1. A stacked electronic component, comprising:
a substrate having electrode portions;
a first electronic component adhered on said substrate, the first electronic component having first electrode pads connected to the electrode portions via first bonding wires; and
a second electronic component adhered on said first electronic component by using an adhesive layer having a two-layer structure including a first layer disposed at and substantially covering a first electronic component side and a second layer disposed at and substantially covering a second electronic component side, the second electronic component having second electrode pads connected to the electrode portions via second bonding wires,
wherein the first and second layers are made of a same material of thermosetting insulating resin, and the second layer has a modulus of elasticity larger than that of the first layer,
wherein at least part of the first bonding wires are taken into a cured resin layer of the first layer, and a cured resin layer of the second layer is disposed between the first bonding wires and the second electronic component so as to prevent contact of the first bonding wires and the second electronic component, wherein:
the first layer softens or melts at an adhesive temperature of said second electronic component, and has a viscosity within a range of about 1 kPa\xb7s to 100 kpa\xb7s at the adhesive temperature; and
the second layer maintains a layered shape at the adhesive temperature of said second electronic component, and has a viscosity within a range of about 130 kPa\xb7s or more at the adhesive temperature.
2. A stacked electronic component according to claim 1,
wherein said second electronic component has a portion protruding outside from an outer periphery of said first electronic component, and the first layer in the adhesive layer of the two-layer structure is filled between the protruding portion of said second electronic component and said substrate, by softened or melted at the adhesive temperature of said second electronic component.
3. The stacked electronic component according to claim 1,
wherein the first and second layers have room temperature moduli of elasticity in a range of 500 MPa or more and 1200 MPa or less.
4. The stacked electronic component according to claim 1,
wherein the adhesive layer of the two-layer structure has a modulus of elasticity at 175\xb0 C. of 40 MPa or more after cure, and a modulus of elasticity at 260\xb0 C. of 1 MPa or more after cure.
5. The stacked electronic component according to claim 1,
wherein said second electronic component has a same shape with said first electronic component or a larger shape than said first electronic component.
6. The stacked electronic component according to claim 1,
wherein said first and second electronic components are constituted by at least one selected from a semiconductor element and a package component including a semiconductor element.
7. A stacked electronic component according to claim 1,
wherein a stud bump provided on a non-connection pad of said first electronic component is disposed between said first electronic component and said second electronic component.
8. The stacked electronic component according to claim 1, wherein the first and second layers are formed by an epoxy resin.
9. A stacked electronic component, comprising:
a substrate having electrode portions;
a first electronic component adhered on said substrate, the first electronic component having first electrode pads connected to the electrode portions via first bonding wires; and
a second electronic component adhered on said first electronic component by using an adhesive layer disposed at and substantially covering a first electronic component side and a second layer disposed at and substantially covering a second electronic component side, the second electronic component having second electrode pads connected to the electrode portions via second bonding wires,
wherein the first and second layers are made of a same material of thermosetting insulating resin, and the second layer has a modulus of elasticity larger than that of the first layer,
wherein at least part of the first bonding wires are taken into a cured resin layer of the first layer, and a cured resin layer of the second layer is disposed between the first bonding wires and the second electronic component so as to prevent contact of the first bonding wires and the second electronic component,
wherein the first and second layers have a room temperature modulus of elasticity in a range of 500 MPa or more and 1200 MPa or less.
10. The stacked electronic component according to claim 9
wherein said second electronic component has a same shape as said first electronic component or a larger shape than said first electronic component.
11. The stacked electronic component according to claim 9,
wherein said first and second electronic components comprise at least one selected from a semiconductor element and a package component including a semiconductor element.
12. The stacked electronic component according to claim 9,
wherein the first and second layers are formed by an epoxy resin.
13. A stacked electronic component, comprising:
a substrate having electrode portions;
a first electronic component adhered on said substrate, the first electronic component having first electrode pads connected to the electrode portions via first bonding wires; and
a second electronic component adhered on said first electronic component by using an adhesive layer having a two-layer structure including a first layer disposed at and substantially covering a first electronic component side and a second layer disposed at and substantially covering a second electronic component side, the second electronic component having second electrode pads connected to the electrode portions via second bonding wires,
wherein the first and second layers are made of a same material of thermosetting insulating resin , and the second layer has a modulus of elasticity larger than that of the first layer,
wherein at least part of the first bonding wires are taken into a cured resin layer of the first layer, and a cured resin layer of the second layer is disposed between the first bonding wires and the second electronic component so as to prevent contact of the first bonding wires and the second electronic component,
wherein the adhesive layer of the two-layer structure has a modulus of elasticity at 175\xb0 C. of about 40 MPa or more after cure, and a modulus of elasticity at 260\xb0 C. of about 1 MPa or more after cure.
14. The stacked electronic component according to claim 13,
wherein said second electronic component has a same shape with said first electronic component or a larger shape than sad first electronic component.
15. The stacked electronic component according to claim 13,
wherein said first and second electronic components are constituted by at least one selected from a semiconductor element and a package component including a semiconductor element.
16. The stacked electronic component according to claim 13,
wherein the first and second layers are formed by an epoxy resin.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method for selecting an auction methodology for a buyersupplier procurement process, said method comprising:
determining an auction scope in a data processing system;
determining an auction interaction in said data processing system;
determining an auction control in said data processing system;
determining an auction pricing in said data processing system;
determining a set of auction closing rules in said data processing system;
determining an auction iteration in said data processing system; and
selecting an auction methodology based on at least one of said auction scope, said auction interaction, said auction control, said auction pricing, said auction closing rules, and said auction iteration.
2. The method of claim 1, wherein said step of determining an auction scope comprises determining whether a request for a bid from a supplier is one of a public request and a directed request.
3. The method of claim 1, wherein said step of determining an auction interaction comprises selecting one of an open-cry auction methodology, a sealed-bid auction methodology, an anonymous auction methodology, and a non-anonymous auction methodology.
4. The method of claim 1, wherein said step of determining an auction control comprises selecting one of a regular reverse auction methodology and a Dutch reverse auction methodology.
5. The method of claim 1, wherein said step of determining an auction pricing comprises selecting one of a discriminative auction methodology and a non-discriminative auction methodology.
6. The method of claim 1, wherein said step of determining a set of auction closing rules comprises ending an auction with one or more of a buyer’s manual intervention, a fixed time intervention, and an automatic intervention, wherein said automatic intervention occurs after a predetermined amount of supplier inactivity in said auction.
7. The method of claim 1, wherein said step of determining an auction iteration comprises selecting one of a single round iteration methodology and a multiple round iteration methodology.
8. A method for selecting an auction methodology for a buyersupplier procurement process, said method comprising:
determining one or more of an auction scope, an auction interaction, an auction control, an auction pricing, a set of auction closing rules, and an auction iteration in a data processing system; and
selecting an auction methodology based on said auction scope, said auction interaction, said auction control, said auction pricing, said auction closing rules, and said auction iteration.
9. The method of claim 8, wherein said auction scope comprises determining whether a request for a bid from a supplier is one of a public request and a directed request.
10. The method of claim 8, wherein said auction interaction comprises selecting one of an open-cry auction methodology, a sealed-bid auction methodology, an anonymous auction methodology, and a non-anonymous auction methodology.
11. The method of claim 8, wherein said auction control comprises selecting one of a regular reverse auction methodology and a Dutch reverse auction methodology.
12. The method of claim 8, wherein said auction pricing comprises selecting one of a discriminative auction methodology and a non-discriminative auction methodology.
13. The method of claim 8, wherein said set of auction closing rules comprises ending an auction with one or more of a buyer’s manual intervention, a fixed time intervention, and an automatic intervention, wherein said automatic intervention occurs after a predetermined amount of supplier inactivity in said auction.
14. The method of claim 8, wherein said auction iteration comprises selecting one of a single round iteration methodology and a multiple round iteration methodology.
15. A program storage device readable by machine, tangibly embodying a program of instructions executable by said machine to perform a method for selecting an auction methodology for a buyersupplier procurement process, said method comprising:
determining an auction scope in a data processing system;
determining an auction interaction in said data processing system;
determining an auction control in said data processing system;
determining an auction pricing in said data processing system;
determining a set of auction closing rules in said data processing system;
determining an auction iteration in said data processing system; and
selecting an auction methodology based on at least one of said auction scope, said auction interaction, said auction control, said auction pricing, said auction closing rules, and said auction iteration.
16. The program storage device of claim 15, wherein said step of determining an auction scope comprises determining whether a request for a bid from a supplier is one of a public request and a directed request.
17. The program storage device of claim 15, wherein said step of determining an auction interaction comprises selecting one of an open-cry auction methodology, a sealed-bid auction methodology, an anonymous auction methodology, and a non-anonymous auction methodology.
18. The program storage device of claim 15, wherein said step of determining an auction control comprises selecting one of a regular reverse auction methodology and a Dutch reverse auction methodology.
19. The program storage device of claim 15, wherein said step of determining an auction pricing comprises selecting one of a discriminative auction methodology and a non-discriminative auction methodology.
20. The program storage device of claim 15, wherein said step of determining a set of auction closing rules comprises ending an auction with one or more of a buyer’s manual intervention, a fixed time intervention, and an automatic intervention, wherein said automatic intervention occurs after a predetermined amount of supplier inactivity in said auction.
21. The program storage device of claim 15, wherein said step of determining an auction iteration comprises selecting one of a single round iteration methodology and a multiple round iteration methodology.