1. A system comprising:
a supporting substrate; and
at least one semiconductor substrate on the supporting substrate comprising a plurality of integrated circuits, a plurality of substrate contacts in electrical communication with the integrated circuits, and a plurality of through interconnects and redistribution conductors;
each through interconnect comprising a via aligned with a substrate contact and a conductive layer at least partially lining the via in physical and electrical contact with the substrate contact,
each conductor comprising a portion of the conductive layer.
2. The system of claim 1 wherein the conductors include terminal contact pads in an area array, and further comprising a plurality of terminal contacts on the terminal contact pads.
3. The system of claim 1 wherein the semiconductor substrate comprises an imager die.
4. The system of claim 1 wherein the semiconductor substrate comprises a high speed digital logic device selected from the group consisting of a dynamic random access memory (DRAM), a static random access memory (SRAM), a flash memory, a microprocessor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a MEMS type device, and a solar cell.
5. The system of claim 1 wherein the integrated circuits include radiation sensitive integrated circuits, and further comprising a transparent cover attached to the semiconductor substrate configured to protect the radiation sensitive integrated circuits.
6. The system of claim 1 wherein the supporting substrate comprises a module substrate, a circuit board or a computer mother board.
7. A system comprising:
a supporting substrate; and
a component on the supporting substrate comprising a plurality of substrate contacts, a plurality of through interconnects in electrical contact with the substrate contacts, a plurality of back side conductors in electrical communication with the through interconnects, and a plurality of terminal contacts in electrical communication with the conductors flip chip mounted to the supporting substrate;
the through interconnects and the conductors comprising a same conductive layer.
8. The system of claim 7 wherein the terminal contacts comprise the same conductive layer.
9. The system of claim 7 wherein each through interconnect comprises a via, and a metal layer in the via in electrical contact with a substrate contact, and the conductors comprise portions of the metal layer.
10. The system of claim 7 wherein the supporting substrate comprises a module substrate, a circuit board or a computer mother board.
11. The system of claim 7 wherein the component comprises a semiconductor die comprising a plurality of integrated circuits in electrical communication with the substrate contacts, and the conductive layer at least partially lines the substrate contacts.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A tiltable three-wheeled vehicle having left and right front wheels and a rear wheel, said vehicle comprising:
a center frame extending in a lengthwise direction of the vehicle;
a rotary member supported on said center frame and rotatable with respect thereto about an axis of said center frame,
a floor plate attached to said rotary member,
a cross shaft attached to said rotary member such that said cross shaft is substantially perpendicular to said center frame, wherein opposing left and right ends of said cross shaft support the left and right front wheels to maintain a zero camber;
a power unit attached to said center frame for supporting the rear wheel on a rear portion of said center frame; and
a manipulating member attached to a front portion of said center frame,
wherein said center frame, said power unit and the rear wheel are tiltable with respect to said cross shaft, said rotary member, said floor plate and the left and right front wheels.
2. The tiltable three-wheeled vehicle according to claim 1 further comprising tie rods, wherein said tie rods extend in the left-and-right direction from a front portion of said center frame or a lower portion of said manipulating member, and said tie rods are attached to the left and right front wheels, whereby the left and right front wheels are configured to be steered when said manipulating member is inclined to the left or to the right.