1. A microstructured article comprising a polymerized structure comprising the reaction product of a composition comprising an organic component having at least one aliphatic oligomeric urethane (meth)acrylate and surface modified silica nanoparticles. have a primary particle size greater than 1 nm and less than 100 nm.
2. The microstructured article according to claim 1 wherein the silica nanoparticles have a primary particle size is from 5 to 75 nm.
3. The microstructured article according to claim 1 wherein the silica nanoparticles have a primary particle size ranging from 10 to 30 nm.
4. The microstructured article according to claim 1 wherein the silica comprises 10 to 60 wt-% of the polymerized structure.
5. The microstructured article according to claim 1 wherein the silica comprises 10 to 40 wt-% of the polymerized structure.
6. The microstructured article according to claim 1 wherein the composition further comprise nanoparticles selected from zirconia, titania, antimony oxides, alumina, tin oxides, mixed metal oxides thereof, or mixtures thereof.
7. The microstructured article according to claim 1 wherein the surface modified nanoparticles are polymerizable with the organic component.
8. The microstructured article according to claim 1 wherein the composition comprises a photoinitiator.
9. The microstructured article of claim 1 wherein the article is retroreflective sheeting.
10. The microstructured article of claim 1 wherein the article is a flexible mold suitable for making barrier ribs for a plasma display panel.
11. The microstructured article of claim 1 wherein the article is an optical film comprising a microstructured optical layer in contact with a base layer.
12. The microstructured article of claim 11 wherein the article microstructured optical layer comprises a plurality of ridges having apexes.
13. The microstructured article of claim 12 wherein the apexes are rounded having a radius ranging from 4 to 15 micrometers.
14. The microstructured article of claim 13 wherein the article is a turning film.
15. A device comprising:
(a) a lighting device having a light-emitting surface; and
(b) the microstructured film of claim 11 placed substantially parallel to said light-emitting surface.
16. The device according to claim 15 wherein the lighting device is a back-lit display device or a liquid crystal display device.
17. The device according to claim 15 wherein the device is selected from a handheld device, a computer display and a television.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A degreasing composition production method being a method for producing a degreasing composition in the form of a slurry for preparing a cleaning liquid, the method comprising:
a step of obtaining a slurry by mixing a first liquid and a powdery silicate having a particle diameter ranging from 0.2 mm to 10 mm,
wherein the first liquid contains an alkaline component composed of at least one of sodium hydroxide and potassium hydroxide, an alcohol having three or fewer carbon atoms, and water, and
the degreasing composition contains, with respect to the total composition, 10 mass % to 60 mass % of the alkaline component, 0.1 mass % to 5 mass % of the alcohol, 1 mass % to 50 mass % of the silicate, and 20 mass % to 50 mass % of water including hydration water of the silicate, and contains no chelating agent.
2. A degreasing composition production method being a method for producing a degreasing composition in the form of a slurry for preparing a cleaning liquid, the method comprising:
a step of obtaining a slurry by mixing a second liquid and a powdery silicate having a particle diameter ranging from 0.2 mm to 10 mm,
wherein the second liquid contains an alkaline component composed of at least one of sodium hydroxide and potassium hydroxide, an alcohol having three or fewer carbon atoms, a chelating agent, and water, and
the degreasing composition contains, with respect to the total composition, 10 mass % to 60 mass % of the alkaline component, 0.1 mass % to 5 mass % of the alcohol, 1 mass % to 50 mass % of the silicate, more than 0.0 mass % but less than 5 mass % of the chelating agent, and 20 mass % to 50 mass % of water including hydration water of the silicate.
3. A degreasing composition production method being a method for producing a degreasing composition in the form of a slurry for preparing a cleaning liquid, the method comprising:
a step of obtaining a slurry by mixing a third liquid and a powdery silicate having a particle diameter ranging from 0.2 mm to 10 mm,
wherein the third liquid contains an alkaline component composed of at least one of sodium hydroxide and potassium hydroxide, an alcohol having three or fewer carbon atoms, a chelating agent, and water, and
the degreasing composition contains, with respect to the total composition, 10 mass % to 60 mass % of the alkaline component, more than 0.0 mass % up to 5 mass % of the alcohol, 1 mass % to 50 mass % of the silicate, 5 mass % to 50 mass % of the chelating agent, and 20 mass % to 50 mass % of water including hydration water of the silicate.
4. A degreasing composition production method being a method for producing a degreasing composition in the form of a slurry for preparing a cleaning liquid, the method comprising:
a step of obtaining a slurry by mixing a fourth liquid and a powdery silicate having a particle diameter ranging from 0.2 mm to 10 mm,
wherein the fourth liquid contains an alkaline component composed of at least one of sodium hydroxide and potassium hydroxide, a chelating agent, and water, and
the degreasing composition contains, with respect to the total composition, 10 mass % to 60 mass % of the alkaline component, 1 mass % to 50 mass % of the silicate, 5 mass % to 50 mass % of the chelating agent, and 20 mass % to 50 mass % of water including hydration water of the silicate, and contains no alcohol having three or fewer carbon atoms.
5. The degreasing composition production method according to claim 2, wherein the chelating agent is EDTA.
6. The degreasing composition production method according to claim 1, wherein the temperature of the liquid that is mixed with the powdery silicate is not higher than 35\xb0 C. at the time when the silicate is added.
7. The degreasing composition production method according to claim 1, wherein the degreasing composition contains 30 mass % or less of a surfactant with respect to the total composition.
8. A degreasing composition for preparing a cleaning liquid, containing: with respect to the total composition, 10 mass % to 60 mass % of an alkaline component composed of at least one of sodium hydroxide and potassium hydroxide; 0.1 mass % to 5 mass % of an alcohol having three or fewer carbon atoms; 1 mass % to 50 mass % of a silicate; and 20 mass % to 50 mass % of water including hydration water of the silicate, and containing no chelating agent, the degreasing composition being a slurry in which at least part of the silicate is dispersed in the form of silicate particles having a particle diameter no greater than 10 mm, wherein no clumpy crystals form even when the degreasing composition is left to stand in an environment at \u22122\xb0 C. for 24 hours.
9. A degreasing composition for preparing a cleaning liquid, containing: with respect to the total composition, 10 mass % to 60 mass % of an alkaline component composed of at least one of sodium hydroxide and potassium hydroxide; 0.1 mass % to 5 mass % of an alcohol having three or fewer carbon atoms; 1 mass % to 50 mass % of a silicate; more than 0.0 mass % but less than 5 mass % of a chelating agent; and 20 mass % to 50 mass % of water including hydration water of the silicate, the degreasing composition being a slurry in which at least part of the silicate is dispersed in the form of silicate particles having a particle diameter no greater than 10 mm, wherein no clumpy crystals form even when the degreasing composition is left to stand in an environment at \u22122\xb0 C. for 24 hours.
10. A degreasing composition for preparing a cleaning liquid, containing: with respect to the total composition, 10 mass % to 60 mass % of an alkaline component composed of at least one of sodium hydroxide and potassium hydroxide; more than 0.0 mass % up to 5 mass % of an alcohol having three or fewer carbon atoms; 1 mass % to 50 mass % of a silicate; 5 mass % to 50 mass % of a chelating agent; and 20 mass % to 50 mass % of water including hydration water of the silicate, the degreasing composition being a slurry in which at least part of the silicate is dispersed in the form of silicate particles having a particle diameter no greater than 10 mm, wherein no clumpy crystals form even when the degreasing composition is left to stand in an environment at \u22122\xb0 C. for 24 hours.
11. A degreasing composition for preparing a cleaning liquid, containing: with respect to the total composition, 10 mass % to 60 mass % of an alkaline component composed of at least one of sodium hydroxide and potassium hydroxide; 1 mass % to 50 mass % of a silicate; 5 mass % to 50 mass % of a chelating agent; and 20 mass % to 50 mass % of water including hydration water of the silicate, and containing no alcohol having three or fewer carbon atoms, the degreasing composition being a slurry in which at least part of the silicate is dispersed in the form of silicate particles having a particle diameter no greater than 10 mm, wherein no clumpy crystals form even when the degreasing composition is left to stand in an environment at \u22122\xb0 C. for 24 hours.
12. The degreasing composition according to claim 9, wherein the chelating agent is EDTA, and at least part thereof is dispersed in the slurry.
13. The degreasing composition according to claim 8, containing 30 mass % or less of a surfactant with respect to the total composition.
14. The degreasing composition production method according to claim 3, wherein the chelating agent is EDTA.
15. The degreasing composition production method according to claim 4, wherein the chelating agent is EDTA.
16. The degreasing composition production method according to claim 2, wherein the temperature of the liquid that is mixed with the powdery silicate is not higher than 35\xb0 C. at the time when the silicate is added.
17. The degreasing composition production method according to claim 3, wherein the temperature of the liquid that is mixed with the powdery silicate is not higher than 35\xb0 C. at the time when the silicate is added.
18. The degreasing composition production method according to claim 4, wherein the temperature of the liquid that is mixed with the powdery silicate is not higher than 35\xb0 C. at the time when the silicate is added.
19. The degreasing composition production method according to claim 2, wherein the degreasing composition contains 30 mass % or less of a surfactant with respect to the total composition.
20. The degreasing composition production method according to claim 3, wherein the degreasing composition contains 30 mass % or less of a surfactant with respect to the total composition.