1. A semiconductor memory device comprising:
a substrate having a first region on which a conductive structure is arranged and a second region defining the first region, the first region including an active region and a multi-faced polyhedral recess having a plurality of sidewalls, at least one of the sidewalls being slanted with respect to a surface of the substrate, the recess having at least a laterally projecting portion;
an insulation layer disposed on the substrate to a thickness sufficient to cover the conductive structure, the insulation layer having a contact hole communicated with the recess, the active region of the substrate being exposed through the contact hole; and
a conductive pattern positioned in the recess and the contact hole, wherein the conductive pattern includes a contact structure making electrical and physical contact with the active region of the substrate.
2. The semiconductor memory device of claim 1, wherein the sidewalls of the recess are slanted downward to a point such that the multi-faced polyhedral recess has a shape of a multi-faced polyhedral cone.
3. The semiconductor memory device of claim 1, wherein the sidewalls of the recess are slanted downward to a linear area such that the multi-faced polyhedral recess has a shape of a multi-faced wedge.
4. The semiconductor memory device of claim 1, wherein the uneven portion includes a first component face that is slanted downward at a first slant angle with respect to the surface of the substrate and a second component face that is connected to the first component face and is slanted downward at a second slant angle with respect to the surface of the substrate.
5. The semiconductor memory device of claim 4, wherein the first slant angle is in a range of about 65\xb0 to about 125\xb0 and the second slant angle is in a range of about 45\xb0 to about 55\xb0.
6. The semiconductor memory device of claim 1, wherein the substrate includes a semiconductor substrate having silicon (Si), the first and the second regions include the active region and a field region, respectively, of the semiconductor substrate.
7. The semiconductor memory device of claim 6, wherein the conductive structure includes a gate structure positioned at a gate area of the active region and the contact structure includes at least one of a storage node contact plug positioned at a source area of the active region and making electrical contact with a capacitor and a bit line contact plug positioned at a drain area of the active region and making electrical contact with a bit line.
8. The semiconductor memory device of claim 7, wherein the contact structure further includes a storage node contact pad positioned on the source area of the active region and making contact with the storage node contact plug.
9. The semiconductor memory device of claim 6, wherein the conductive structure includes a plurality of string selection transistors, a plurality of cell transistors, and a plurality of ground selection transistors positioned on the active region extending along a first direction on the substrate, and the contact structure includes at least one of a bit line contact plug interposed between neighboring string selection transistors on the active region and a common source line interposed between neighboring ground selection transistors on the active region.
10. The semiconductor memory device of claim 7, wherein the contact structure further includes a bit line contact pad interposed between neighboring string selection transistors and making contact with the bit line contact plug.
11. A semiconductor memory device, comprising:
a substrate including a first region and a second region defining the first region, the first region including an active region and a polyhedral recess partially extending into the substrate, the polyhedral recess having at least four slanted faces relative to a surface of the substrate;
an insulation layer on the substrate, the insulation layer having a contact hole exposing the active region of the substrate, the contact hole being in communication with the polyhedral recess; and
a conductive pattern disposed in the contact hole and the polyhedral recess, the conductive pattern having a terminal portion in the form of a polyhedron that corresponds to a shape of the polyhedral recess, wherein the terminal portion makes electrical and physical contact with the active region of the substrate.
12. The semiconductor memory device of claim 11, wherein the polyhedral recess includes at least two upper faces that slant outward and away from each other from an upper surface of the substrate.
13. The semiconductor memory device of claim 12, wherein the polyhedral recess includes at least two lower faces that slant inward and toward each other, the at least two lower faces being below and directly adjacent to the at least two upper faces.
14. The semiconductor memory device of claim 13, wherein a slant angle of the at least two upper faces is greater than a slant angle of the at least two lower faces.
15. The semiconductor memory device of claim 11, wherein the terminal portion of the conductive pattern in the polyhedral recess is wider than the contact hole.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
I claim:
1. An assembly for purifying water, the assembly comprising:
(a) a tube for carrying the water, the tube having an upstream end and a downstream end;
(b) means for introducing ozone into the tube at an ozone introduction point within the tube for carrying water;
(c) ozone dissolving means situated between the ozone introduction point and the downstream end of the tube for carrying water;
(d) a bubble separator column having a water input port and a water output port, the downstream end of the tube for carrying water being positioned so that water emitting therefrom may pass through the water input port; and
(e) means for continuously alternately collecting water within and discharging water from the bubble separator column.
2. The assembly of claim 1 wherein the ozone introduction means comprising an ozone generator selected from the group of high intensity ultraviolet light ozone generators, or corona discharge ozone generators.
3. The assembly of claim 2 wherein the ozone dissolving means comprises an ozone contact time segment, the ozone contact time segment being contiguous with the tube for carrying water, the ozone contact time segment being situated between the ozone introduction point and the downstream end of the tube for carrying water.
4. The assembly of claim 3 wherein the bubble separator column has an upper end and a lower end, wherein the water input port is positioned at the upper end of the bubble separator column; and wherein the water output port is positioned at the lower end of the bubble separator column.
5. The assembly of claim 4 wherein the alternate collecting and discharging means comprises an electrically actuated valve for alternately opening and closing the water output port of the bubble separator column.
6. The assembly of claim 5 wherein the alternate collecting and discharging means further comprises a water level sensitive electric switch for alternately actuating the electrically actuated valve to open the water output port of the bubble separator column when the water level within the bubble separator column approaches the upper end of the bubble separator column, and counter-actuating the electrically actuated valve to close said water output port when said water level approaches the lower end of the bubble separator column.
7. The assembly of claim 6 wherein the water level sensitive electric switch comprises a switch selected from the group of float actuated mechanical switches, float actuated mercury switches, or water sensor controlled switches.
8. The assembly of claim 7 wherein the ozone dissolving means further comprises means for inducing turbulence within water flowing through the ozone contact time segment.
9. The assembly of claim 8 wherein the upper end of the bubble separator column has an off gassing vent.
10. The assembly of claim 9 further comprising means for preventing water flow through the off gassing vent.
11. The assembly of claim 10 wherein the means for preventing water flow through the off gassing vent comprises a valve selected from the group of electrically actuated valves or float actuated valves.
12. The assembly of claim 11 wherein the means for introducing ozone further comprises a venturi.
13. The assembly of claim 11 wherein the means for introducing ozone further comprises an air compressor for driving air through the ozone generator.
14. The assembly of claim 11 wherein the electrically actuated valve comprises a magnetic shaft driven by an electric solenoid.
15. The assembly of claim 11 wherein the electrically actuated valve comprises electric motor means.
16. The assembly of claim 4 wherein the alternate collecting and discharging means comprises a float actuated valve for alternately opening and closing the water output port of the bubble separator column.
17. The assembly of claim 16 wherein the ozone dissolving means further comprises means for inducing turbulence within water flowing through the ozone contact time segment.
18. The assembly of claim 17 wherein the upper end of the bubble separator column has an off gassing vent.
19. The assembly of claim 18 further comprising means for preventing water flow through the off gassing vent.
20. The assembly of claim 19 wherein the means for introducing ozone further comprises a venturi.