1. A polishing system, comprising:
a drive assembly; and
a chemical mechanical polishing pad in connection with said drive assembly and adapted to receive a wafer for polishing, said polishing pad including:
a plurality of continuously porous sections each including a plurality of interconnected pores; and
a non-porous section which separates each of said continuously porous sections from another of said continuously porous sections; wherein said drive assembly rotates at least one of said polishing pad and the wafer.
2. The system of claim 1, further comprising a wafer holder adapted to receive the wafer, wherein said drive assembly rotates said wafer holder.
3. The system of claim 2, further comprising a second drive assembly and a platen, wherein said second drive assembly connects with and rotates said platen.
4. The system of claim 3, wherein said drive assembly rotates said wafer holder in the same direction as said second drive assembly rotates said platen.
5. The system of claim 3, wherein said drive assembly rotates said wafer holder in the opposite direction as said second drive assembly rotates said platen.
6. The system of claim 1, wherein said non-porous section comprises a network of trenches.
7. The system of claim 6, wherein said network of trenches comprises tapered trenches.
8. The system of claim 6, wherein said network of trenches comprises straight walled trenches.
9. The system of claim 1, wherein said non-porous section comprises a first material having a plurality of pores and a second material provided over and within said pores.
10. The system of claim 9, wherein said second material comprises a polymer resin.
11. The system of claim 1, wherein said non-porous section comprises a solid material.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A system, comprising:
a simple peripheral bus (SPB) configured for data communication between components in a computing system; and
peripheral sensors implemented with an HID SPB interface, each of the peripheral sensors configured to interface a peripheral device with the computing system via the simple peripheral bus in an HID data format.
2. A system as recited in claim 1, wherein a peripheral sensor is further configured to communicate extensibility data for a proprietary function of the peripheral device in the computing system via the simple peripheral bus.
3. A system as recited in claim 1, wherein a peripheral sensor is further configured to indicate that the peripheral device is an HID compatible device to the computing system, and determine a configuration of the peripheral device.
4. A system as recited in claim 1, wherein a peripheral sensor is further configured for bi-directional data communication from the peripheral device to the computing system, and from the computing system to the peripheral device using HID reporting protocols.
5. A system as recited in claim 1, wherein a peripheral sensor is further configured to maintain HID application compatibility with a peripheral device.
6. A system as recited in claim 1, wherein the peripheral sensors include at least one of a sensor or peripheral device controller.
7. A system as recited in claim 1, wherein the peripheral sensors are further configured to communicate data as HID data structures via the simple peripheral bus.
8. A system as recited in claim 1, further comprising an SPB driver configured to communicate HID data between a peripheral sensor and an HID software stack.
9. A computer-implemented method, comprising:
receiving inputs from a peripheral device at a peripheral sensor that implements an HID SPB interface to interface the peripheral device with a computing system via a simple peripheral bus (SPB) in an HID data format;
receiving extensibility data for a proprietary function of the peripheral device at the peripheral sensor; and
communicating the inputs from the peripheral device and the extensibility data via the simple peripheral bus in the HID data format in the computing system.
10. A method as recited in claim 9, further comprising indicating that the peripheral device is an HID compatible device to the computing system.
11. A method as recited in claim 9, further comprising determining a configuration of the peripheral device.
12. A method as recited in claim 9, further comprising communicating configuration data from the computing system to the peripheral device.
13. A method as recited in claim 9, further comprising maintaining HID application compatibility with the peripheral device.
14. A method as recited in claim 9, further comprising communicating data as HID data structures via the simple peripheral bus.
15. A method as recited in claim 9, further comprising communicating HID data between the peripheral sensor and an HID software stack.
16. A method, comprising:
generating sensor data at a peripheral sensor that implements an HID SPB interface to interface the peripheral sensor with a computing system via a simple peripheral bus (SPB) in an HID data format;
communicating the sensor data via the simple peripheral bus in the HID data format to the computing system; and
communicating extensibility data for a proprietary function of the peripheral sensor to the computing system.
17. A method as recited in claim 16, further comprising indicating that the peripheral sensor is an HID compatible device to the computing system.
18. A method as recited in claim 16, further comprising:
communicating configuration information to the computing system; and
receiving configuration data from the computing system to configure the peripheral sensor.
19. A method as recited in claim 16, wherein the simple peripheral bus is at least one of an I2C data bus or a serial peripheral interface (SPI) data bus.
20. A method as recited in claim 16, further comprising communicating HID data between the peripheral sensor and an HID software stack.