist and an inner wall of the dam is partially varied;
the semiconductor element flip-chip bonded to the connection portions; and
the underfill resin provided in a clearance between the semiconductor element and the wiring substrate.
7. The wiring substrate according to claim 6, wherein
an underfill resin feeding area, from which the underfill resin is fed, is defined at a portion of a clearance between the semiconductor element and the wiring substrate main body,
a first distance is defined between the inner wall of the opening portion of the solder resist and the inner wall of the dam in the underfill resin feeding area,
a second distance is defined between the inner wall of the opening portion of the solder resist and the inner wall of the dam in are area other than the underfill resin feeding area,
the first distance is larger than the second distance.
8. The wiring substrate according to claim 7, wherein the second distance is decreased stepwisely or continuously.
9. The wiring substrate according to claim 6, further comprising:
a pad to which another wiring substrate is mounted and which is provided on the wiring substrate main body at a position outside the dam.
10. The wiring substrate according to claim 9, further comprising:
an external connection pad which is electrically connected to the wiring pattern and is provided on a second surface of the wiring substrate main body, wherein
the second surface is positioned on an opposite side to the first surface.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A golf club head comprising:
a head body having a front opening;
a striking plate member covering said front opening, and having a front striking face with a striking zone, and a ring projecting rearwardly from a rear side of said striking plate member and defining an indentation; and
a vibration-absorbing plate member fixed in said indentation.
2. The golf club head of claim 1, further comprising a fastening unit to fix said vibration-absorbing plate member in said indentation.
3. The golf club head of claim 2, wherein said fastening unit includes a plurality of angularly spaced-apart studs projecting rearwardly from said rear side, and a plurality of fasteners, said vibration-absorbing plate member having a plurality of spaced-apart through holes to receive respectively said studs, said fasteners being fixed respectively to said studs after said studs extend through said through holes, respectively.
4. The golf club head of claim 3, wherein each of said studs has an internal screw hole to engage a respective one of said fasteners.
5. The golf club head of claim 3, wherein each of said studs has an external thread extending through a respective one of said through holes in said vibration-absorbing plate member to engage a respective one of said fasteners.
6. The golf club head of claim 2, wherein said striking plate member further has a cover plate secured to said ring and covering said vibration-absorbing plate member.
7. The golf club head of claim 6, wherein said ring is formed with a plurality of angularly spaced-apart radial through holes, said fastening unit including a plurality of fasteners each extending into said cover plate and said vibration-absorbing plate member through one of said radial through holes.
8. The golf club head of claim 6, wherein said fastening unit includes an external thread formed on an outer peripheral face of said ring, and an internal thread formed on said cover plate to engage said external thread of said ring.
9. The golf club head of claim 1, wherein said striking plate member is made of a titanium alloy, and said vibration-absorbing plate member is made of a carbon fiber plastic material.