1. A method of making a touch fastener product, the method comprising
distributing a multiplicity of discrete fastening bits over a support surface, each bit having opposite side surfaces forming boundaries of surfaces defining projections extending in different directions from the fastening bits, at least one of the opposite side surfaces being non-planar, and each projection having an overhanging head; and
fixing the distributed bits to the support surface, with each bit oriented with at least one of its projection heads raised from the support surface to releasably engage fibers.
2. The method of claim 1, wherein distributing the bits causes them to orient with at least one projection head raised from the support surface.
3. The method of claim 1, wherein distributing the bits comprises distributing a liquid onto the support surface, the liquid containing the bits in suspension.
4. The method of claim 1, wherein distributing the bits comprises distributing the bits in a foam carrier that collapses on the support surface.
5. The method of claim 1, wherein the support surface comprises both adhesive regions and non-adhesive regions, and wherein distributing the bits comprises:
distributing the bits over both the adhesive and non-adhesive regions; and then
removing distributed bits from the non-adhesive regions.
6. The method of claim 1, wherein fixing the distributed bits comprises heating the bits to cause a portion of each bit to melt and bond to the support surface.
7. The method of claim 1, wherein the bits are porous and fixing the distributed bits involves adhesive being drawn from the surface into pores of the bits.
8. The method of claim 1, wherein both of the opposite sides are non-planar.
9. A method of making a fastening bit, the method comprising
cutting completely through a longitudinal rail defining a longitudinal axis and having multiple ribs defining undercuts and extending in different directions, the cutting occurring at discrete intervals along the longitudinal axis of the rail to form discrete and separate fastening bits, the cutting forming opposite side surfaces of each bit, at least one of which opposite side surfaces is non-planar, such that each bit includes fastening projections formed of severed rib segments; and
collecting the fastening bits.
10. The method of claim 9, wherein cutting through the rail comprises moving a cutter along a substantially linear path through the rail.
11. The method of claim 9, wherein the cutter is mounted at an outer edge of a wheel and moves along a circular path that has a radius at least 40 times a distance that the cutter cuts through the rail.
12. The method of claim 9, wherein cutting through the rail causes material being severed from the rail to curl away from the cutter to form a non-planar one of the opposite side surfaces of one of the fastening bits.
13. The method of claim 9, wherein each cut through the rail forms a similar cut shape, such that both of the opposing side surfaces are non-planar and of complementary topography.
14. A fastening bit in the form of a solid body defined between two opposite side surfaces forming opposite boundaries of surfaces defining projections extending in different directions, each projection having an overhanging head defining a crook for engaging fibers and at least one of the opposite side surfaces being non-planar.
15. The bit of claim 14, wherein the projection-defining surfaces are all parallel to a common axis.
16. The bit of claim 14, wherein the bit has an overall thickness, measured between the non-planar side surfaces, that is less than a maximum overall linear dimension of the bit.
17. A touch fastener product comprising
a support surface; and
a multiplicity of the fastening bits bit of claim 14 dispersed across and fixed to the support surface in various orientations;
wherein each fixed bit is oriented with at least one of the projections extending away from the support surface for releasable engagement of fibers.
18. (canceled)
19. A container of bits, the container comprising:
a housing defining an interior volume; and
a bulk quantity of the fastening bits of claim 14 contained within the volume.
20. The container of claim 19, wherein the bits are loosely disposed within the volume.
21. A method of installing a floor covering, the method comprising
distributing a multiplicity of the fastening bits of claim 14 over a floor;
fixing the distributed bits to the floor with adhesive, with each bit oriented with at least one of its projection heads raised from the floor to releasably engage fibers; and
placing a floor covering over the floor, the floor covering having exposed fibers on a surface of the floor covering facing the floor, such that the fixed bits engage and retain the exposed fibers of the floor covering to releasably secure the floor covering to the floor.
22. The method of claim 1, wherein as fixed to the support surface, each bit is oriented with at least one projection head extending away from the support surface.
23. The method of claim 8, wherein the opposite sides are of complementary topography.
24. The method of claim 10, wherein the cutter comprises a solid cutting edge that forms an acute cutting angle.
25. The hit of claim 14, wherein both of the opposite side surfaces are non-planar.
26. The bit of claim 14, wherein both of the opposite side surfaces are of complementary topography.
27. The bit of claim 14, wherein the projections extend in more than two different directions.
28. The bit of claim 14, wherein all linear dimensions of the bit are less than about 1.2 millimeters.
29. The container of claim 19, wherein the bits are suspended in a flowable carrier.
30. The container of claim 19, wherein the bits are of an average bit size of less than three millimeters across.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A semiconductor device comprising:
a semiconductor substrate with an active region;
an oxide film to cover the active region of the semiconductor substrate;
a first borophosphosilicate glass film to cover the oxide film; and
a second borophosphosilicate glass film to cover the first insulating film;
wherein the first borophosphosilicate glass film has a concentration of a boron which is lower than that of the second borophosphosilicate glass film.
2. A semiconductor device as claimed in claim 1, wherein a concentration of a boron oxide in the first borophosphosilicate is 10-12 weight %, and a concentration of a boron oxide in the second borophosphosilicate glass film is 12-18 weight %.
3. A semiconductor device as claimed in claim 1, wherein the first borophosphosilicate glass film is a phosphosilicate glass film.
4. A semiconductor device as claimed in claim 1, wherein the first borophosphosilicate glass film is a silicate glass film.
5. A method for forming a semiconductor device comprising:
providing a semiconductor substrate with an active region;
covering the active region of the semiconductor substrate with an oxide film;
covering the oxide film with a first borophosphosilicate glass film having an inhibitory of an outdiffusion of the phosphorus;
covering the first borophosphosilicate glass film with a second borophosphosilicate glass film including a phosphorus and a boron; and
reflowing the second borophosphosilicate glass film so as to have a fluidity with a thermal treatment.
6. A method for forming a semiconductor device as claimed in claim 5, wherein a concentration of a boron oxide in the first borophosphosilicate is 10-12 weight % and a concentration of a boron oxide in the second borophosphosilicate glass film is 12-18 weight %.
7. A method for forming a semiconductor device as claimed in claim 5, wherein the first borophosphosilicate glass film is a phosphosilicate glass film.
8. A method for forming a semiconductor device as claimed in claim 5, wherein the first borophosphosilicate glass film is a silicate glass film.