1. A light-source circuit unit comprising:
a circuit substrate that has a light-reflective wiring pattern on a surface thereof and includes a chip mounting layer as a part of the wiring pattern; and
one or more light-emitting element chips that are directly placed on the chip mounting layer, and are driven by a current flowing through the wiring pattern.
2. The light-source circuit unit according to claim 1, further comprising a sealing lens on the circuit substrate, the sealing lens covering the light-emitting element chip and the periphery thereof.
3. The light-source circuit unit according to claim 1, wherein the light-emitting element chip is configured of a light-emitting diode.
4. The light-source circuit unit according to claim 1, wherein
the light-emitting element chip has a pair of electrodes on one side, and
the wiring pattern includes first and second wiring layers that electrically connect the chip mounting layer to the respective two electrodes of the light-emitting element chip.
5. The light-source circuit unit according to claim 1, wherein
the light-emitting element chip has first and second electrodes on respective two sides thereof, and
the wiring pattern includes a first wiring layer that serves as the chip mounting layer and is electrically connected with the first electrode of the light-emitting element chip, and a second wiring layer electrically connected with the second electrode of the light-emitting element chip.
6. The light-source circuit unit according to claim 1, further comprising:
a white resist layer between the wiring pattern and the sealing lens; and
a reflective layer formed of the same material as the white resist layer between sub-patterns of the wiring pattern in a region covered with the sealing lens.
7. The light-source circuit unit according to claim 1, further comprising a reflective layer at least between sub-patterns of the wiring pattern in a region covered with the sealing lens on the circuit substrate, the reflective layer being formed of the same material as the wiring pattern.
8. The light-source circuit unit according to claim 1, further comprising a reflective sheet having an opening corresponding to the sealing lens over the entire area above the circuit substrate.
9. The light-source circuit unit according to claim 1, wherein the circuit substrate is configured of a resin film having the wiring pattern printed thereon, a reflective metal substrate having an insulating film on a surface thereof and the wiring pattern printed on the insulating film, or a glass-contained resin film having the wiring pattern printed thereon.
10. The light-source circuit unit according to claim 1, wherein two or more light-emitting element chips are provided on the circuit substrate, and the reflective layer is provided over the entire surface of the circuit substrate including a region between the light-emitting element chips.
11. The light-source circuit unit according to claim 1, wherein a heat-radiating metal sheet is laminated on the back surface of the circuit substrate.
12. An illumination device comprising:
a light-source circuit unit;
a support member that supports the light-source circuit unit therein; and
a diffuser sheet disposed oppositely to the entire area of the light-source circuit unit,
wherein the light-source circuit unit includes
a circuit substrate that has a light-reflective wiring pattern on a surface thereof and includes a chip mounting layer as a part of the wiring pattern, and
a plurality of light-emitting element chips that are directly placed on the chip mounting layer, and are driven by a current flowing through the wiring pattern.
13. An illumination device comprising:
a light guide plate;
a support member that supports the light guide plate therein;
a diffuser sheet disposed oppositely to the entire area of the light guide plate; and
a light-source circuit unit disposed oppositely to an end face of the light guide plate in the support member,
wherein the light-source circuit unit includes
a circuit substrate that has a light-reflective wiring pattern on a surface thereof and includes a chip mounting layer as a part of the wiring pattern, and
a plurality of light-emitting element chips that are directly placed on the chip mounting layer, and are driven by a current flowing through the wiring pattern.
14. An illumination device comprising:
a support member having a through-hole from the front surface to the back surface of the support member;
an optical sheet supported in front of the support member;
a drive substrate having a connector and disposed on the back surface of the support member; and
a foldable light-source circuit unit that is disposed between the optical sheet and the support member, extends to the back surface of the support member through the through-hole, and is electrically connected to the drive substrate via the connector,
wherein the light-source circuit unit includes
a circuit substrate that has a light-reflective wiring pattern on a surface thereof and includes a chip mounting layer as a part of the wiring pattern, and
one or more light-emitting element chips that are directly placed on the chip mounting layer, and are driven by a current flowing through the wiring pattern.
15. An illumination device comprising:
a support member having a through-hole from the front surface to the back surface of the support member;
an optical sheet supported in front of the support member;
a drive substrate having a connector and disposed on the back surface of the support member;
a plurality of light-source circuit units provided in parallel between the optical sheet and the support member; and
a foldable connection member that extends from the inside of the support member to the back surface thereof through the through-hole, and is electrically connected to each of the plurality of light-source circuit units via an anisotropic conductive resin, and to the drive substrate via the connector,
wherein the light-source circuit unit includes
a circuit substrate that has a light-reflective wiring pattern on a surface thereof and includes a chip mounting layer as a part of the wiring pattern, and
one or more light-emitting element chips that are directly placed on the chip mounting layer, and are driven by a current flowing through the wiring pattern.
16. An illumination device comprising:
an optical sheet;
a support member having a curved bottom that allows a distance from the optical sheet to be gradually reduced from the center of the support member to an end face thereof;
a foldable light-source circuit unit that has a plurality of light-emitting element chips in (one or more) rows and is accommodated in the support member along the curved bottom; and
a back protective member that covers the entire back surface of the support member from the neighborhoods of both ends of the optical sheet, and has an inclined surface according to the curved bottom of the support member,
wherein the light-source circuit unit includes
a circuit substrate that has a light-reflective wiring pattern on a surface thereof and includes a chip mounting layer as a part of the wiring pattern, and
one or more light-emitting element chips that are directly placed on the chip mounting layer, and are driven by a current flowing through the wiring pattern.
17. The illumination device according to claim 16, wherein a pitch of the plurality of light-emitting element chips arranged in a row direction is narrowed with a decrease in width of the accommodating space.
18. The illumination device according to claim 17, wherein a drive current applied to the plurality of light-emitting element chips is adjusted to allow surface luminance to be uniform, in response to the pitch of the plurality of light-emitting element chips arranged in the row direction.
19. A display device comprising:
a display panel; and
a light-source circuit unit as a light source for the display panel,
wherein the light-source circuit unit includes
a circuit substrate that has a light-reflective wiring pattern on a surface thereof and includes a chip mounting layer as a part of the wiring pattern, and
one or more light-emitting element chips that are directly placed on the chip mounting layer, and are driven by a current flowing through the wiring pattern.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A rolling bearing cage, comprising:
two annular elements; and
cage crossbars, which have an elastic configuration, connecting the annular elements to each other so as to form pockets for rolling elements between every two of the cage crossbars which are adjacent to each other and the annular elements.
2. The rolling bearing cage according to claim 1, wherein the cage crossbars are made of an elastic plastics material
3. The rolling bearing cage according to claim 1, wherein the cage crossbars are springs.
4. The roiling bearing cage according to claim 1, further comprising at least three positioning elements arranged equally spaced over a periphery of the rolling bearing cage between the annular elements.
5. The rolling bearing cage according to claim 4, wherein one of the positioning elements is arranged between two of the cage crossbars which are adjacent to each other, or a pocket formed between two of the cage crossbars which are adjacent to each other.
6. The rolling bearing cage according to claim 4, wherein the positioning elements have a rigid rod-shaped configuration.
7. The rolling bearing cage according to claim 1, wherein the cage crossbars and the annular elements are connected firmly to one another.
8. A rolling bearing, comprising:
a rolling bearing cage having two annular elements, and cage crossbars having an elastic configuration connecting the annular elements to each other so as to form pockets between every two of the cage crossbars which are adjacent to each other and the annular elements; and
rolling elements arranged in the pockets of the rolling bearing cage.
9. The rolling bearing according to claim 8, wherein the rolling bearing is a needle roller bearing.
10. The roiling bearing according to claim 8, further comprising rolling element retainers arranged on opposing axial inner sides of the annular elements in a region of the pockets.