1. A system for providing remote control of data directory structures across at least one communications network, comprising:
a computer server, the computer server coupled to the communications network;
a remote data directory structure management computing application, the remote data directory structure management computing application operating on the computer server to process received requests for remote data directory management of desired data residing in directory structures by participating users; and
a profile data store comprising information relating to the data and data directory structures accessible to each of the participating users, wherein the profile data store is queried for the data directory structures accessible to each of the participating users, wherein further a single directory structure from among a plurality of the data directory structures associated with the profile data store is selected by each of the participating users for modification.
2. The system as recited in claim 1, further comprising at least one client computing device, the client computing device operably coupled to the communications network to transmit and receive data.
3. The system as recited in claim 2, wherein the client computing device comprises a wireless computing device.
4. The system as recited in claim 3, wherein the wireless computing device comprises any of:
a mobile telephone, a pager, a wireless access protocol (WAP) device, a wireless personal digital assistant (PDA), a pocket-PC, and a wirelessly enable personal computer.
5. The system of claim 1 wherein the remote data directory structure management computing application comprises a computing application processing and storage area and a computing application display area.
6. The system as recited in claim 5, wherein the communications network comprises a combination of any of: a wireless LAN, a fixed wire LAN, a wireless WAN, a fixed wire WAN, a wireless intranet, a fixed wire intranet, a wireless extranet, a fixed wire extranet, a wireless peer-to-peer network, a fixed wire peer-to-peer network, a central office, a public switch telephone network (PSTN), a voice provider communications network, the Internet, and the wireless Internet.
7. The system as recited in claim 1, wherein the communications network comprises any of: a wireless LAN, a fixed wire LAN, a wireless WAN, a fixed wire WAN, a wireless intranet, a fixed wire intranet, a wireless extranet, a fixed wire extranet, a wireless peer-to-peer network, a fixed wire peer-to-peer network, a central office, a public switch telephone network (PSTN), a voice provider communications network, the Internet, and the wireless Internet.
8. The system as recited in claim 1, wherein the computer server comprises a Web server.
9. The system as recited in claim 1, further comprising at least one data store, the data store housing data used to realize remote access and management.
10. The system as recited in claim 9, wherein the at least one data store comprises any of: a user ID data store, a data files data store, and the profile data store.
11. The system as recited in claim 10, wherein the at least one data store comprises a combination of any of: the user ID data store, the data files data store, and the profile data store.
12. The system as recited in claim 1, wherein delivering the user requested data and sending a confirmation of the delivery is accomplished via e-mail.
13. A method for providing remote data directory structure management across at least one communications network comprising:
receiving at least one request by a computing application operating on a computer server over the communications network for remote management control of data directory structures from participating users offered through a computing device coupled to the communications network;
processing the request to provide the remote management control over the data directory structures by providing data directory structure information if deemed accessible from data stored in a profile store relating to the data and data directory structures accessible to each of the participating users, the profile data store being queried for the data directory structures accessible to each of the participating users, wherein a single directory structure from among a plurality of the data directory structures associated with the profile data store is selected by each of the participating users for modification;
delivering desired data and the remote management control over the desired data to identified delivery targets by the computing application over the communications network;
generating at least one notification of the delivery of the desired data to the identified delivery targets upon the delivery of the desired data to the identified delivery targets;
determining if user requested data is accessible based on the information in the profile data store; and
delivering the user requested data and sending a confirmation of the delivery.
14. The method as recited in claim 13, wherein delivering the user requested data and sending a confirmation of the delivery is accomplished via e-mail.
15. The method as recited in claim 13, wherein the profile data store provides an e-mail address.
16. The system of claim 1, wherein the remote data directory structure management computing application determines if user requested data is accessible based on the information in the profile data store and, if so, delivering the user requested data and sending a confirmation of the delivery.
17. A computer readable medium having computer executable instructions to perform the steps recited in claim 13.
18. A system providing remote management of data directory structures across at least one communications network comprising:
at least one computer server, the computer server operably coupled to the communications network;
at least one client computing device, the client computing device operably coupled to the communications network;
a computing application, the computing application having processing rules to process requests for remote management of data directory structures, the requests originating from the at least one client computing device and comprising a request for desired data found in a corresponding data directory structure, wherein the computing application provides control over data directory structures to participating users; and
a profile data store comprising information relating to the data and data directory structures accessible to each of the participating users, wherein the profile data store is queried for the data directory structures accessible to each of the participating users, wherein a single directory structure from among a plurality of the data directory structures associated with the profile data store is selected by each of the participating users for modification, the computing application determining if user requested data is accessible based on the information in the profile data store and, if so, delivering the user requested data and sending a confirmation of the delivery.
19. The system as recited in claim 18, wherein the communications network comprises a combination of any of: a wireless LAN, a fixed wire LAN, a wireless WAN, a fixed wire WAN, a wireless intranet, a fixed wire intranet, a wireless extranet, a fixed wire extranet, a wireless peer-to-peer network, a fixed wire peer-to-peer network, a central office, a public switch telephone network (PSTN), a voice provider communications network, the Internet, and the wireless Internet.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of manufacturing an electrodeposited copper foil combined with a carrier foil, the combination having high-temperature heat resistance, comprising the steps of:
(1) forming an organic adhesive interface layer on a surface of a carrier foil by immersing said carrier foil into an acid pickling solution containing 50 ppm to 2000 ppm organic agent to pickle, the metal on the surface of the carrier foil and create metal ions in the acid pickling solution, wherein said metal ions react with said organic agent to create a metal complex which precipitates and adsorbs to the carrier foil to form the organic adhesive interface layer; and thereafter
(2) electrodepositing a copper foil layer onto said organic adhesive interface layer.
2. The method of claim 1 wherein said electrodeposited copper foil combined with the carrier foil is heat resistant at a temperature between 230\xb0 C. and 300\xb0 C.
3. A method of manufacturing an electrodeposited copper foil in combination with a carrier foil, the combination having high-temperature resistance, comprising the steps of:
(1) forming an organic adhesive interface layer on a surface of a carrier foil by immersing said carrier foil into an acid pickling solution containing 50 ppm to 2000 ppm organic agent to pickle, the metal on the surface of the carrier foil and create metal ions in the acid solution, wherein said metal ions react with said organic agent in said acid pickling solution to create a metal complex which precipitates and adsorbs to the carrier foil to form the organic adhesive interface layer; and thereafter
(2) electrodepositing a copper foil layer onto said organic adhesive interface layer.
4. The method of claim 3 wherein said electrodeposited copper foil in combination with the carrier foil is heat resistant at a temperature between 230\xb0 C. and 300\xb0 C.
5. A method of manufacturing an electrodeposited copper foil in combination with a carrier foil, the combination having high-temperature heat-resistance, comprising the steps of:
(1) forming a first organic adhesive interface layer on a surface of a carrier foil by immersing said carrier foil into an acid pickling solution containing 50 ppm to 2000 ppm of a first organic agent to pickle the metal on the surface of the carrier foil and create metal ions in the acid pickling solution, wherein said metal ions react with said first organic agent in the acid pickling solution, forming a complex which precipitates and adsorbs to the carrier foil;
(2) forming a second organic adhesive interface layer in contact with the first organic adhesive interface layer by immersing the carrier foil in an aqueous solution containing a second organic agent whereby said second organic agent adsorbs onto the first organic adhesive interface layer; and
(3) electrodepositing a copper foil layer onto the second organic adhesive interface layer.
6. The method of claim 5 wherein said electrodeposited copper foil in combination with the carrier foil is heat resistant at a temperature between 230\xb0 C. and 300\xb0 C.
7. A method of manufacturing an electrodeposited copper foil in combination with a carrier foil having high-temperature resistance, comprising the steps of:
(1) forming an organic adhesive interface layer on a surface of a carrier foil by immersing said carrier foil into an acid pickling solution containing 50 ppm to 2000 ppm organic agent, to pickle the metal on the surface of the carrier foil and create metal ions in the acid pickling solution, wherein said metal ions react with the organic agent in the acid pickling solution to create a metal complex which precipitates and adsorbs to the carrier foil;
(2) immersing the carrier foil into a second solution containing a dissimilar metal selected from the group consisting of nickel, nickel alloys, cobalt, and cobalt alloys;
(3) passing a current through said second solution to cause the dissimilar metal to adhere to the organic adhesive interface layer to create a dissimilar metal layer having a thickness of 0.001 \u03bcm to 0.05 \u03bcm; and
(4) electrodepositing a copper foil layer onto said dissimilar metal layer.
8. The method of claim 7 wherein said electrodeposited copper foil in combination with the carrier foil is heat resistant at a temperature between 230\xb0 C. and 300\xb0 C.
9. A method of manufacturing an electrodeposited copper foil in combination with a carrier foil, the combination having high-temperature resistance, comprising the steps of:
(1) forming a first organic adhesive interface layer on a surface of a carrier foil by immersing said carrier foil into an acid pickling solution containing 50 ppm to 2000 ppm of a first organic agent to pickle the metal on the surface of the carrier foil and create metal ions in the acid solution, wherein said metal ions react with said first organic agent in the acid pickling solution to create a metal complex which precipitates and adsorbs to the carrier foil;
(2) forming a second organic adhesive interface layer in contact with the first organic adhesive interface layer by immersing the carrier foil in an aqueous solution containing a second organic agent thereby adsorbing said second organic agent onto the first organic adhesive interface layer;
(3) immersing the carrier foil into a second solution containing a dissimilar metal selected from the group consisting of nickel, nickel alloys, cobalt, and cobalt alloys;
(4) passing a current through said second solution to cause the dissimilar metal to adhere to the second organic adhesive interface layer to create a dissimilar metal layer having a thickness of 0.001 \u03bcm to 0.05 \u03bcm; and
(5) electrodepositing a copper foil layer onto the dissimilar metal layer.
10. The method of claim 9 wherein said electrodeposited copper foil in combination with the carrier foil is heat resistant at a temperature between 230\xb0 C. and 300\xb0 C.
11. An electrodeposited copper foil in combination with a carrier foil exhibiting high-temperature heat-resistance, wherein the copper foil in combination with a carrier foil is obtained by the method of claim 1.
12. An electrodeposited copper foil in combination with a carrier foil exhibiting high-temperature heat-resistance, wherein the electrodeposited copper foil and the carrier foil is obtained by the method of claim 3.
13. An electrodeposited copper foil in combination with carrier foil exhibiting high-temperature heat-resistance, wherein the electrodeposited copper foil and the carrier foil is obtained by the method of claim 5.
14. An electrodeposited copper foil in combination with carrier foil exhibiting high-temperature heat-resistance, wherein the electrodeposited copper foil and the carrier foil is obtained by the method of claim 7.
15. An electrodeposited copper foil in combination with a carrier foil array exhibiting high-temperature heat-resistance obtained by the method of claim 9.