1. A one-piece, injection-molded case for storing an optical storage disc, said case comprising:
a spine;
a front cover coupled to said spine via a first living hinge; and
a back cover coupled to said spine via a second living hinge;
wherein said case, when in a closed configuration, has generally semi-cylindrical rimwalls, including upper and lower rimwalls, a spine rimwall, and a closure rimwall, which intersect in generally quarter-spherical corners; and
a disk mounting structure, including a hub and a platform, positioned on an inner surface of the back cover, said disk mounting structure being positioned closer to said lower rimwall than to said upper rimwall.
2. The one-piece, injection-molded case of claim 1, wherein each of the rimwalls has a flattened band running along a center portion thereof.
3. The one-piece, injection-molded case of claim 1, which further comprises a flexible, polymeric sleeve that wraps around the spine rimwall and is bonded to an edge of the closure rimwall on an outer surface of said front cover and to an edge of the closure rimwall on an outer surface of said back cover, said flexible polymeric sleeve being vertically displaced from the top rimwall to provide a band having a generally planar surface on an upper portion of the case with a height within a range of about 1 to 2 centimeters.
4. The one-piece, injection-molded case of claim 1, wherein said first live hinge is positioned at about a first quarter of the hemi-cylindrical spine rimwall, and said second live hinge is positioned at about a third quarter of the hemi-cylindrical spine rimwall, such that said front cover incorporates about one-fourth of the spine rimwall, said back cover incorporates about one-fourth of the spine rimwall, and said spine incorporates about one-half of the spine rimwall, having an outer contour that is generally about quarter cylindrical.
5. The one-piece, injection-molded case of claim 3, wherein positioning of the disk mounting structure closer to said lower rimwall than to said upper rimwall provides a space on an inner surface of the back cover, above the disk mounting structure and below the band on the upper portion of the case, for the mounting of an EAS tag.
6. The one-piece, injection-molded case of claim 3, which further comprises:
a tab integral with the spine that rotates down over an outer edge of an optical video disc stored on the disk mounting structure when the cover is in a closed configuration; and
a bracket integral with the front cover that locks over the outer edge of a stored optical video disc at a point adjacent the closure rimwall when the front cover is closed, said tab and bracket cooperating to prevent a stored disc from being removed from the hub when the case is in a closed configuration.
7. The one-piece, injection-molded case of claim 3, which further comprises upper and lower booklet clips and upper and lower guide walls integral with the inside front cover, said guide walls projecting upwardly from a major inner surface of the front cover, and said guide walls serving to guide the placement of an informational booklet that will be installed within the case beneath the booklet clips so that the booklet does not encroach on the band on the upper portion of the case, said guide walls also serving to reinforce the front cover to make it more difficult to bow both the front and back covers when the case is in a closed configuration.
8. The one-piece, injection-molded case of claim 3, which further comprises:
a first set of projections, which extend vertically from an inner surface of said rear cover adjacent the closure edge; and
a second set of projections, which extend vertically from the front cover near the closure edge, said first and second set of projections hampering removal of a stored optical video disc through a slit along a closure rimwall when the case is in a partially-open configuration.
9. The one-piece, injection-molded case of claim 3, which further comprisesat least one security latches that locks the front cover to the back cover along their closure edges.
10. A one-piece, injection-molded case for storing an optical storage disc, said case comprising:
a spine;
a front cover coupled to said spine via a first living hinge; and
a back cover coupled to said spine via a second living hinge; and
a flexible, polymeric laminar sleeve that wraps around the spine, covers a major portions of the front and back cover, one end thereof being bonded to an outer edge of the front cover adjacent its closure edge, the opposite end thereof being bonded to an outer edge of the back cover adjacent its closure edge, said flexible polymeric laminar sleeve being vertically displaced from a top of the case so as to provide a band having a generally planar surfaces on said front and back covers with a height within a range of about 1 to 2 centimeters.
11. The one-piece, injection-molded case of claim 10, wherein said case, when in a closed configuration, has generally semi-cylindrical rimwalls, including upper and lower rimwalls, a spine rimwall, and a closure rimwall, which intersect in generally quarter-spherical corners.
12. The one-piece, injection-molded case of claim 11, which further comprises a disk mounting structure, including a hub and a platform, positioned on an inner surface of the back cover, said disk mounting structure being positioned closer to said lower rimwall than to said upper rimwall.
13. The one-piece, injection-molded case of claim 11, wherein each of the rimwalls has a flattened band running along a center portion thereof.
14. The one-piece, injection-molded case of claim 11, wherein said first live hinge is positioned at about a first quarter of the hemi-cylindrical spine rimwall, and said second live hinge is positioned at about a third quarter of the hemi-cylindrical spine rimwall, such that said front cover incorporates about one-fourth of the spine rimwall, said back cover incorporates about one-fourth of the spine rimwall, and said spine incorporates about one-half of the spine rimwall, having an outer contour that is generally about quarter cylindrical.
15. The one-piece, injection-molded case of claim 12, wherein positioning of the disk mounting structure closer to said lower rimwall than to said upper rimwall provides a space on an inner surface of the back cover, above the disk mounting structure and below the band on the upper portion of the case, for the mounting of an EAS tag.
16. The one-piece, injection-molded case of claim 10, which further comprises:
a tab integral with the spine that rotates down over an outer edge of an optical video disc stored on the disk mounting structure when the cover is in a closed configuration; and
a bracket integral with the front cover that locks over the outer edge of a stored optical video disc at a point adjacent the closure rimwall when the front cover is closed, said tab and bracket cooperating to prevent a stored disc from being removed from the hub when the case is in a closed configuration.
17. The one-piece, injection-molded case of claim 10, which further comprises upper and lower booklet clips and upper and lower guide walls integral with the inside front cover, said guide walls projecting upwardly from a major inner surface of the front cover, and said guide walls serving to guide the placement of an informational booklet that will be installed within the case beneath the booklet clips so that the booklet does not encroach on the band on the upper portion of the case, said guide walls also serving to reinforce the front cover to make it more difficult to bow both the front and back covers when the case is in a closed configuration.
18. The one-piece, injection-molded case of claim 10, which further comprises:
a first set of projections, which extend vertically from an inner surface of said rear cover adjacent the closure edge; and
a second set of projections, which extend vertically from the front cover near the closure edge, said first and second set of projections hampering removal of a stored optical video disc through a slit along a closure rimwall when the case is in a partially-open configuration.
19. The one-piece, injection-molded case of claim 10, which further comprisesat least one security latches that locks the front cover to the back cover along their closure edges.
20. The one-piece, injection-molded case of claim 10, wherein said spine has curved upper and lower end portions which fit into corresponding cutouts in the upper and lower sidewalls, respectively, when the case is in a closed configuration, a first half of each of said cutouts being incorporated in the front cover and a second half of each of said cutouts being incorporated in the back cover.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for fabricating a semiconductor device test apparatus, comprising:
providing a carrier substrate having at least one contact pad on a surface thereof;
securing to said surface of said carrier substrate at least one test substrate with a surface opposing said carrier substrate having at least one test pad exposed thereto, said at least one test pad communicating with a corresponding contact pad by way of at least one electrical trace;
forming at least one wire bond to electrically connect said at least one contact pad of said at least one test substrate to said corresponding contact pad of said carrier substrate; and
stereolithographically fabricating at least one protective structure to shield said at least one wire bond.
2. The method of claim 1, further comprising placing a fence member over said at least one protective structure.
3. The method of claim 2, wherein said placing said fence member comprises assembling a preformed fence member with at least said at least one test substrate.
4. The method of claim 2, wherein said placing said fence member comprises stereolithographically fabricating said fence member at least on said at least one test substrate.
5. The method of claim 2, wherein said stereolithographically fabricating said at least one protective structure and said placing said fence member are effected substantially concurrently.
6. The method of claim 1, further comprising storing data including at least one physical parameter of at least said at least one test substrate in computer memory and using the stored data in conjunction with a machine vision system to recognize a location and orientation of said at least one test substrate.
7. The method of claim 6, further comprising using the stored data, in conjunction with said machine vision system, to selectively form said at least one protective structure stereolithographically over at least one portion of at least one of said carrier substrate and said at least one test substrate laterally adjacent said at least one wire bond.
8. The method of claim 6, further comprising using the stored data, in conjunction with said machine vision system, to form sidewalls comprising at least one layer of material about said carrier substrate.
9. The method of claim 6, wherein said stereolithographically fabricating comprises sequentially fabricating a plurality of superimposed, contiguous, mutually adhered layers positioned and of sufficient thickness so as to shield said at least one wire bond.
10. The method of claim 6, wherein said stereolithographically fabricating comprises fabricating said at least one protective structure in at least partial contact with said at least one wire bond.
11. A method for fabricating a semiconductor device test apparatus, comprising:
providing a carrier substrate having at least one contact pad on a surface thereof;
securing to said surface of said carrier substrate at least one test substrate to form a semiconductor device assembly with a surface opposing said carrier substrate having at least one test pad exposed thereto, said at least one test pad communicating with a corresponding contact pad by way of at least one electrical trace;
forming at least one bond wire to electrically connect said at least one contact pad of said at least one test substrate to said corresponding contact pad of said carrier substrate; and
forming at least one layer comprising a material in an unconsolidated state on at least a portion of said semiconductor device assembly; and
selectively altering a state of material adjacent said at least one bond wire to at least a semisolid state to form an at least semisolid region of said at least one layer.
12. The method of claim 11, further comprising:
forming, over said at least one layer, a second layer comprising a material in an unconsolidated state; and
selectively altering, to an at least semisolid state, material of said second layer located adjacent said at least one bond wire and at least partially contiguous with said at least semisolid region of said at least one layer.
13. The method of claim 12, wherein said selectively altering said material of said second layer comprises forming a substantially solid region of said second layer.
14. The method of claim 12, wherein said forming said second layer comprises forming said second layer to have a different thickness than said at least one layer.
15. The method of claim 13, wherein said selectively altering said material of said second layer comprises securing said substantially solid region of said second layer to said at least semisolid region of said at least one layer.
16. The method of claim 11, wherein said forming said at least one layer comprises disposing a photopolymer in a liquid state on said at least a portion of said semiconductor device assembly.
17. The method of claim 16, wherein said selectively altering comprises directing a controlled beam of radiation onto selected areas of said at least one layer.
18. The method of claim 17, wherein said selectively altering comprises directing ultraviolet radiation onto said selected areas.
19. The method of claim 11, wherein said selectively altering comprises selectively altering material located at at least one boundary of a structure to be fabricated adjacent said at least one bond wire.
20. The method of claim 19, wherein said selectively altering further comprises, following said selectively altering said material located at said at least one boundary, selectively altering said material within confines of said at least one boundary.
21. The method of claim 20, wherein said selectively altering comprises selectively altering at least material of said at least one layer in contact with said at least one bond wire.
22. The method of claim 20, further comprising repeating said forming said at least one layer and selectively altering the state of said material of said at least one layer until said material in said at least said semisolid state is disposed over an uppermost portion of said at least one bond wire.
23. The method of claim 11, further comprising removing at least some of said material remaining in said unconsolidated state from said semiconductor device assembly.
24. The method of claim 23, further comprising further curing at least said material in said at least said semisolid state.
25. The method of claim 24, wherein said further curing comprises heating at least said material in said at least said semisolid state.
26. The method of claim 24, wherein said further curing comprises exposing at least said material in said at least said semisolid state to ultraviolet radiation.