1. An electronic device, comprising:
a memory driver unit configured to read partition headers having encrypted version numbers from a memory and configured to write an updated encrypted version numbers to the memory;
an update agent unit configured to control a software or firmware update of the electronic device;
a one-time programmable memory configured to store a first value; and
an encrypt-decrypt unit configured to decrypt the partition headers stored in the memory based on the first value stored in the one-time programmable memory, the encrypt-decrypt unit configured to retrieve version numbers from the partition headers;
wherein the update agent unit is configured to compare the retrieved version numbers with version numbers from a software or firmware update to determine whether the version numbers of the software or firmware update are larger than the retrieved version numbers,
wherein the first value is incremented and stored in the one-time programmable memory if an update is performed; wherein the encrypt-decrypt unit is configured to encrypt the version numbers of the software or firmware update based on the new first value; and
wherein the memory driver unit is configured to write new partition headers with updated encrypted version numbers into the memory.
2. The electronic device according to claim 1, wherein the software or firmware of the electronic comprises at least two components, wherein each component can have its own version number, and wherein each component can be updated separately.
3. The electronic device according to claim 1, wherein the update of the first value can be deactivated.
4. A method, comprising:
updating software or firmware of an electronic device, the updating performed by the electronic device and including:
reading a partition header including an encrypted version number from a memory; controlling a software or firmware update of the electronic device;
storing a first value in a one-time programmable memory;
decrypting the partition header stored in the memory based on the first value stored in the one-time programmable memory, the decrypting to retrieve the encrypted version number of the partition header;
comparing the retrieved version number with a version number of a software or firmware update in order to determine whether the version number of the software or firmware update is larger than the retrieved version number;
incrementing and storing the first value in the one-time programmable memory if an update is performed;
encrypting the version number of the software or firmware update based on the new first value; and
writing a new partition header with the updated encrypted version number into the memory.
5. The method according to claim 4, wherein the updating comprises:
reading a second partition header including a second encrypted version number from the memory;
decrypting the second partition header based on the first value, the decrypting to retrieve the second encrypted version number;
comparing the retrieved second version number with a second version number of the software or firmware update in order to determine whether the second version number of the software or firmware update is larger than the retrieved second version number,
encrypting the second version number of the software or firmware update based on the new first value,
writing a new second partition header with the updated encrypted second version number into the memory.
6. The method according to claim 4, wherein the updating includes:
encrypting a second version number based on the new first value if the software or firmware update does not direct an update to a second partition;
writing a new second partition header with the encrypted second version number into the memory.
7. The method according to claim 4, wherein the updating includes:
creating a dependency tree to map multiple software or firmware updates.
8. The method according to claim 4, wherein the updating includes:
encrypting the incremented first value together with the version number of the software or firmware update.
9. An electronic device, comprising:
a memory having a first partition and a second partition, the first and second partitions configured to store first and second components respectively, the first and second partitions having first and second partition headers respectively, and the first and second partition header having encrypted first and second version numbers respectively, the first and second version numbers corresponding to the first and second stored components;
a one-time programmable memory configured to store a first value;
a memory driver unit configured to read the first partition header from the memory and write an updated first partition header to the memory, the updated first partition header having an updated encrypted version number;
an encrypt-decrypt unit configured to retrieve the first version number of the first partition header by decrypting the first partition header based on the first value, the encrypt-decrypt unit configured to create an updated first partition header by encrypting an updated first version number corresponding to an updated first component based on an updated first value; and
an update agent unit configured to compare the retrieved first version number with the updated first version number to determine whether the updated first version number represents that the updated first component is a later version of the stored first component, and, if the updated first component is a later version of the stored first component, the update agent unit is configured to generate the updated first value and direct storage of the updated first value in the one-time programmable memory.
10. The electronic device according to claim 9, wherein the memory driver unit, the encrypt-decrypt unit, and the update agent unit are configured to store an updated second component.
11. The electronic device according to claim 10, wherein the memory driver unit, the encrypt-decrypt unit, and the update agent unit are configured to store an updated second partition header even if the stored second component is not updated.
12. The electronic device according to claim 9, wherein the updated first value represents the first value having one additional bit asserted.
13. The electronic device according to claim 9, wherein the updated first value represents the first value incremented by one.
14. The electronic device according to claim 9, wherein the encrypt-decrypt unit is configured to retrieve first data when the first partition header is decrypted.
15. The electronic device according to claim 14, wherein the first data represents a public key.
16. The electronic device according to claim 9, wherein the encrypt-decrypt unit is configured to retrieve a copy of the first value when the first partition header is decrypted and wherein the update agent unit is configured to compare the first value with the copy of the first value.
17. The electronic device according to claim 16, wherein the update agent unit is configured to direct a reboot of the electronic device if the first value is not the same as the copy of the first value.
18. The electronic device according to claim 9, wherein, during boot of the electronic device, the memory driver unit is configured to retrieve an unencrypted copy of the first version number, the encrypt-decrypt unit is configured to retrieve the first version number, and the update agent unit is configured to take an action if the copy of the first version number is different than the first version number.
19. The electronic device according to claim 9, wherein the memory driver unit, the encrypt-decrypt unit, and the update agent unit are parts of a set top box.
20. The electronic device according to claim 9, wherein the memory driver unit, the encrypt-decrypt unit, and the update agent unit are parts of a mobile device.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A light emitting element mounting frame, having a silver alloy layer formed on at least a portion of its surface.
2. The light emitting element mounting frame according to claim 1, wherein
said Ag alloy is any of Ag\u2014Nd alloy, Ag\u2014Nd\u2014Cu alloy, Ag\u2014Pd alloy, Ag\u2014Pd\u2014Cu alloy, Ag\u2014Bi alloy and Ag\u2014Nd\u2014Au alloy.
3. The light emitting element mounting frame according to claim 1, wherein said Ag alloy layer is formed by any of vapor deposition, resistance heating and plating.
4. The light emitting element mounting frame according to claim 1, wherein
said frame is a lead frame including a cup portion positioned to surround said light emitting element, and the Ag alloy layer is formed on at least a portion of the lead frame.
5. The light emitting element mounting frame according to claim 4, wherein
said Ag alloy layer is formed on an inner side of said cup portion facing the light emitting element.
6. The light emitting element mounting frame according to claim 4, wherein
said Ag alloy layer is formed on a side surface of said cup portion.
7. The light emitting element mounting frame according to claim 4, wherein
said Ag alloy layer is formed on a bottom of said cup portion.
8. The light emitting element mounting frame according to claim 4, wherein
said Ag alloy layer is formed on a portion where said lead frame contacts resin.
9. The light emitting element mounting frame according to claim 4, wherein
said Ag alloy layer is formed on a region to be wire-bonded of said lead frame.
10. The light emitting element mounting frame according to claim 1, wherein
said frame is a surface-mounting type frame including a portion where said light emitting element is mounted, an electrode terminal and a cup portion positioned to surround said light emitting element, and an Ag alloy layer is formed at any of the portion where said light emitting element is mounted, the electrode terminal and the cup portion positioned to surround said light emitting element.
11. The light emitting element mounting frame according to claim 10, wherein
said Ag alloy layer is formed on an inner side of said cup portion facing the light emitting element.
12. The light emitting element mounting frame according to claim 10, wherein
said Ag alloy layer is formed on a portion in contact with resin of said cup portion.
13. The light emitting element mounting frame according to claim 10, wherein
said Ag alloy layer is formed on a portion in contact with a phosphor of said cup portion.
14. The light emitting element mounting frame according to claim 10, wherein
said Ag alloy layer is formed on a region to be wire-bonded to said electrode terminal.
15. A light emitting device, using a frame having a silver alloy layer formed on at least a portion of its surface, for mounting a light emitting element, wherein
a conductive adhesive used for fixing said light emitting element to said frame contains Ag as a main component and additionally contains at least Nd.
16. The light emitting device according to claim 15, wherein
said light emitting element is a light emitting diode of infra-red to ultra-violet.
17. The light emitting device according to claim 15, wherein
said light emitting element is any of three chips of red, green and blue LEDs, one chip 6f blue LED, and one chip of ultra-violet LED.
18. A light emitting device, using a frame having a silver alloy layer formed on at least a portion of its surface, for mounting a light emitting element, wherein
a conductive adhesive used for fixing said light emitting element is Ag paste having an Ag alloy layer formed on paste surface.
19. The light emitting device according to claim 18, wherein said light emitting element is a light emitting diode of infra-red to ultra-violet.
20. The light emitting device according to claim 18, wherein
said light emitting element is any of three chips of red, green and blue LEDs, one chip of blue LED, and one chip of ultra-violet LED.
21. A light emitting device, using a frame having a silver alloy layer formed on at least a portion of its surface, for mounting a light emitting element, wherein
said light emitting element includes at least one wire per one surface.
22. The light emitting device according to claim 21, wherein said light emitting element is a light emitting diode of infra-red to ultra-violet.
23. The light emitting device according to claim 21, wherein
said light emitting element is any of three chips of red, green and blue LEDs, one chip of blue LED, and one chip of ultra-violet LED.