1. A semiconductor workpiece comprising:
a main body having a device side and a back side and a thickness less than approximately 150 microns, the device side of the main body being free from a protective tape or polymer;
the main body having devices selected from the group consisting of microelectronic circuits, data storage elements or layers and micro-mechanical elements formed on the device side but not on the back side; and
a rim connected to the main body and having a thickness in a range of approximately 150 to 725 microns, the rim extending outwardly from the periphery of the back side of the workpiece but not the device side of the workpiece.
2. The semiconductor workpiece of claim 1, wherein the main body thickness is less than 100 microns.
3. The semiconductor workpiece of claim 1, wherein the main body thickness is less than 50 microns.
4. The semiconductor workpiece of claim 1, wherein the main body thickness is less than 25 microns.
5. The semiconductor workpiece of claim 1, wherein the rim and the main body are integral.
6. The semiconductor workpiece of claim 1, wherein the rim and the main body are comprised of silicon.
7. The semiconductor workpiece of claim 1, wherein the rim has a thickness in a range of approximately 600-725 microns.
8. The semiconductor workpiece of claim 1, wherein the rim has a thickness in a range of approximately 300-725 microns.
9. A semiconductor workpiece having a device side and a back side with a back side surface area, BSSA, the semiconductor workpiece comprising:
a rim comprising less than approximately 5% of the BSSA and having a thickness, RT; the rim extending outwardly from the back side of the workpiece but not the device side of the workpiece and
a main body having microelectronic devices formed on the device side only and a thickness, MBT, less than approximately 50% of RT, the main body being free of a protective tape or polymer.
10. The semiconductor workpiece of claim 9, wherein the rim comprises less than approximately 3% of the BSSA.
11. The semiconductor workpiece of claim 9, wherein the rim comprises less than approximately 1% of the BSSA.
12. The semiconductor workpiece of claim 9, wherein the MBT is less than approximately 40% of the RT.
13. The semiconductor workpiece of claim 9, wherein the MBT is less than approximately 30% of the RT.
14. The semiconductor workpiece of claim 9, wherein the MBT is less than approximately 20% of the RT.
15. The semiconductor workpiece of claim 9, wherein the MBT is less than approximately 10% of the RT.
16. The semiconductor workpiece of claim 9, wherein the MBT is less than approximately 5% of the RT.
17. The semiconductor workpiece of claim 9, wherein the rim imparts structural integrity to the main body.
18. A semiconductor workpiece having a device side surface and a back side surface, the back side surface having a surface area, BSSA, the semiconductor workpiece comprising:
a main body comprising at least 95% of the BSSA;
the back side surface of the main body consisting essentially of a semiconductive material;
a rim connected to the main body and comprising less than approximately 5% of the BSSA, having a thickness RT, and formed from the same material as the main body, the rim extending outwardly from the periphery of the back side surface of the workpiece but not the device side surface of the workpiece; and
the main body having a thickness less than approximately 50% of the RT and being free from a protective polymer or tape.
19. The semiconductor workpiece of claim 18, wherein the same material is silicon.
20. The semiconductor workpiece of claim 18, wherein the main body has a thickness less than approximately 40% of the RT.
21. The semiconductor workpiece of claim 18, wherein the main body has a thickness less than approximately 30% of the RT.
22. The semiconductor workpiece of claim 18, wherein the main body has a thickness less than approximately 20% of the RT.
23. The semiconductor workpiece of claim 18, wherein the main body has a thickness less than approximately 10% of the RT.
24. A semiconductor workpiece comprising:
a main body having first and second opposing sides and a thickness less than approximately 100 microns;
a rim connected to the main body and having a thickness in a range of about 300 to 725 microns, the rim extending outwardly from the periphery of the first side of the workpiece but not the second side of the workpiece; and
microelectronic devices formed on the second side of the device but not on the first side of the device, the microelectronic devices being free from a protective polymer or tape.
25. The semiconductor workpiece of claim 24, wherein the first and second sides of the main body are free from a protective film or tape.
26. The semiconductor workpiece of claim 25, wherein the main body has a thickness less than approximately 50 microns.
27. The semiconductor workpiece of claim 25, wherein the main body has a thickness less than approximately 25 microns.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for maintaining linear beamforming weights of a communications channel, comprising:
expanding matrix channel estimates and whitening matrix filter estimates over time and frequency, using an interpolator; and
modeling selected emitter channels using the expanded matrix channel estimates and the whitening matrix filter estimates for linear weight computation, wherein unmodeled interference is treated as white noise, and wherein the linear beamforming weights are maintained as a function of time or frequency.
2. The method of claim 1, further comprising interpolating time varying channels from one time block to a next time block using one or more interpolation techniques.
3. The method of claim 2, wherein the interpolation is accomplished by parameterizing channel matrices and interference matrices using a continuous time offset and sampling the channels at discrete times.
4. The method of claim 2, wherein the one or more interpolation techniques include one or more of linear interpolation, log linear interpolation, linear interpolation of the logarithm of channel quantities, polynomial interpolation, log polynomial interpolation, spline interpolation, or log spline interpolation.
5. The method of claim 1, wherein expanding matrix channel estimates includes using a state space model-based interpolator in time or frequency domain to interpolate the channels.
6. The method of claim 1, wherein expanding matrix channel estimates includes using a filter-based interpolator in time or frequency domain to interpolate the channels.
7. The method of claim 1, wherein expanding matrix channel estimates includes using whitening matrix filters to maintain linear beamforming weights as a function of time or frequency.
8. The method of claim 1, wherein the linear weight computation models the selected emitter channels which are identified as relatively important in terms of their contribution in beamforming, while treating unmodeled interference as white noise.
9. The method of claim 8, wherein the linear weight computation models either interference processes or entire data processes using inverse modeling.
10. The method of claim 8, wherein the linear weight computation models either interference processes or entire data processes using direct modeling with standard system identification procedures.
11. The method of claim 1, further comprising facilitating stacked carrier processing using a deinterleaver that forms vectors in stacks and clusters vectors of adjacent frequencies.
12. The method of claim 1, further comprising using subcarrier permutations in repetition codes.
13. A wireless communications system for maintaining linear beamforming weights of a communications channel, comprising:
a channel estimation component configured to generate matrix channel estimates and whitening matrix filter estimates;
a modeling component configured to:
expand the matrix channel estimates and whitening matrix filter estimates over time and frequency; and
model selected emitter channels using the expanded matrix channel estimates and the whitening matrix filter estimates for linear weight computation, wherein unmodeled interference is treated as white noise, and wherein the linear beamforming weights are maintained as a function of time or frequency.
14. The wireless communications system of claim 13, further comprising an interpolator configured to interpolate time varying channels from one time block to a next time block using one or more interpolation techniques.
15. The wireless communications system of claim 14, wherein the interpolation is accomplished by parameterizing channel and interference matrices using a continuous time offset and sampling the channels at discrete times.
16. The wireless communications system of claim 13, further comprising a state space model-based interpolator in time domain or frequency domain to interpolate the channels.
17. The wireless communications system of claim 13, further comprising a filter-based interpolator in time domain or frequency domain to interpolate the channels.
18. The wireless communications system of claim 13, further comprising whitening matrix filters to maintain linear beamforming weights as a function of time or frequency.
19. The wireless communications system of claim 13, wherein the linear weight computation models the selected emitter channels which are identified as relatively important in terms of their contribution in beamforming, while treating unmodeled interference as white noise.
20. The wireless communications system of claim 19, wherein the linear weight computation models either interference processes or entire data processes using inverse modeling.
21. The wireless communications system of claim 19, wherein the linear weight computation models either interference processes or entire data processes using direct modeling with standard system identification procedures.
22. The wireless communications system of claim 13, further comprising a deinterleaver configured to facilitate stacked carrier processing by forming vectors in stacks and clustering vectors of adjacent frequencies.