1. A BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly, comprising:
an underlying circuit layer having a connection surface adapted for face to face operative connection of an integrated circuit chip,
an insulating layer over the underlying circuit,
an outer conductive layer over the insulating layer and above the connection surface and including at least one outer conductive layer vertical wall and a raised BGA solder ball pad substantially co-planar with the outer conductive layer, said BGA solder ball pad having a raised face and vertical conductive pad walls spaced from the at least one outer conductive layer vertical wall,
the raised face being raised above the connection surface of the underlying circuit layer a substantial height, and a BGA solder ball adhered to the raised face and a substantial portion of the outer vertical conductive walls,
a solder mask layer at a lower portion of raised pad formed to provide an insulating layer upon the outer conductive layer vertical wall and occupying at least a portion of a space between the outer conductive layer vertical wall and the raised BGA solder ball pad, the BGA solder ball being supported, at least in part, by the solder mask layer, and wherein said BGA solder ball has an average diameter of greater than the width of the raised face.
2. The BGA solder ball interconnection defined in claim 1, wherein the BGA solder ball has an average diameter of greater than approximately two times the width of the raised face.
3. The BGA solder ball interconnection defined in claim 1, wherein the BGA solder ball is further adhered to a substantial portion of at least one of the vertical walls.
4. The BGA solder ball interconnection defined in claim 1, wherein the raised pad is formed by photolithographic etching away of portion of the outer conductive layer.
5. The BGA solder ball interconnection defined in claim 1, wherein the raised pad is contiguous with a portion of the outer conductive layer serving as a power plane for a chip.
6. The BGA solder ball interconnection defined in claim 1, wherein the raised pad has a longitudinally extending offset portion.
7. The BGA solder ball interconnection defined in claim 6, wherein the raised pad has an enlarged base portion and the offset portion extends longitudinally from the enlarged base portion.
8. The BGA solder ball interconnection defined in claim 7, wherein the base portion has a window defined therein, the window including solder or electrically conductive paste electrically connecting the raised pad to the underlying circuit layer.
9. The BGA solder ball interconnection defined in claim 8, wherein the underlying circuit layer includes an upstanding bump, the window having a width substantially greater than the width of the bump and the solder or conductive paste is electrically connected to the bump.
10. The BGA solder ball interconnection defined in claim 1, further comprising a solder mask layer over the underlying conductive layer, the solder mask layer having a window defined therein exposing at least a portion of the raised face of the raised pad, the solder ball being adhered to the raised face.
11. The BGA solder ball interconnection defined in claim 10, wherein at least a portion of the vertical conductive walls of the raised pad is exposed and the solder ball is further adhered to a substantial portion of at least one of the vertical conductive walls.
12. A BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly comprising an underlying circuit layer having a connection surface adapted for face to face operative connection of an integrated circuit chip, an insulating layer over the underlying circuit, and a conductive layer over the insulating layer and above the connection surface and including at least one conductive layer vertical wall and a raised BGA solder ball pad spaced from the at least one conductive layer vertical wall and substantially co-planar with the conductive layer, the BGA solder ball pad having a raised face and vertical conductive walls, the raised face being raised above the connection surface of the underlying circuit layer a substantial height, a solder mask layer at a lower portion of raised pad providing an insulating layer upon the conductive layer vertical wall and occupying at least a portion of a space between the conductive layer vertical wall and the raised BGA solder ball pad, a BGA solder ball having an average diameter of greater than the width of the raised face adhered to the raised face and to a substantial portion of at least one of the vertical conductive walls, the BGA solder ball being supported, at least in part, by the solder mask layer.
13. A BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly having an underlying circuit layer having a connection surface adapted for face to face operative connection of an integrated circuit chip and comprising,
an insulating layer over the underlying circuit, and
an outer conductive layer over the insulating layer and above the connection surface and including at least one outer conductive layer vertical wall spaced from a raised BGA solder ball pad substantially co-planar with the outer conductive layer, the BGA solder ball pad having a raised face and vertical conductive walls, the raised face being raised above the connection surface of the underlying circuit layer at least about 25 microns, a solder mask layer at a lower portion of raised pad providing an insulating layer upon the outer conductive layer vertical wall and occupying at least a portion of a space between the outer conductive layer vertical wall and the raised BGA solder ball pad, and a BGA solder ball adhered to the raised face and to a substantial portion of at least one of the vertical conductive walls, the BGA solder ball being supported, at least in part, by the solder mask layer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus for enhancing audio quality, the apparatus comprising:
at least three microphones which are disposed in a non-uniform configuration;
a frequency conversion unit configured to transform acoustic signals input from the at least three microphones to acoustic signals of frequency domain;
a band division and merging unit configured to divide frequencies of the transformed acoustic signals into bands based on intervals between the at least three microphones and to merge the acoustic signals in the frequency domain into signals of two channels based on the divided frequency bands; and
a two channel beamforming unit configured to reduce noise of signals including input from a direction other than the direction of a target sound by performing beamforming on the signals of the two channels and to output the noise-reduced signals.
2. The apparatus of claim 1, wherein the at least three microphones are disposed according to a minimum redundant linear array configuration that minimizes a redundant component for an interval between the at least three microphones.
3. The apparatus of claim 1, wherein, when the band division and merging unit divides the frequencies into bands for the transformed acoustic signals based on the respective intervals of the at least three microphones, the frequency bands are assigned using the maximum frequency value that does not cause spatial aliasing for each corresponding interval of the at least three microphones.
4. The apparatus of claim 3, wherein the band division and merging unit determines the maximum frequency value (fo) of a band to be less than a value obtained by dividing a sound velocity (c) by twice the interval between the corresponding microphones (d).
5. The apparatus of claim 1, wherein the number of frequency bands configured by the band division and margining unit are determined to correspond to the number of intervals of various pairs of the at least three microphones.
6. The apparatus of claim 1, wherein the band division and merging unit is further configured to extract acoustic signals in the frequency domain that are input from a set of two of the at least three microphones forming an interval for all sets of intervals of the at least three microphones of each frequency band and to merge the extracted acoustic signals into acoustic signals of two channels.
7. The apparatus of claim 1, further comprising an inverse frequency conversion unit configured to transform the output noise-reduced signals into acoustic signals of a time domain.
8. An apparatus for enhancing audio quality, the apparatus comprising:
at least three microphones disposed in a non-uniform configuration;
a filtering unit including a plurality of band-pass filters configured to allow acoustic signals input from the at least three microphones to pass through respective frequency bands of the plurality of band-pass filters, wherein the range of frequencies corresponding to each band-pass filter is determined based on intervals between the at least three microphones;
a frequency conversion unit configured to transform the acoustic signals having passed through the filtering unit into acoustic signals of a frequency domain;
a two channel beamforming unit configured to reduce noise input from a direction other than a direction of a target sound of acoustic signals of two channels for each frequency band, the acoustic signals having passed through a same band-pass filter among the plurality of band-pass filters;
a merging unit configured to merge the noise reduced acoustic signals output for each frequency band; and
an inverse frequency conversion unit configured to transform the merged signals into acoustic signals of a time domain.
9. The apparatus of claim 8, wherein the at least three microphones are configured according to a minimum redundant linear array to minimize a redundant component for the intervals of the at least three microphones.
10. The apparatus of claim 8, wherein the range of frequencies corresponding to each band-pass filter band-pass filters included in the filtering unit are determined by use of maximum frequency values that do not cause spatial aliasing for each corresponding interval of the at least three microphones.
11. A method of enhancing audio quality of an acoustic array, the method comprising:
transforming acoustic signals input from at least three microphones disposed in a non-uniform configuration into acoustic signals of the frequency domain;
dividing a range of frequencies of the acoustic signals of frequency domain into frequency bands based on intervals between the microphones;
merging the acoustic signals of the frequency domain into two channel signals based on the frequency bands;
reducing noise of the acoustic signals input from a direction other than a direction of a target sound by use of the two channel signals; and
outputting the noise reduced signals.
12. The method of claim 11, wherein transforming acoustic signals input from at least three microphones disposed in a non-uniform configuration includes disposing the at least three microphones according to a minimum redundant linear array configuration to minimize a redundant component for the interval between the microphones.
13. The method of claim 11, wherein dividing the range of frequencies of the acoustic signals of frequency domain into frequency bands based on intervals between the microphones further comprises determining the frequency bands by use of a maximum frequency value that does not cause spatial aliasing for each corresponding interval of the microphones.
14. The method of claim 13, wherein determining the frequency bands by use of a maximum frequency value that does not cause spatial aliasing for each corresponding interval of the microphones includes determining the maximum frequency value (fo) of a band to be less than a value obtained by dividing a sound velocity (c) by twice a corresponding interval of microphones (d).
15. The method of claim 11, wherein dividing the range of frequencies of the acoustic signals of frequency domain into frequency bands based on intervals between the microphones comprises dividing the frequency range of frequencies into bands corresponding to the number of intervals of the microphones.
16. The method of claim 11, wherein merging the acoustic signals of the frequency domain into two channel signals comprises
extracting acoustic signals in the frequency domain that are input from a set of two of the at least three microphones forming an interval for all sets of intervals of the at least three microphones of each frequency band; and
merging the extracted acoustic signals into acoustic signals of two channels.
17. The method of claim 11, further comprising transforming the output noise-reduced signals into acoustic signals of a time domain.
18. A method of enhancing audio quality of an acoustic array including at least three microphones disposed in a non-uniform configuration, the method comprising:
allowing acoustic signals input from the at least three microphones to pass through respective frequency bands of a plurality of band-pass filters, wherein the range of frequencies corresponding to each band-pass filter is determined based on intervals between the at least three microphones;
transforming the acoustic signals into acoustic signals of a frequency domain;
reducing noise input from direction other than a direction of a target sound of acoustic signals of two channels for each frequency band, the acoustic signals having passed through a same band-pass filter among the plurality of band-pass filters;
merging the noise-reduced acoustic signals output for each frequency band; and
transforming the merged noise-reduced acoustic signals into acoustic signals of time domain.
19. The method of claim 18, wherein the at least three microphones are configured according to a minimum redundant linear array to minimize a redundant component for the intervals of the at least three microphones.
20. The method of claim 18, wherein the allowing of the acoustic signals to pass through the respective frequency bands comprises:
passing acoustic signals through the respective frequency bands that are determined by use of the maximum frequency value that does not cause spatial aliasing for each corresponding interval of the at least three microphones.