1. A method for producing an at least partially cured layer, comprising:
applying a layer comprising a (meth)acrylate-functional siloxane to a major surface of a substrate; and
irradiating said layer, in a substantially inert atmosphere comprising no greater than 500 ppm oxygen, with a short wavelength polychromatic ultraviolet light source having at least one peak intensity at a wavelength of from about 160 nanometers to about 240 nanometers to at least partially cure the layer, optionally wherein the layer is at a curing temperature greater than 25\xb0 C.
2. The method of claim 1, wherein said at least one peak intensity is at a wavelength between about 170 nanometers to about 220 nanometers.
3. The method of claim 2, wherein said peak intensity is at a wavelength of about 185 nanometers.
4. The method of claim 1, wherein said short wavelength polychromatic ultraviolet light source comprises at least one low pressure mercury vapor lamp, at least one low pressure mercury amalgam lamp, at least one pulsed Xenon lamp, at least one glow discharge from a polychromatic plasma emission source, or combinations thereof.
5. The method of claim 1, wherein said layer consists essentially of one or more (meth)acrylate-functional siloxane monomers.
6. The method of claim 1, wherein said layer consists essentially of one or more (meth)acrylate-functional siloxane oligomers.
7. The method of claim 1, wherein said layer consists essentially of one or more (meth)acrylate-functional polysiloxanes.
8. The method of claim 1, wherein said layer further comprises one or more copolymerizable materials selected from the group consisting of monofunctional (meth)acrylate monomers, difunctional (meth)acrylate monomers, polyfunctional (meth)acrylate monomers having functionality greater than two, vinyl ester monomers, vinyl ester oligomers, vinyl ether monomers, and vinyl ether oligomers.
9. The method of claim 1, wherein said layer further comprises at least one functional polysiloxane material which does not comprise a (meth)acrylate functionality.
10. The method of claim 9, wherein said functional polysiloxane material is selected from the group consisting of a vinyl-functional polysiloxane, a hydroxy-functional polysiloxane, an amine-functional polysiloxane, a hydride-functional polysiloxane, an epoxy-functional polysiloxane, and combinations thereof.
11. The method of claim 1, wherein said layer further comprises at least one non-functional polysiloxane material.
12. The method of claim 11, wherein said at least one non-functional polysiloxane material is selected from a poly(dialkylsiloxane), a poly(alkylarylsiloxane), a poly(diarylsiloxane), a poly(dialkyldiarylsiloxane), or a combination thereof, optionally wherein the non-functional polysiloxane material comprises from 0.1 wt. % to 95 wt. %, inclusive, of the at least partially cured layer.
13. The method of claim 1, wherein said layer is substantially free of an added photoinitiator.
14. The method of claim 1, wherein said layer is substantially free of an organic solvent.
15. The method of claim 1, wherein said substantially inert atmosphere comprises no greater than 50 ppm oxygen.
16. The method of claim 1, wherein applying said layer to the surface of the substrate comprises applying a discontinuous coating.
17. The method of claim 1, wherein the substrate is selected from the group consisting of paper, poly-coated Kraft paper, supercalendered or glassine Kraft paper, a cloth backing, a nonwoven web, a metal foil, poly(ethylene terephthalate), poly(ethylene naphthalate), polycarbonate, polypropylene, biaxially-oriented polypropylene, polyethylene, polyamide, cellulose acetate, ethyl cellulose, and combinations thereof.
18. A release layer prepared using the method of claim 1, wherein said at least partially cured layer is substantially cured to produce a release layer having an unaged peel adhesion less than about 1.0 Newton per decimeter, optionally wherein the release layer is used as a surface layer in a release liner.
19. A release layer prepared using the method of claim 1, wherein said at least partially cured layer is substantially cured to produce a release layer having an unaged peel adhesion greater than about 4.0 Newtons per decimeter, optionally wherein the release layer is used as a low adhesion backsize (LAB) in an adhesive article.
20. An adhesive article comprising the release layer of claim 19, and an adhesive layer opposite the release layer on a substrate, optionally wherein the adhesive layer comprises one or more adhesive selected from a pressure sensitive adhesive, a hot melt adhesive, a radiation curable adhesive, a tackified adhesive, a non-tackified adhesive, a synthetic rubber adhesive, a natural rubber adhesive, a (meth)acrylic (co)polymer adhesive, a silicone adhesive, and a polyolefin adhesive.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A gasket assembly for reducing EMI, comprising:
a soft core configured to extend along an entire length of an opening in an EMI housing; and
a plurality of fingers positionable at spaced-apart positions along at least the length of the opening in the EMI housing, the plurality of fingers piercing an insulating layer of at least one mating conductive surface of the EMI housing to maintain conductivity between the at least one mating conductive surface and another mating conductive surface of the EMI housing.
2. The gasket assembly of claim 1 wherein at least one of the plurality of fingers is positioned over the soft core.
3. The gasket assembly of claim 1 wherein at least one of the plurality of fingers is positioned adjacent the soft core.
4. The gasket assembly of claim 1 wherein at least one of the plurality of fingers partially surrounds the soft core.
5. The gasket assembly of claim 1 wherein the gasket assembly provides a low-impedance path for conducting current between the mating surfaces of the EMI housing.
6. The gasket assembly of claim 1 wherein the soft core is fabric over foam.
7. A system for reducing EMI, comprising:
an enclosure with at least one opening for EMI formed between mating conductive surfaces;
a gasket assembly provided between the mating conductive surfaces of the enclosure, the gasket assembly including a soft core for sealing the at least one opening. and the gasket assembly including a plurality of spaced-apart fingers piercing an insulating layer of at least one mating conductive surface for maintaining conductivity between the at least one mating conductive surface and another mating conductive surfaces; and
the gasket assembly configured as a resistor to reduce EMI at low frequencies, and the gasket assembly configured as an inductor in series with a resistive load to reduce EMI at higher frequencies.
8. The system of claim 7 wherein the enclosure and gasket assembly shield against emissions that cause EMI.
9. The system of claim 7 wherein the enclosure and gasket assembly shield against EMI caused by other computer systems or electronic devices.
10. The gasket assembly of claim 7 wherein the soft core is fabric over foam.
11. The system of claim 7 wherein the gasket assembly functions as a shunt capacitor in parallel to a resistive load to reduce EMI.
12. The system of claim 7 wherein the gasket assembly reduces emissions in the DC through VHF range.
13. The system of claim 7 wherein the soft core reduces emissions in the VHF through microwave range.
14. A system comprising:
enclosure means for at least partially enclosing a source of EMI in an electronic device;
means for sealing mating surfaces between the enclosure means; and
a plurality of spaced-apart fingers means for piercing an insulating layer of at least one of the mating surfaces for maintaining conductivity between the mating surfaces; and
gasket assembly means for reducing EMI with a shunt capacitor in parallel to a resistive load.
15. The system of claim 14 further comprising means for reducing emissions in the DC through microwave range.