What is claimed is:
1. A hybrid electrochemical cell system comprising:
a cathode;
an electrolyte;
a first anode portion in ionic communication with the cathode via the electrolyte; and
a second anode portion in ionic communication with the cathode via the electrolyte, wherein the first anode portion, the electrolyte, and the cathode form a power generating electrochemical cell, and further wherein the second anode portion, the electrolyte, and the cathode form an auxiliary electrochemical cell.
2. The electrochemical cell system as in claim 1, wherein the auxiliary electrochemical cell comprises a gas separator.
3. The electrochemical cell system as in claim 1, wherein the auxiliary device comprises a gas sensor.
4. The electrochemical cell system as in claim 1, wherein the power generating electrochemical cell comprises a metal air battery.
5. The electrochemical cell as in claim 4, wherein the cathode comprises an air diffusion electrode.
6. The electrochemical cell system as in claim 4, wherein the auxiliary electrochemical cell comprises a gas separator.
7. The electrochemical cell system as in claim 4, wherein the electrolyte comprises a solid state ionic conducting material.
8. The electrochemical cell system as in claim 7, wherein the solid state ionic conducting material comprises a hydroxide conducting membrane.
9. The electrochemical cell system as in claim 8, wherein the auxiliary electrochemical cell comprises an oxygen separator.
10. The electrochemical cell system as in claim 1, further comprising a charging electrode in ionic communication with the first anode portion.
11. The electrochemical cell system as in claim 10, wherein the ionic communication between the charging electrode and the first anode portion is through the electrolyte.
12. The electrochemical cell system as in claim 1, wherein the first anode portion is refuel able.
13. The electrochemical cell system as in claim 12, wherein the first anode portion comprises an anode fuel tape.
14. The electrochemical cell system as in claim 1, wherein the first anode portion comprises an oxidizing electrode, further wherein a fuel source is provided to distribute oxidizable fuel to the oxidizing electrode.
15. The electrochemical cell system as in claim 1, wherein the second anode portion comprises and a oxygen evolving material.
16. A hybrid electrochemical cell system comprising:
a first cathode portion and a second cathode portion; an electrolyte;
a first anode portion in ionic communication with the first cathode portion via the electrolyte;
and a second anode portion in ionic communication with the second cathode portion cathode via the electrolyte, wherein the first anode portion, the electrolyte, and the first cathode portion form a power generating electrochemical cell, and further wherein the second anode portion, the electrolyte, and the second cathode portion form an auxiliary electrochemical cell.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of making a compliant interconnect assembly, the method comprising the steps of:
positioning a plurality of first electrical traces against the first major surface of a first dielectric layer, the first electrical traces comprising a plurality of conductive compliant members comprising a plurality of first distal ends, a plurality of the first distal ends aligned with a plurality of openings in the first dielectric layer;
positioning a first major surface of a second dielectric layer against a portion of at least one of the first electric traces or the first major surface of the first dielectric layer, the second dielectric layer having a plurality of openings;
compressively and releasably engaging the first distal ends of the conductive compliant members with contact pads on a first circuit member such that the first distal ends are in direct physical and electrical contact with the contact pads;
positioning a plurality of second conductive interfaces separate from the first distal ends of the first electrical traces in the plurality of openings in the second dielectric layer to electrically couple with a plurality of the first electric traces; and
electrically coupling the second conductive interfaces to a second circuit member.
2. The method of claim 1 comprising positioning at least a portion of the first distal ends above a second major surface of the first dielectric layer.
3. The method of claim 1 wherein the first distal ends comprise spring members.
4. The method of claim 1 wherein the first electrical traces comprise a flexible circuit member.
5. The method of claim 1 wherein the second conductive interfaces are selected from one of a solder ball, solder paste, a conductive plug, a conductive rivet, conductive adhesive, a heat stake, spot weld, and ultrasonic weld, a compression joint, or electrical plating.
6. The method of claim 1 wherein positioning the second conductive interface comprises aligning second distal ends of the conductive compliant members with the plurality of openings in the second dielectric layer.
7. The method of claim 1 wherein the plurality of second conductive interfaces comprise a plurality of second electrical traces.
8. The method of claim 7 comprising electrically coupling the first electrical traces to the second electrical traces.
9. The method of claim 7 comprising positioning the first and second electrical traces against the first major surface of the first dielectric layer.
10. The method of claim 7 comprising positioning the first and second electrical traces between the first and second dielectric layers.
11. The method of claim 1 comprising the steps of:
aligning a plurality of second distal ends on a plurality of second electrical traces with a plurality of openings in the second dielectric layer; and
electrically coupling one or more of the second conductive compliant members on the first electrical traces with one or more of the second electrical traces.
12. The method of claim 11 comprising locating a dielectric layer located between the first and second sets of electrical traces.
13. The method of claim 1 wherein the plurality of second conductive interfaces comprise a plurality of conductive compliant members.
14. The method of claim 1 comprising positioning one or more discrete electrical components in the openings in the second dielectric layer.
15. The method of claim 1 comprising locating at least one additional circuitry plane in the compliant interconnect assembly.
16. The method of claim 15 comprising selecting the at least one additional circuitry plane from one of a ground plane, a power plane, an electrical connection to other circuit members, a dielectric layer, a printed circuit board, a flexible circuit, a bare die device, an integrated circuit device, organic or inorganic substrates, or a rigid circuit.
17. The method of claim 1 comprising extending a portion of the first electrical traces beyond the compliant interconnect assembly to electrically coupling with another circuit member.
18. The method of claim 1 wherein the second conductive interfaces comprise second conductive complaint members aligned with a plurality of openings in the second dielectric layer, the method comprising singulating the first electrical traces so that a portion of the second conductive compliant members are electrically isolated from the first electrical traces.
19. The method of claim 1 wherein the second circuit member comprises a printed circuit board, the method comprising electrically coupling a plurality of the second conductive compliant members to contact pads on the printed circuit board through the openings in the second dielectric layer.
20. The method of claim 1 comprising arranging a plurality of the compliant interconnect assemblies in a stacked configuration electrically coupled to a plurality of circuit members.
21. The method of claim 1 comprising selecting the first and second circuit members from one of a dielectric layer, a printed circuit board, a flexible circuit, a bare die device, an integrated circuit device, organic or inorganic substrates, or a rigid circuit.
22. The method of claim 1 comprising selecting the conductive compliant members from one or more of spring members or rigid members.