1. An integrated circuit comprising:
programmable non-volatile memory that stores sets of operating conditions of the integrated circuit under specific environmental conditions;
an access circuit that accesses and reads one of the stored sets of operating conditions that corresponds to one or more environmental conditions of a system in which the integrated circuit is being used; and
a control circuit that sends control signals to alter the operation of specific elements of the system to support the set of read operating conditions.
2. The integrated circuit of claim 1 further comprising:
a unique identifier having a value that matches at least one element of one of the stored sets of operating conditions.
3. The integrated circuit of claim 2 wherein the access circuit uses the unique identifier to access the matching stored set of operating conditions.
4. The integrated circuit of claim 3 wherein the operating conditions includes frequency, voltage, and thermal dissipation requirement.
5. The integrated circuit of claim 4 wherein the value of the unique identifier matches the frequency of one of the stored sets of operating conditions.
6. The integrated circuit of claim 5 wherein the control circuit alters the supplied voltage to the integrated circuit to match the voltage specified in the matching set of operating conditions.
7. The integrated circuit of claim 5 wherein the control circuit alters a heat dissipation element of the system to match the heat dissipation specified in the matching set of operating conditions.
8. The integrated circuit of claim 1 wherein the operating conditions includes frequency, voltage, and thermal dissipation requirement.
9. The integrated circuit of claim 8 wherein the control circuit alters the supplied voltage to the integrated circuit to match the voltage specified in the matching set of operating conditions.
10. The integrated circuit of claim 9 wherein the control circuit alters a heat dissipation element of the system to match the beat dissipation specified in the matching set of operating conditions.
11. A method of automatically adjusting the environmental settings of a system to support the operating conditions of an embedded integrated circuit having memory, the method comprising the steps of:
storing sets of operating conditions of the integrated circuit under specific environmental conditions in the memory;
reading one of the stored sets of operating conditions that corresponds to one or more environmental conditions of the system; and
altering the operation of specific elements of the system to support the set of read operating conditions.
12. The method of claim 11 further comprising the steps of:
storing a unique identifier in the integrated circuit that matches at least one element of one of the stored sets of operating conditions;
13. The integrated circuit of claim 12 wherein the step of reading one of the stored sets of operating conditions includes the step of:
reading one of the stored sets of operating conditions that matches the unique identifier.
14. The method of claim 13 wherein the operating conditions includes frequency, voltage, and thermal dissipation requirement.
15. The method of claim 14 wherein the value of the unique identifier matches the frequency of one of the stored sets of operating conditions.
16. The method of claim 15 wherein the step of altering the operation of specific elements of the system includes the step of:
altering a voltage level that is supplied to the integrated circuit to match the voltage specified in the matching set of operating conditions.
17. The method of claim 16 wherein the step of altering the operation of specific elements of the system includes the step of:
altering a heat dissipation element of the system to match the heat dissipation specified in the matching set of operating conditions.
18. The method of claim 11 wherein the operating conditions includes frequency, voltage, and thermal dissipation requirement.
19. The method of claim 18 wherein the step of altering the operation of specific elements of the system includes the step of:
altering a voltage level supplied to the integrated circuit to match the voltage specified in the matching set of operating conditions.
20. The method of claim 19 wherein the step of altering the operation of specific elements of the system includes the step of:
altering a heat dissipation element of the system to match the heat dissipation specified in the matching set of operating conditions
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A bubble wand comprising:
a shaft;
a plurality of first bubble rings attached to the shaft;
a plurality of second bubble rings attached to the shaft; and
wherein the first bubble rings have a different shape and size than the second bubble rings.
2. The wand of claim 1, wherein each bubble ring has a thickness and a generally cylindrical configuration.
3. The wand of claim 1, each bubble ring has a diameter that is greater than one inch.
4. The wand of claim 1, wherein each bubble ring has a body with ridges provided thereon.
5. A bubble wand comprising:
a shaft; and
at least six separate bubble rings attached to the shaft.
6. The wand of claim 5, wherein the at least six bubble rings comprises at least seven bubble rings.
7. The wand of claim 5, wherein the at least six bubble rings comprises at least eight bubble rings.
8. The wand of claim 5, wherein the bubble rings include:
a plurality of first bubble rings attached to the shaft;
a plurality of second bubble rings attached to the shaft; and
wherein the first bubble rings have a different shape and size than the second bubble rings.
9. The wand of claim 5, wherein each bubble ring has a thickness and a generally cylindrical configuration.
10. The wand of claim 5, each bubble ring has a diameter that is greater than one inch.
11. The wand of claim 5, wherein each bubble ring has a body with ridges provided thereon.
12. A bubble toy comprising:
a container having an interior and a mouth;
a cap removably coupled to the mouth; and
a bubble wand retained inside the interior of the container, the wand comprising:
a shaft; and
at least six separate bubble rings attached to the shaft.
13. The bubble toy of claim 12, wherein the shaft has one end that is attached to the cap.
14. The bubble toy of claim 12, wherein the bubble rings include:
a plurality of first bubble rings attached to the shaft;
a plurality of second bubble rings attached to the shaft; and
wherein the first bubble rings have a different shape and size than the second bubble rings.
15. The bubble toy of claim 12, wherein each bubble ring has a thickness and a generally cylindrical configuration.
16. The bubble toy of claim 12, each bubble ring has a diameter that is greater than one inch.
17. The bubble toy of claim 12, wherein each bubble ring has a body with ridges provided thereon.
18. The bubble toy of claim 12, wherein the cap has a flat gripping surface.
19. The bubble toy of claim 12, wherein the at least six bubble rings comprises at least seven bubble rings.
20. The bubble toy of claim 12, wherein the at least six bubble rings comprises at least eight bubble rings.