1. A process for producing sodium dihydrate salt of ibuprofen, the process comprising:
dissolving 1 mole of ibuprofen in 2 volume of organic solvent, stirring with 1 mole of salt of a long chain carboxylic acid in 1 volume of double distilled waterand corresponding solvent for 1 hr at 28\xb0 C. and for 6 hrs at room temperature, evaporating the solvent and precipitating the resultant product in 10 volume acetone, wherein the said salt of long chain carboxylic acid is sodium-2-ethyl hexanoate.
2. The process according to claim 1, wherein the organic solvent is selected from a group comprising, tetrahydrofuran, ethanol or acetone.
3. The process according to claim 1, wherein the organic solvent is tetrahydrofuran.
4. The process according to claim 1, wherein the organic solvent is ethanol.
5. A process for producing sodium dihydrate salt of ibuprofen, the process comprising:
dissolving 1 mole of ibuprofen in 5 volume of an organic solvent, stirring with 1 mole of salt of a long chain carboxylic acid in 1 volume of aqueous acetone for 1 hr at 28\xb0 C. and for 6 hrs at room temperature, chilling the solution and precipitating the resultant product.
6. The process according to claim 5 wherein the said salt of long chain carboxylic acid is sodium-2-ethyl hexanoate.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A multi-celled assembly comprising:
a plurality of horizontally adjacent cells wherein each cell comprises at least one base material layer and at least one conductive pattern;
the adjacent cells of the assembly being bound together by an adhesive material.
2. The assembly of claim 1 wherein the adhesive material differs from the material of the at least one base material layer of the cells.
3. The assembly of claim 2 wherein the at least one base material layer comprises a polyimide film.
4. The assembly of claim 1 wherein:
each cell is a stack of alternating bond-ply and layer-pair layers, the layer-pair layers comprising the at least one base material layer and at least one conductive pattern;
the adjacent stacks being bound together by the adhesive material.
5. The assembly of claim 4 wherein:
during formation of the assembly, the bond-ply layers are provided in a form comprising at least one adhesive layer;
during formation of the assembly, inclusion of the bond-ply layers in the stacks results in portions of the adhesive layers interconnecting the stacks;
during formation of the assembly but after the stacks are interconnected by portions of the adhesive layer, the interconnecting portions of the adhesive layer are cured.
6. The assembly of claim 1 wherein the assembly is produced by:
providing a plurality of known good layer-pairs and bond-ply members;
forming the layer-pairs and bond-ply members into adjacent stacks;
interconnecting the adjacent stacks to form a multi-celled unit.
7. The assembly of claim 6 wherein each of the layer-pairs comprises a polyimide base layer having conductive patterns on two opposing sides.
8. The assembly of claim 6 wherein the bond-ply layers each comprise at least two adhesive layers and one non-adhesive layer.
9. The assembly of claim 1 wherein the assembly is produced by:
providing a multi-celled unit comprising a plurality of cells joined together by at least one common interconnecting layer wherein each cell comprises at least one conductive trace, pad or via;
identifying good cells having desirable characteristics;
separating each good cell from the common interconnecting layer and forming a new multi-celled unit from the good cells.
10. The assembly of claim 9 wherein the step of coupling the good cells together to form a new multi-celled unit comprises the steps of:
positioning the cells of the group of good cells adjacent to each other;
providing a corresponding bond-ply layer for each cell, wherein the bond-ply layer comprises at least one adhesive layer and at least one non-adhesive layer;
stacking the bond-ply layers onto their corresponding cells to form a group of adjacent stacks;
applying sufficient pressure to the adjacent stacks to force portions of the adhesive layers of each stack into contact with adjacent stacks;
curing the adjacent stacks to cure the adhesive layers.
11. The assembly of claim 10 wherein the bond-ply layers have a non-adhesive layer between a first adhesive layer and a second adhesive layer.
12. The assembly of claim 11 wherein the volume of adhesive material in the first adhesive layer differs from the volume of adhesive material in the second adhesive layer.
13. The assembly of claim 12 wherein the volume of adhesive material in at least one adhesive layer of a bond-ply layer is adjusted based on the volume of space to be filled between the bond-ply layer and its corresponding cell and between the bond-ply layer and one or more adjacent stacks.
14. A method for producing a high density interconnect comprising at least 3 layer-pairs wherein the percentage yield for the resulting multi-celled unit is at least 90%.
15. The method of claim 14 wherein the high density interconnect comprises at least N layer-pairs and N is one of 4, 5, 6, 7, 8, 9, 10.
16. The method of claim 15 wherein the percentage yield for the resulting multi-celled unit is at least Y% where Y is one of 95, 98, 99, and 99.5.
17. A method for producing a multi-celled assembly comprising:
providing a panel comprising two layer pairs separated by a distance D;
producing a second panel comprising the two layer pairs separated by a distance E wherein E is not equal to D.