1. An adhesive film for underfill, comprising:
resin components containing an epoxy resin having a number average molecular weight of 600 or less, a phenol resin having a number average molecular weight exceeding 500, and an elastomer;
wherein a content of the epoxy resin in the resin components is 5 to 50% by weight;
wherein a content of the phenol resin in the resin components is 5 to 50% by weight.
2. The adhesive film for underfill according to claim 1, wherein a hydroxyl equivalent weight of the phenol resin is 200 geq or more.
3. The adhesive film for underfill according to claim 1, wherein the phenol resin contains a skeleton represented by a following formula (I);
(In the formula, n represents an integer.)
4. The adhesive film for underfill according to claim 1, wherein the epoxy resin is a bisphenol A epoxy resin or a bisphenol F epoxy resin.
5. The adhesive film for underfill according to claim 1, wherein a content of the elastomer in the resin components is 10 to 40% by weight.
6. The adhesive film for underfill according to claim 1, wherein the elastomer is an acrylic resin.
7. The adhesive film for underfill according to claim 1, wherein a temperature exists at which a viscosity becomes 20,000 Pa\xb7s or less when the viscosity is measured at 40 to 100\xb0 C.;
wherein a minimum viscosity at 100 to 200\xb0 C. is 100 Pa\xb7s or more.
8. The adhesive film for underfill according to claim 1, further comprising an inorganic filler at 30 to 70% by weight.
9. An adhesive film for underfill integrated with a tape for grinding a rear surface, comprising:
the adhesive film for underfill according to claim 1; and
the tape for grinding the rear surface;
wherein the adhesive film for underfill is provided on the tape for grinding the rear surface.
10. An adhesive film for underfill integrated with a dicing tape, comprising:
the adhesive film for underfill according to claim 1; and
the dicing tape;
wherein the adhesive film for underfill is provided on the dicing tape.
11. A semiconductor device manufactured by using the adhesive film for underfill according to claim 1.
12. A semiconductor device manufactured by using the adhesive film for underfill integrated with the tape for grinding the rear surface according to claim 9.
13. A semiconductor device manufactured by using the adhesive film for underfill integrated with the dicing tape according to claim 10.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A crystalline form of trans-1{4-2-4-(2,3-dichlorophenyl)-piperazin-1-yl-ethyl-cyclohexyl}-3,3-dimethyl-urea hydrochloride (Form III) having a X-ray powder diffraction pattern comprising characteristic peaks at about 4.1, about 12.3, about 16.5, and about 17.4\xb10.2 degrees 2\u03b8.
2. The crystalline form of claim 1, having an X-ray powder diffraction pattern substantially as shown in FIG. 5.
3. The crystalline form of claim 1, having a melting endotherm at about 260\xb0 C. as determined by DSC.
4. A process for preparing the crystalline form of claim 1, comprising:
(i) adding trans-1{4-2-4-(2,3-dichlorophenyl)-piperazin-1-yl-ethyl-cyclohexyl}-3,3-dimethyl-urea hydrochloride to pyridine; and
(ii) precipitating the crystalline form from the solution.
5. The process of claim 4, wherein the mixture in step (i) is heated to a temperature of about 30\xb0 C. to about 50\xb0 C.
6. The process of claim 4, wherein step (i) comprises forming a saturated solution.
7. The process of claim 4, further comprising (iii) recovering the crystalline form.
8. The process of claim 7, wherein step (iii) comprises (a) filtering the precipitate formed in step (ii) and (b) drying the crystalline form.
9. A formic acid solvate of trans-1{4-2-4-(2,3-dichlorophenyl)-piperazin-1-yl-ethyl-cyclohexyl}-3,3-dimethyl-urea hydrochloride.
10. The formic acid solvate of claim 9, having a X-ray powder diffraction pattern comprising characteristic peaks at about 3.8, about 7.4, about 18.3, about 24.2, and about 29.3\xb10.2 degrees 2\u03b8.
11. The formic acid solvate of claim 9, having an X-ray powder diffraction pattern substantially as shown in FIG. 9.
12. A process for preparing a formic acid solvate of trans-1{4-2-4-(2,3-dichlorophenyl)-piperazin-1-yl-ethyl-cyclohexyl}-3,3-dimethyl-urea hydrochloride comprising:
(i) mixing trans-1{4-2-4-(2,3-dichlorophenyl)-piperazin-1-yl-ethyl-cyclohexyl}-3,3-dimethyl-urea hydrochloride with formic acid to form a solvate, and
(ii) precipitating the solvate formed in step (i).
13. The process of claim 12, wherein step (i) comprises formation of a slurry.
14. The process of claim 12, further comprising (iii) recovering the formic acid solvate.
15. The process of claim 14, wherein step (iii) comprises (a) filtering the precipitate formed in step (ii) and (b) drying the formic acid solvate.
16. A pharmaceutical composition comprising the crystalline form of claim 1.
17. A pharmaceutical composition comprising the formic acid solvate of claim 9.
18. A method for treating andor preventing a condition which requires modulation of dopamine receptor(s) comprising administering to a patient in need thereof, an effective amount of the crystalline form of claim 1.
19. A method for treating andor preventing a condition which requires modulation of dopamine receptor(s) comprising administering to a patient in need thereof, an effective amount of the solvate of claim 9.
20. The method of claim 18, wherein the dopamine receptor is a dopamine D3 receptor andor a dopamine D2 receptor.
21. The method of claim 18, wherein the condition is selected from schizophrenia, schizo-affective disorders, cognitive impairment accompanying schizophrenia, mild-to-moderate cognitive deficits, dementia, psychotic states associated with dementia, psychotic depression, mania, acute mania, bipolar disorder, paranoid and delusional disorders, dyskinetic disorders such as Parkinson’s disease, neuroleptic induced parkinsonism, depression, anxiety, and drug abuse.
22. The method of claim 21, where in the condition is schizophrenia.
23. The method of claim 21, where in the condition is acute mania.
24. The method of claim 19, wherein the dopamine receptor is a dopamine D3 receptor andor a dopamine D2 receptor.
25. The method of claim 19, wherein the condition is selected from schizophrenia, schizo-affective disorders, cognitive impairment accompanying schizophrenia, mild-to-moderate cognitive deficits, dementia, psychotic states associated with dementia, psychotic depression, mania, acute mania, bipolar disorder, paranoid and delusional disorders, dyskinetic disorders such as Parkinson’s disease, neuroleptic induced parkinsonism, depression, anxiety, and drug abuse.
26. The method of claim 25, where in the condition is schizophrenia.
27. The method of claim 25, where in the condition is acute mania.
28-37. (canceled)