1. A method for producing a semiconductor optical device, comprising the steps of:
forming a first optical waveguide and a second optical waveguide on a principal surface of a substrate;
forming a first resin layer on the principal surface of the substrate, on top surfaces of the first and the second optical waveguides, and on side surfaces of the first and second optical waveguides;
forming an opening in the first resin layer on the first optical waveguide by etching the first resin layer to the first optical waveguide without etching the first resin layer on the second optical waveguide;
forming a first electrode in a part of the opening, the first electrode being in contact with the top surface of the first optical waveguide through the opening;
forming a second resin layer on the first electrode and on the first resin layer, the second resin layer filling the opening;
forming a groove by etching the second resin layer on the first electrode without etching the second resin layer on the second optical waveguide until a top surface of the first electrode is exposed;
forming a second electrode on the second resin layer, on a side surface of the groove, and on the top surface of the first electrode; and
forming a third electrode on the second electrode, wherein
in the step of forming the groove, the groove is formed to have a width smaller than a width of the first electrode at a bottom surface of the groove,
the third electrode is configured to fill the groove,
the second and third electrodes have a region in which the second and third electrodes pass over the second optical waveguide, and
in said region, the first and second resin layers are disposed between the second electrode and the second optical waveguide, the second electrode being separated in a direction perpendicular to the principal surface of the substrate at a predetermined distance from the top surface of the second optical waveguide.
2. The method according to claim 1, wherein the second resin layer has a thickness larger than a height of the second optical waveguide in the region in which the second and third electrodes pass over the second optical waveguide.
3. The method according to claim 1, wherein, in the step of forming the first resin layer, the first resin layer has a surface higher than the top surface of the first optical waveguide,
the surface of the first resin layer is separated at a predetermined distance from the top surface of the first optical waveguide, and
the distance between the surface of the first resin layer and the top surface of the first optical waveguide is smaller than one half of the height of the first optical waveguide.
4. The method according to claim 1, wherein, in the step of forming the groove, the side surface of the groove is formed to extend in a direction substantially perpendicular to the principal surface of the substrate.
5. The method according to claim 1, further comprising the steps of:
before the formation of the second resin layer, forming an insulating layer on the first resin layer and on the first electrode; and
after the formation of the groove in the second resin layer, etching the insulating layer using the second resin layer as a mask until the top surface of the first electrode is exposed.
6. The method according to claim 1, wherein, in the step of forming the opening, the opening is formed to have a width larger than a width of the first optical waveguide at a bottom surface of the opening, and
in the step of forming the first electrode, the first electrode is formed to have a width larger than the width of the first optical waveguide.
7. The method according to claim 1, wherein the second electrode is formed by a sputtering method, and the third electrode is formed by a plating method.
8. The method according to claim 1, wherein, in the step of forming the groove, the groove is formed to extend in a direction parallel to the first optical waveguide, and the side surface of the groove is formed to be entirely surrounded by the second resin layer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A heat dissipating apparatus for an electronic device having an integrated heat spreader, comprising:
a base having a lower surface and an upper surface, the lower surface having a contact area to contact the integrated heat spreader when the base is disposed on the electronic device, and the lower surface having a concave area extended to the contact area from an edge of the lower surface of the base.
2. The heat dissipating apparatus as claimed in claim 1, wherein the contact area of the base is connected to the integrated heat spreader by means of thermal paste.
3. The heat dissipating apparatus as claimed in claim 2, wherein the thermal paste is composed of a phase change material.
4. The heat dissipating apparatus as claimed in claim 1, wherein the base further comprises a plurality of fins formed on the upper surface thereof.
5. The heat dissipating apparatus as claimed in claim 1, wherein the cross section of the concave area is rectangular.
6. The heat dissipating apparatus as claimed in claim 1, wherein the cross section of the concave area is semicircular.
7. The heat dissipating apparatus as claimed in claim 1, wherein the cross section of the concave area is triangular.
8. The heat dissipating apparatus as claimed in claim 1, wherein the integrated heat spreader and contact area are substantially rectangular.
9. The heat dissipating apparatus as claimed in claim 1, wherein the electronic device is a central processing unit (CPU).
10. A heat dissipating apparatus, disposed on an electronic device having an integrated heat spreader, comprising:
a base having a concave area and a contact area, wherein the contact area is connected to the integrated heat spreader, the shape and position of the contact area correspond to the shape and position of the integrated heat spreader, and the concave area is extended to the contact area from an edge of the base; and
a thermal paste disposed between the contact area and integrated heat spreader.
11. The heat dissipating apparatus as claimed in claim 10, wherein the thermal paste is composed of a phase change material.
12. The heat dissipating apparatus as claimed in claim 10, wherein the base further comprises a plurality of fins formed thereon.
13. The heat dissipating apparatus as claimed in claim 10, wherein the cross section of the concave area is rectangular.
14. The heat dissipating apparatus as claimed in claim 10, wherein the cross section of the concave area is semicircular.
15. The heat dissipating apparatus as claimed in claim 10, wherein the cross section of the concave area is triangular.