1. A method for processing a carrier, the method comprising:
changing a three-dimensional structure of a mask layer arranged over the carrier so that at least two mask layer regions are formed having different mask layer thicknesses, wherein changing the three-dimensional structure of the mask layer comprises forming at least a first mask layer region comprising a gradual decrease of the thickness of the mask layer along a predefined direction parallel to a surface of the carrier and at least a second mask layer region comprising a gradual increase of the thickness of the mask layer along the same direction;
applying an ion implantation process to the at least two mask layer regions to form at least two implanted regions in the carrier having different implantation depth profiles.
2. The method according to claim 1,
wherein changing the three-dimensional structure of the mask layer comprises changing the three-dimensional structure of a resist layer.
3. The method according to claim 1, further comprising:
forming at least one electronic device including at least one of the at least two implanted regions.
4. The method according to claim 1,
wherein changing the three-dimensional structure of the mask layer comprises at least one lithographic process, wherein the at least two mask layer regions are formed using different exposures for each of the at least two mask layer regions.
5. The method according to claim 1,
wherein changing the three-dimensional structure of the mask layer comprises at least one lithographic process, wherein a plurality of mask layer regions are formed using different exposures for each of the plurality of mask layer regions.
6. The method according to claim 1,
wherein changing the three-dimensional structure of the mask layer comprises forming at least one mask layer region to form one of a step-wise and gradual change of the thickness of the mask layer.
7. The method according to claim 1,
wherein changing the three-dimensional structure of the mask layer comprises exposing at least two regions of a photoresist layer arranged over the carrier using ultraviolet light.
8. The method according to claim 1,
wherein changing the three-dimensional structure of the mask layer comprises a lithographic process using a single lithographic mask for exposing the at least two mask layer regions with different exposures for each of the at least two mask layer regions.
9. The method according to claim 8,
wherein the lithographic mask comprises at least a first lithographic mask region and a second lithographic mask region, wherein the optical transmittance provided by the first lithographic mask region is different from the optical transmittance provided by the second lithographic mask region.
10. The method according to claim 8,
wherein the single lithographic mask comprises a lithographic pixel mask having at least two different pixel mask regions to expose the at least two different mask layer regions with different exposures.
11. The method according to claim 10,
wherein at least one of the at least two different pixel mask regions of the lithographic pixel mask is adapted to compensate light intensity variations of an exposure tool.
12. The method according to claim 1,
wherein changing the three-dimensional structure of the mask layer comprises changing the three-dimensional structure of a resist layer by exposing at least two regions of the resist layer with light or particles having different intensities.
13. The method according to claim 1,
wherein changing the three-dimensional structure of the mask layer comprises changing the three-dimensional structure of a resist layer by exposing at least two regions of the resist layer with light or particles using different exposure durations.
14. The method according to claim 1,
wherein the ion implantation process comprises implanting ions simultaneously through the at least two mask layer regions.
15. The method according to claim 1,
wherein the ion implantation process comprises an ion implantation process using ions having a kinetic energy in the range from about 50 keV to about 10 MeV.
16. The method according to claim 1,
wherein the ion implantation process generates a doping profile in the carrier in accordance to the shape of the three-dimensional structure of the mask layer.
17. A method for processing a carrier, the method comprising:
changing a three-dimensional structure of a mask layer arranged over the carrier so that at least two mask layer regions are formed having different mask layer thicknesses;
applying an ion implantation process to the at least two mask layer regions to form at least two implanted regions in the carrier having different implantation depth profiles;
wherein changing the three-dimensional structure of the mask layer comprises a lithographic process using a single lithographic mask for exposing the at least two mask layer regions with different exposures for each of the at least two mask layer regions,
wherein the single lithographic mask comprises a lithographic pixel mask having at least two different pixel mask regions to expose the at least two different mask layer regions with different exposures, and
wherein at least one of the at least two different pixel mask regions of the lithographic pixel mask is adapted to compensate light intensity variations of an exposure tool.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A MEMS device package, comprising:
a hollow tubular part;
a top cap formed to cover a top opening of the tubular part;
a bottom cap formed to cover a bottom opening of the tubular part; and
a sensor device equipped in a cavity of the tubular part.
2. The MEMS device package as set forth in claim 1, wherein the sensor device is a support structure having a plate and an elastic arm and equipped in the tubular part.
3. The MEMS device package as set forth in claim 1, wherein the tubular part has one or more slits formed along a perimeter thereof.
4. The MEMS device package as set forth in claim 3, wherein the one or more slits are separated at an equal distance along the perimeter of the tubular part.
5. The MEMS device package as set forth in claim 3, wherein the slits pass through the tubular part in a length direction.
6. The MEMS device package as set forth in claim 3, wherein a damper are inserted into each of the slits.
7. The MEMS device package as set forth in claim 6, wherein the damper has a shape of an I-beam.
8. The MEMS device package as set forth in claim 6, wherein the damper has a shape of a T-beam.
9. The MEMS device package as set forth in claim 6, wherein the damper is formed of foam.
10. The MEMS device package as set forth in claim 6, wherein the damper is formed to have a honeycomb structure.
11. The MEMS device package as set forth in claim 6, wherein the damper is curved at the same curvature as the tubular part.
12. The MEMS device package as set forth in claim 1, wherein the tubular part is a quadrangular tubular part having a quadrangular cross section.
13. The MEMS device package as set forth in claim 1, wherein the top and bottom caps are formed to have a shape of a plate.
14. The MEMS device package as set forth in claim 1, wherein the top cap has a side part protruding in a vertical direction along a perimeter thereof.
15. The MEMS device package as set forth in claim 1, wherein the bottom cap has a side part protruding in a vertical direction along a perimeter thereof.
16. The MEMS device package as set forth in claim 1, wherein the tubular part is a circular tubular part having a circular cross section.
17. The MEMS device package as set forth in claim 1, wherein the top and bottom caps are formed to have a shape of an arch.
18. The MEMS device package as set forth in claim 1, wherein adhesive layers are stacked on the top and bottom surfaces of the tubular part, respectively.