1. An organic EL element, comprising:
a substrate;
a first electrode having a pixel region, the first electrode formed on the substrate;
a multi-step partition wall,
which includes a first partition wall formed on the substrate, the first partition wall sectioning the first electrode and having an inverse tapered shape, and
a second partition wall formed on the first partition wall, the second partition wall having a bottom part which is narrower than a top part of the first partition wall;
a light emitting medium layer,
which includes a first light emitting medium layer formed on the pixel region, the first partition wall and the second partition wall, the first light emitting medium layer made of an inorganic material, and
an organic light emitting layer on the first light emitting medium layer; and
a second electrode formed on the light emitting medium layer; wherein
the first light emitting medium layer is formed on the first electrode and the multi-step partition wall.
2. The organic EL element according to claim 1, wherein the first partition wall is made of an inorganic insulating material.
3. The organic EL element according to claim 2, wherein a film thickness of the first partition wall is 50 nm-1000 nm.
4. The organic EL element according to claim 1, wherein the second partition wall is made of a light sensitive material.
5. The organic EL element according to claim 1, further comprising:
a second light emitting medium layer made of an organic material, the second light emitting medium layer arranged between the first light emitting medium layer and the second electrode and covering the light emitting medium layer and the multi-step partition wall on the first electrode.
6. The organic EL element according to claim 1, wherein a total film thickness of the first partition wall and the second partition wall is 550 nm-5000 nm.
7. The organic EL element according to claim 1, wherein a thickness of the light emitting medium layer is smaller than a total film thickness of the first partition wall and the second partition wall.
8. The organic EL element according to claim 1, wherein the first electrode is a transparent electrode, and wherein the light emitting medium layer is formed between the first electrode and the second electrode.
9. The organic EL element according to claim 1, wherein the second electrode is a transparent electrode, and wherein the light emitting medium layer is formed between the first electrode and the second electrode.
10. An image display device comprising a display element of the organic EL element according to claim 1.
11. A method for manufacturing an organic EL element, the method comprising:
preparing a substrate;
forming a first electrode on the substrate;
forming a first partition wall having an inverse tapered shape, the first partition wall made of a silicon system insulating material and sectioning the first electrode;
forming a second partition wall made of a light sensitive material, the second partition wall having a bottom part which is narrower than a top part of the first partition wall;
forming a light emitting medium layer including a hole transport layer and an organic light emitting layer, the hole transport layer made of an inorganic material and formed on a region of the first electrode, the first partition wall and the second partition wall; and
forming a second electrode facing the first electrode.
12. The method for manufacturing an organic EL element according to claim 11, wherein a film thickness of the first partition wall is 50 nm-1000 nm.
13. The method for manufacturing an organic EL element according to claim 11, wherein a film thickness of the second partition wall is 500 nm-5000 nm.
14. The method for manufacturing an organic EL element according to claim 11, wherein at least one layer of the light emitting medium layer is formed by a wet type film forming method.
15. The method for manufacturing an organic EL element according to claim 14, wherein at least one layer of the light emitting medium layer is formed by a printing method.
16. The method for manufacturing an organic EL element according to claim 11, wherein the first electrode is a transparent electrode, and wherein the light emitting medium layer is formed between the first electrode and the second electrode.
17. The method for manufacturing an organic EL element according to claim 11, wherein the second electrode is a transparent electrode and wherein the light emitting medium layer is formed between the first electrode and the second electrode.
18. A method for manufacturing an image display device, the method comprising:
forming a display element by the method for manufacturing an organic EL element according to claim 11.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A bucket assembly for a machine, comprising:
a bucket configured to be coupled to a linkage assembly of the machine, the bucket having a top section, a bottom section, and a curved middle section; and
a kinematic reaction point about which the bucket is configured to rotate, wherein a loadability index of the bucket is between approximately 0.95 and 1.05, the loadability index being a ratio of a distance between the kinematic reaction point and a tip of the bottom section and a distance between the kinematic reaction point and a tip of the top section.
2. The bucket assembly of claim 1, wherein the tip of the bottom section is a part of the bottom section furthest away from the kinematic reaction point.
3. The bucket assembly of claim 1, wherein the tip of the top section is a part of the top section furthest away from the kinematic reaction point.
4. The bucket assembly of claim 1, wherein a bottom surface of at least a portion of the bottom section defines a cutting edge plane.
5. The bucket assembly of claim 4, wherein an angle between a plane perpendicular to the cutting edge plane and a plane extending between the tip of the bottom section and the tip of the top section is equal to a value (\u03b1) between approximately 17.8\xb0 and 23.8\xb0.
6. The bucket assembly of claim 4, wherein an angle between a plane formed by the top section and the cutting edge plane is equal to a value (\u03b2) between approximately 23.0\xb0 and 29.0\xb0.
7. The bucket assembly of claim 4, wherein an angle between a plane perpendicular to the cutting edge plane and a plane extending between the tip of the bottom section and the tip of the top section is equal to a value (\u03b1) between approximately 22.0\xb0 and 28.0\xb0.
8. The bucket assembly of claim 4, wherein an angle between a plane formed by the top section and the cutting edge plane is equal to a value (\u03b2) between approximately 47.0\xb0 and 53.0\xb0.
9. The bucket assembly of claim 4, wherein an angle between a plane perpendicular to the cutting edge plane and a plane extending between the tip of the bottom section and the tip of the top section is equal to a value (\u03b1) between approximately 18.5\xb0 and 24.5\xb0.
10. The bucket assembly of claim 4, wherein an angle between a plane formed by the top section and the cutting edge plane is equal to a value (\u03b2) between approximately 44.0\xb0 and 50.0\xb0.