1. A film formation method comprising:
setting a substrate inside a processing vessel held in a vacuum;
reacting carboxylic acid with an oxygen-containing metal compound to produce carboxylate salt gas of a metal of the metal compound;
supplying the carboxylate salt gas of the metal onto the substrate inside the processing vessel; and
applying energy to the substrate inside the processing vessel to decompose the carboxylate salt of the metal supplied onto the substrate, thereby forming a metal film,
wherein the carboxylate salt gas is formed outside the processing vessel by reacting the carboxylic acid with the oxygen-containing metal compound, and supplied into the processing vessel through a pipe, and
the pipe includes an inner surface coated with the oxygen-containing metal compound, and the carboxylate salt gas is produced by causing a carboxylic acid gas serving as the carboxylic acid to flow through the pipe.
2. The film formation method according to claim 1, wherein
the carboxylate salt is deposited on the substrate by supplying the carboxylate salt gas onto the substrate, and
the carboxylate salt on the substrate is decomposed by applying energy to the substrate on which the carboxylate salt is deposited.
3. The film formation method according to claim 1, wherein energy is applied to the substrate while the carboxylate salt gas is supplied onto the substrate.
4. The film formation method according to claim 1, wherein the metal is one of copper and silver.
5. The film formation method according to claim 4, wherein the oxygen-containing metal compound is a material selected from the group consisting of copper(I) oxide (Cu2O), copper(II) oxide (CuO), copper(II) hydroxide (Cu(OH)2), silver(I) oxide (Ag2O), and silver(II) oxide (Ag2O2).
6. The film formation method according to claim 1, wherein the carboxylic acid is an acid selected from the group consisting of formic acid, acetic acid, propionic acid, valeric acid, and butyric acid.
7. The film formation method according to claim 1, wherein the carboxylic acid is formic acid, the oxygen-containing metal compound is an oxygen-containing copper compound, the carboxylate salt gas is copper formate gas, and the metal film is a copper film.
8. The film formation method according to claim 1, wherein energy applied to the substrate is heat energy.
9. The film formation method according to claim 8, wherein a resistance heating element formed in a substrate support member which supports the substrate applies heat energy to the substrate.
10. The film formation method according to claim 8, wherein a heating lamp disposed in a position apart from the substrate applies heat energy to the substrate.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A voice coil for a voice coil motor of a hard disk drive, said voice coil comprising:
an inner surface of said voice coil, which bounds a central space of said voice coil;
a first outer surface of said voice coil substantially parallel to a second outer surface of said voice coil; and
a constrained layer damper attached to said inner surface of said voice coil by a coupler, said constrained layer damper comprising:
a first constraining layer coupled to a first surface of a viscoelastic damping layer; and
a second constraining layer coupled to a second surface of said viscoelastic damping layer, wherein said constrained layer damper is curved in a direction that is substantially perpendicular to said first outer surface of said voice coil and said second outer surface of said voice coil.
2. The voice coil of claim 1 wherein said coupler comprises a mounting pad juxtaposed to said inner surface of said voice coil.
3. The voice coil of claim 2 wherein said coupler further comprises an adhesive.
4. The voice coil of claim 3 wherein said adhesive comprises a thermal plastic adhesive.
5. The voice coil of claim 1 wherein said coupler comprises a coil winding bobbin.
6. The voice coil of claim 1 wherein said first constraining layer and said second constraining layer are about three times stiffer than said viscoelastic damping layer.
7. The voice coil of claim 1 wherein said first constraining layer and said second constraining layer are selected from the group of constraining layer materials consisting of: stainless steel, aluminum, polyimide, and polyester.
8. The voice coil of claim 1 wherein said viscoelastic damping layer comprises a pressure sensitive adhesive.
9. A hard disk drive comprising:
a voice coil motor having a voice coil comprising:
an inner surface of said voice coil, which bounds a space of said voice coil;
a first outer surface of said voice coil substantially parallel to a second outer surface of said voice coil; and
a constrained layer damper attached to said inner surface of said voice coil by a coupler, said constrained layer damper comprising:
a first constraining layer coupled to a first surface of a viscoelastic damping layer; and
a second constraining layer coupled to a second surface of said viscoelastic damping layer, wherein said constrained layer damper is curved in a direction that is substantially perpendicular to said first outer surface of said voice coil and said second outer surface of said voice coil.
10. The hard disk drive of claim 9 wherein said hard disk drive has at least one gain reduced of at least one system frequency in the range of 6 KHz to 12 KHz.
11. The hard disk drive of claim 9 wherein said coupler comprises a mounting pad juxtaposed to said inner surface of said voice coil.
12. The hard disk drive of claim 11 wherein said coupler further comprises an adhesive.
13. The hard disk drive of claim 12 wherein said adhesive comprises a thermal plastic adhesive.
14. The hard disk drive of claim 9 wherein said coupler comprises a coil winding bobbin.
15. The hard disk drive of claim 9 wherein said first constraining layer and said second constraining layer are selected from the group of constraining layer materials consisting of: stainless steel, aluminum, polyimide, and polyester.
16. The hard disk drive of claim 9 wherein said viscoelastic damping layer comprises a pressure sensitive adhesive.