1. A computer-readable medium for locating the coordinates of a targeting symbol within an image for calibrating an optical reader device, the computer-readable medium comprising executable instructions for:
receiving the captured image;
locating the targeting symbol in the image, wherein the targeting symbol is not a machine-readable graphical code; and
upon identifying the targeting symbol, calculating coordinates of the targeting symbol in the image.
2. The computer readable medium of claim 1, wherein locating the targeting symbol comprises:
thresholding the image to identify clusters; and
comparing clusters to a template to identify the targeting symbol.
3. The computer readable medium of claim 2, wherein thresholding the image comprises sampling pixels to identify the pixels as light or background.
4. The computer readable medium of claim 3, wherein thresholding the image further comprises comparing the intensity of each pixel to a threshold value to identify the pixel as light or background.
5. The computer readable medium of claim 3, wherein thresholding the image further comprises:
counting identified light pixels that form a cluster; and
locating the cluster in the image.
6. The computer readable medium of claim 2, wherein comparing clusters to a template further comprises comparing the shape and size of each cluster to the template.
7. The computer readable medium of claim 2, wherein comparing clusters to a template further comprises identifying clusters that are approximate matches.
8. The computer readable medium of claim 7, wherein comparing clusters to a template further comprises attempting displacements for approximate clusters in the x and y axes to thereby identify a cluster that is a maximum match.
9. The computer readable medium of claim 2, wherein calculating coordinates of the targeting symbol includes calculating the center of the targeting symbol.
10. The computer readable medium of claim 2, wherein the targeting symbol includes a bull’s eye having a ring and a center dot, and wherein calculating the center comprises:
locating the center of the ring;
locating the center of the center dot; and
calculating a target point from the location of the center of the ring and the location of the center of the center dot.
11. The computer readable medium of claim 10, wherein locating the center of the ring comprises:
counting the number of pixels matching a ring portion of the template;
counting the number of background pixels within the ring and outside the center dot; and
locating a best match for the template.
12. The computer readable medium of claim 11, wherein locating a best match for the template includes positioning the template to find a maximal product of the count of matching ring pixels and the count of background pixels within the ring and outside the center dot.
13. The computer readable medium of claim of claim 11 further comprising:
locating a coarse approximation of the center of the ring; and
refining the location of the center of the ring.
14. The computer readable medium of claim 11, wherein locating the center of the center dot comprises:
counting the number of pixels matching a center dot portion of the template;
counting the number of background pixels outside the center dot and within the ring; and
locating a best match for the template.
15. The computer readable medium of claim 14 wherein locating a best match for the template includes positioning the template to find a maximal product of the count of matching center dot pixels and the count of background pixels within the ring and outside the center dot.
16. The computer readable medium of claim 14 further comprising:
locating a coarse approximation of the center of the center dot; and
refining the location of the center of the center dot.
17. The computer readable medium of claim 1, further comprising executable instructions for storing the coordinates in a memory.
18. The computer readable medium of claim 17, further comprising executable instructions for using the coordinates to select a machine-readable graphical code nearest the targeting symbol from a plurality of machine-readable graphical codes.
19. A computer-readable medium for locating the coordinates of a targeting symbol within an image for calibrating an optical reader device, the computer-readable medium comprising executable instructions for:
receiving a captured image, wherein the captured image comprises a machine-readable graphical code;
thresholding the image to identify a cluster;
determining if there is a single object in the image or multiple objects in the image;
if it is determined that there is the single object in the image, directing lines vertically and horizontally to the cluster to identify the targeting symbol; and
upon identifying the targeting symbol, calculating coordinates of the targeting symbol in the image.
20. The computer readable medium of claim 19, further comprising executable instructions for storing the coordinates in a memory.
21. The computer readable medium of claim 20, further comprising executable instructions for using the coordinates to select a machine-readable graphical code nearest the targeting symbol from a plurality of machine-readable graphical codes.
22. The computer readable medium of claim 19, wherein thresholding the image comprises sampling pixels to identify the pixels as light or background.
23. The computer readable medium of claim 22, wherein thresholding the image further comprises comparing the intensity of each pixel to a threshold value to identify the pixel as light or background.
24. The computer readable medium of claim 22, wherein thresholding the image further comprises:
counting identified light pixels that form a cluster; and
locating the cluster in the image.
25. The computer readable medium of claim 19, wherein directing lines vertically and horizontally includes defining tracks to intersect the cluster, and further comprising executable instructions for:
identifying tracks that intersect a cross section of the cluster; and
identifying tracks that do not intersect a cross section of the cluster to thereby locate tangents to the cluster.
26. The computer readable medium of claim 19, wherein calculating coordinates of the targeting symbol comprises locating the geometric center of the targeting symbol.
27. The computer readable medium of claim 26, wherein locating the geometric center of the targeting symbol comprises applying symmetric relationships of the targeting symbol.
28. The computer readable medium of claim 26, wherein locating the geometric center of the targeting symbol comprises applying known geometric relationships of the targeting symbol.
29. The computer readable medium of claim 19, further comprising executable instructions for rejecting a noise cluster based on the noise cluster being in a region of the image distant from an expected location of the targeting symbol.
30. The computer readable medium of claim 19, further comprising executable instructions for rejecting a noise cluster based on the noise cluster being in an expected region of the image.
31. A method for locating the coordinates of a targeting symbol having a plurality of objects for calibrating an optical reader device, the method comprising:
the optical reader device projecting each object one at a time onto a surface;
the optical reader device capturing a plurality of images, wherein each image contains an object;
thresholding the images to identify clusters within each image;
directing lines vertically and horizontally across each image to the clusters to identify the objects;
upon identifying the objects, calculating coordinates of the objects in each image; and
identifying a center for the targeting symbol based on the coordinates for the objects.
32. The method of claim 31, further comprising storing the coordinates in a memory.
33. The method of claim 31, wherein thresholding the images comprises sampling pixels of each image to identify the pixels as light or background.
34. The method of claim 33, wherein thresholding the images further comprises comparing the intensity of each pixel to a threshold value to identify the pixel as light or background.
35. The method of claim 33, wherein thresholding the images further comprises:
counting identified light pixels that form a cluster; and
locating the cluster in the images.
36. The method of claim 31, wherein directing lines vertically and horizontally across each image includes defining tracks to intersect the clusters and wherein the method further comprises:
identifying tracks that intersect a cross section of each cluster; and
identifying tracks that do not intersect a cross section of the clusters to thereby locate tangents to the clusters.
37. The method of claim 31, wherein calculating coordinates of each object comprises locating the geometric center of each object.
38. The method of claim 37, wherein locating the geometric center of each object comprises applying symmetric relationships for each object.
39. The method of claim 37, wherein locating the geometric center of each object comprises applying known geometric relationships for each object.
40. The method of claim 31, wherein identifying a center for the targeting symbol based on the coordinates for the objects comprises applying known geometric relationships between the objects.
41. The method of claim 31, further comprising rejecting a noise cluster based on the noise cluster being in a region of the image distant from an expected location of the targeting symbol.
42. The method of claim 31, further comprising rejecting a noise cluster based on the noise cluster being in an expected region of the image.
43. An optical reader apparatus for locating the coordinates of a targeting symbol having a plurality of objects for calibration, the apparatus comprising:
a projector for projecting the objects of the targeting symbol one at a time onto a surface;
a camera for capturing a plurality of images, wherein each image includes an object;
a processor in electrical communication with the projector and the camera; and
a memory in electrical communication with the processor, the memory including a calibration module programmed to:
receive the plurality of images;
threshold the images to identify clusters within each image;
direct lines vertically and horizontally across each image to the clusters to identify the objects;
upon identifying the objects, calculate coordinates of the objects in each image; and
identify a center for the targeting symbol based on the coordinates for the objects.
44. The apparatus of claim 43, wherein the calibration module is also programmed to store the coordinates in a memory.
45. The apparatus of claim 43, wherein thresholding the images comprises sampling pixels of each image to identify the pixels as light or background.
46. The apparatus of claim 43, wherein thresholding the images further comprises comparing the intensity of each pixel to a threshold value to identify the pixel as light or background.
47. The apparatus of claim 45, wherein thresholding the images further comprises:
counting identified light pixels that form a cluster; and
locating the cluster in the images.
48. The apparatus of claim 43, wherein directing lines vertically and horizontally across each image includes defining tracks to intersect the clusters and wherein the calibration module is also programmed to:
identify tracks that intersect a cross section of each cluster; and
identify tracks that do not intersect a cross section of the clusters to thereby locate tangents to the clusters.
49. The apparatus of claim 43, wherein calculating coordinates of each object comprises locating the geometric center of each object.
50. The apparatus of claim 49, wherein locating the geometric center of each object comprises applying symmetric relationships for each object.
51. The apparatus of claim 49, wherein locating the geometric center of each object comprises applying known geometric relationships for each object.
52. The apparatus of claim 43, wherein identifying a center for the targeting symbol based on the coordinates for the objects comprises applying known geometric relationships between the objects.
53. The apparatus of claim 43, wherein the calibration module is also programmed to reject a noise cluster based on the noise cluster being in a region of the image distant from an expected location of the targeting symbol.
54. The apparatus of claim 43, wherein the calibration module is also programmed to reject a noise cluster based on the noise cluster being in an expected region of the image.
55. A computer readable medium for locating the coordinates of a targeting symbol having a plurality of objects for calibrating an optical reader device, the computer-readable medium comprising executable instructions for:
receiving a plurality of images, wherein each image includes one or more objects;
thresholding the images to identify one or more clusters within each image;
for each image, determining if there is a single object in the image or multiple objects in the image;
for each image that includes a single object, directing lines vertically and horizontally across the image to a cluster to identify the object;
upon identifying the objects in the images, calculating coordinates of the objects; and
identifying a center for the targeting symbol based on the coordinates for the objects.
56. The computer readable medium of claim 55, further comprising executable instructions for storing the coordinates in a memory.
57. The computer readable medium of claim 55, wherein thresholding the images comprises sampling pixels of each image to identify the pixels as light or background.
58. The computer readable medium of claim 57, wherein thresholding the images further comprises comparing the intensity of each pixel to a threshold value to identify the pixel as light or background.
59. The computer readable medium of claim 57, wherein thresholding the images further comprises:
counting identified light pixels that form a cluster; and
locating the cluster in the images.
60. The computer readable medium of claim 55, wherein directing lines vertically and horizontally across each image includes defining tracks to intersect the clusters, and further comprising executable instructions for:
identifying tracks that intersect a cross section of each cluster; and
identifying tracks that do not intersect a cross section of the clusters to thereby locate tangents to the clusters.
61. The computer readable medium of claim 55, wherein calculating coordinates of the objects comprises locating the geometric center of each object.
62. The computer readable medium of claim 61, wherein locating the geometric center of each object comprises applying symmetric relationships for each object.
63. The computer readable medium of claim 61, wherein locating the geometric center of each object comprises applying known geometric relationships for each object.
64. The computer readable medium of claim 55, wherein identifying a center for the targeting symbol based on the coordinates for the objects comprises applying known geometric relationships between the objects.
65. The computer readable medium of claim 55, further comprising executable instructions for rejecting a noise cluster based on the noise cluster being in a region of the image distant from an expected location of the targeting symbol.
66. The computer readable medium of claim 55, further comprising executable instructions for rejecting a noise cluster based on the noise cluster being in an expected region of the image.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of fabricating a light emitting device including a silicon carbide substrate having first and second opposing faces and a light emitting element on a first face of the SiC substrate, comprising:
directly etching the second face of the silicon carbide substrate utilizing an aqueous etch to remove a damaged portion of the SiC substrate resulting from processing of the SiC substrate.
2. The method of claim 1, wherein the damaged portion of the second face of the silicon carbide substrate results from sawing the SiC substrate, lapping the SiC substrate, polishing the SiC substrate, implantation in the SiC substrate andor laser processing the SiC substrate.
3. The method of claim 1, wherein directly etching the second face of the silicon carbide substrate is carried out subsequent to singulation of the light emitting device from a wafer.
4. The method of claim 1, wherein directly etching the second face of the silicon carbide substrate is carried out prior to singulation of the light emitting device from a wafer.
5. The method of claim 1, wherein the aqueous etch comprises an etch with KOH:K3Fe(CN)6.
6. The method of claim 1, wherein directly etching the second face of the silicon carbide substrate further comprises etching a carbon-faced surface of the silicon carbide substrate.
7. The method of claim 6, wherein the carbon-faced surface of the silicon carbide substrate comprises a carbon-faced surface of a sidewall of the SiC substrate.
8. The method of claim 1, wherein directly etching the second face of the silicon carbide substrate further comprises etching a non-carbon-faced surface of the silicon carbide substrate.
9. The method of claim 1, wherein directly etching the second face of the silicon carbide substrate comprises directly etching a surface oblique to the second face of the silicon carbide substrate.
10. A method of increasing light output of a light emitting diode, comprising:
etching a substrate of the light emitting diode using an aqueous etch to at least partially remove a light absorption region of the substrate of the light emitting diode.
11. The method of claim 10, wherein the light absorption region corresponds to a region of the substrate damaged by processing the substrate in fabrication of the light emitting diode.
12. The method of claim 11, wherein the region of the substrate damaged by processing the substrate corresponds to a saw groove in the substrate.
13. The method of claim 11, wherein the region of the substrate damaged by processing the substrate corresponds to a lapped, polished, implanted andor laser processed region of the substrate.
14. The method of claim 10, wherein the substrate comprises a silicon carbide substrate.
15. The method of claim 14, wherein etching a substrate comprises etching a carbon face of the silicon carbide substrate.
16. The method of claim 15, wherein etching a substrate further comprises etching a non-carbon face of the silicon carbide substrate.
17. The method of claim 14, wherein etching a substrate comprises etching a carbon face sidewall of the silicon carbide substrate.
18. The method of claim 10, wherein the substrate comprises a sapphire substrate.
19. The method of claim 10, wherein etching a substrate is carried out subsequent to singulation of the light emitting diode.
20. The method of claim 10, wherein the aqueous etch comprises etching with KOH:K3Fe(CN)6.
21. The method of claim 20, wherein the aqueous etch is carried out for at least about 50 minutes.
22. The method of claim 20, wherein the aqueous etch is carried out at a temperature of at least about 80\xb0 C.
23. The method of claim 10, wherein etching a substrate comprises directly etching the substrate.
24. A method of fabricating a light emitting diode, comprising:
etching a substrate of the light emitting diode using an aqueous etch and using etching parameters that are sufficient to increase an amount of light extracted through the substrate.
25. The method of claim 24, wherein etching a substrate comprises etching a substrate to remove at least a portion of a region of the substrate damaged by processing the substrate in fabrication of the light emitting diode.
26. The method of claim 25, wherein the region of the substrate damaged by processing the substrate corresponds to a saw groove in the substrate.
27. The method of claim 25, wherein the region of the substrate damaged by processing the substrate corresponds to a lapped, polished, implanted andor laser processed region of the substrate.
28. The method of claim 24, wherein the substrate comprises a silicon carbide substrate.
29. The method of claim 28, wherein etching a substrate comprises etching a carbon face of the silicon carbide substrate.
30. The method of claim 29, wherein etching a substrate further comprises etching a non-carbon face of the silicon carbide substrate.
31. The method of claim 29, wherein etching a substrate further comprises etching a carbon face sidewall of the silicon carbide substrate.
32. The method of claim 24, wherein the substrate comprises a sapphire substrate.
33. The method of claim 24, wherein etching a substrate is carried out subsequent to singulation of the light emitting diode.
34. The method of claim 33, wherein the aqueous etch comprises etching with KOH:K3Fe(CN)6.
35. The method of claim 34, wherein the aqueous etch is carried out for at least about 50 minutes.
36. The method of claim 35, wherein the aqueous etch is carried out at a temperature of at least about 80\xb0 C.
37. The method of claim 34, wherein etching a substrate comprises directly etching the substrate.
38. A method of fabricating a light emitting device, comprising:
etching a silicon carbide substrate of the light emitting device using an aqueous etch to remove at least a portion of amorphous silicon carbide from a surface of the silicon carbide substrate of the light emitting device.
39. The method of claim 38, wherein the amorphous silicon carbide corresponds to a region of the SiC substrate damaged by processing the SiC substrate in fabrication of the light emitting device.
40. The method of claim 39, wherein the region of the SiC substrate damaged by processing the SiC substrate corresponds to a saw groove in the SiC substrate.
41. The method of claim 39, wherein the region of the SiC substrate damaged by processing the SiC substrate corresponds to a lapped, polished, implanted andor laser processed region of the SiC substrate.
42. The method of claim 38, wherein etching the SiC substrate is carried out subsequent to singulation of the light emitting device.
43. The method of claim 38, wherein the aqueous etch comprises etching with KOH:K3Fe(CN)6.
44. The method of claim 43, wherein the aqueous etch is carried out for at least about 50 minutes.
45. The method of claim 43, wherein the aqueous etch is carried out at a temperature of at least about 80\xb0 C.
46. The, method of claim 38, wherein etching a substrate comprises directly etching the substrate.