1. A stack package comprising:
a substrate;
a lower semiconductor chip stacked on the substrate and electrically connected to the substrate through a lower via;
a plurality of upper semiconductor chips stacked on the lower semiconductor chip and electrically connected to the lower via through an upper via, wherein the upper semiconductor chips are larger in size than the lower semiconductor chip; and
an edge guide electrically connecting edge vias of the upper semiconductor chips and the substrate.
2. The stack package of claim 1, further comprising a connection pad formed between the adjacent edge vias of the upper semiconductor chips, and electrically connecting the edge vias of the upper semiconductor chips and the edge guide.
3. The stack package of claim 2, wherein the edge guide and the connection pad are integrally formed.
4. The stack package of claim 1, wherein the edge guide comprises:
a horizontal portion formed between the adjacent upper semiconductor chips; and
a vertical portion connecting the horizontal portion to the substrate.
5. The stack package of claim 4, wherein the horizontal portion of the edge guide comprises an interconnection material which connects the edge vias of the upper semiconductor chips.
6. The stack package of claim 1, wherein the edge guide couples the substrate and the bottom of the edge via of the lowermost upper semiconductor chip among the upper semiconductor chips.
7. The stack package of claim 1, wherein the edge guide comprises one or more material selected from the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), nickel (Ni), tungsten (W), titanium (Ti), platinum (Pt), palladium (Pd), tin (Sn), lead (Pb), zinc (Zn), indium (In), cadmium (Cd), chrome (Cr), molybdenum (Mo), and an alloy thereof.
8. The stack package of claim 1, wherein the edge guide simultaneously couples two or more different positions of the edge vias of the upper semiconductor chips.
9. The stack package of claim 1, wherein the edge guide is electrically connected to the edge via through a solder.
10. A method for manufacturing a stack package, the method comprising:
stacking a lower semiconductor chip on a substrate, wherein the lower semiconductor chip is electrically connected to the substrate through a lower via;
stacking upper semiconductor chips on the lower semiconductor chip, wherein the upper semiconductor chips are larger in size than the lower semiconductor chip and are electrically connected to the lower via through an upper via; and
forming an edge guide which electrically connects edge vias of the upper semiconductor chips and the substrate.
11. The method of claim 10, further comprising, forming a connection pad between the adjacent edge vias of the upper semiconductor chips and electrically connect the edge vias of the upper semiconductor chips and the edge guide.
12. The method of claim 11, wherein the edge guide and the connection pad are integrally formed.
13. The method of claim 10, wherein the edge guide comprises:
a horizontal portion formed between the adjacent upper semiconductor chips; and
a vertical portion connecting the horizontal portion to the substrate.
14. The method of claim 10, wherein the edge guide couples the substrate and the bottom of the edge via of the lowermost upper semiconductor chip among the upper semiconductor chips.
15. The method of claim 10, wherein the edge guide simultaneously couples two or more different positions of the edge vias of the upper semiconductor chips.
16. The method of claim 10, further comprising filling a gap between the lower semiconductor chip and the substrate after the lower semiconductor chip is stacked on the substrate.
17. The method of claim 10, wherein the edge guide comprises one or more material selected from the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), nickel (Ni), tungsten (W), titanium (Ti), platinum (Pt), palladium (Pd), tin (Sn), lead (Pb), zinc (Zn), indium (In), cadmium (Cd), chrome (Cr), molybdenum (Mo), and an alloy thereof.
18. The method of claim 10, wherein the edge guide is electrically connect to the edge via through a solder.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for facilitating n-way high availability storage services, the method comprising:
monitoring with a passive storage controller a plurality of active storage controllers;
determining with the passive storage controller when a failure of one of the active storage controllers has occurred based on the monitoring; and
remapping one or more storage devices previously assigned to the one of the active storage controllers to the passive storage controller, retrieving one of a plurality of transaction logs corresponding to the one of the active storage controllers from a transaction log database, and replaying one or more transactions in the one transaction log with the passive storage controller when the failure of the one of the active storage controllers is determined to have occurred.
2. The method of claim 1, wherein the transaction log database stores the transaction logs and each of the transaction logs is maintained by, and stores transactions for, a different one of the active storage controllers.
3. The method of claim 1, wherein the monitoring further comprises receiving a heartbeat periodically from each of the active storage controllers and a failure of the one of the active storage controllers is determined to have occurred when a heartbeat is not received from the one of the active storage controllers for a specified period of time.
4. The method of claim 3, wherein the heartbeat comprises an identifier of the one of the active storage controllers and the method further comprises retrieving with the passive storage controller the transaction log from the transaction log database based on the identifier.
5. The method of claim 1, wherein the remapping further comprises remapping a network interface previously assigned to the one of the active storage controllers to be assigned to the passive storage controller.
6. The method of claim 1, wherein the transaction log database is separate from the active storage controllers and the passive storage controller, and is accessible over at least one communication network by the active storage controllers and the passive storage controller.
7. An apparatus, comprising a processor and a memory coupled to the processor which is configured to be capable of executing programmed instructions comprising and stored in the memory to:
monitor with a passive storage controller a plurality of active storage controllers;
determine with the passive storage controller when a failure of one of the active storage controllers has occurred based on the monitoring; and
remap one or more storage devices previously assigned to the one of the active storage controllers to the passive storage controller, retrieve one of a plurality of transaction logs corresponding to the one of the active storage controllers from a transaction log database, and replaying one or more transactions in the one transaction log with the passive storage controller when the failure of the one of the active storage controllers is determined to have occurred.
8. The apparatus of claim 7, wherein the transaction log database stores the transaction logs and each of the transaction logs is maintained by, and stores transactions for, a different one of the active storage controllers.
9. The apparatus of claim 7, wherein the processor coupled to the memory is further configured to be capable of executing at least one additional programmed instruction comprising and stored in the memory to receive with the passive storage controller a heartbeat periodically from each of the active storage controllers and a failure of the one of the active storage controllers is determined to have occurred when a heartbeat is not received from the one of the active storage controllers for a specified period of time.
10. The apparatus of claim 9, wherein the heartbeat comprises an identifier of the one of the active storage controllers and the processor coupled to the memory is further configured to be capable of executing at least one additional programmed instruction comprising and stored in the memory to retrieve with the passive storage controller the transaction log from the transaction log database based on the identifier.
11. The apparatus of claim 7, wherein the processor coupled to the memory is further configured to be capable of executing at least one additional programmed instruction comprising and stored in the memory to remap a network interface previously assigned to the one of the active storage controllers to be assigned to the passive storage controller.
12. The apparatus of claim 7, wherein the transaction log database is separate from the active storage controllers and the passive storage controller, and is accessible over at least one communication network by the active storage controllers and the passive storage controller.
13. A non-transitory computer readable medium having stored thereon instructions for facilitating n-way high availability storage services comprising executable code which when executed by a processor, causes the processor to perform steps comprising:
monitoring with a passive storage controller a plurality of active storage controllers;
determining with the passive storage controller when a failure of one of the active storage controllers has occurred based on the monitoring; and
remapping one or more storage devices previously assigned to the one of the active storage controllers to the passive storage controller, retrieving one of a plurality of transaction logs corresponding to the one of the active storage controllers from a transaction log database, and replaying one or more transactions in the one transaction log with the passive storage controller when the failure of the one of the active storage controllers is determined to have occurred.
14. The non-transitory computer readable medium of claim 13, wherein the transaction log database stores the transaction logs and each of the transaction logs is maintained by, and stores transactions for, a different one of the active storage controllers.
15. The non-transitory computer readable medium of claim 13, wherein the monitoring further comprises receiving a heartbeat periodically from each of the active storage controllers and a failure of the one of the active storage controllers is determined to have occurred when a heartbeat is not received from the one of the active storage controllers for a specified period of time.
16. The non-transitory computer readable medium of claim 15, wherein the heartbeat comprises an identifier of the one of the active storage controllers and the executable code when executed by the processor further causes the processor to perform at least one additional step comprising retrieving with the passive storage controller the transaction log from the transaction log database based on the identifier.
17. The non-transitory computer readable medium of claim 13, wherein the executable code when executed by the processor further causes the processor to perform at least one additional step comprising remapping a network interface previously assigned to the one of the active storage controllers to be assigned to the passive storage controller.
18. The non-transitory computer readable medium of claim 13, wherein the transaction log database is separate from the active storage controllers and the passive storage controller, and is accessible over at least one communication network by the active storage controllers and the passive storage controller.