1460956151-882dc24a-fa91-4f6c-b1ea-4a6b735046e4

What is claimed is:

1. A semiconductor package comprising:
a plurality of horizontal metal leads, each lead having a first side, and an opposite second side having at least one horizontal first surface and at least one horizontal second surface recessed from the first surface;
a chip mounting substrate having a first side and an opposite second side, said second side having a horizontal central surface and a horizontal peripheral surface fully around and recessed from the central surface;
a semiconductor chip having an active surface facing the first side of the leads and the first side of the chip mounting substrate, and input-output pads at a peripheral portion of the active surface, wherein each of the peripheral input-output pads faces and is electrically connected to the first side of a respective one of the leads; and
a package body formed of a hardened encapsulating material, wherein the encapsulating material covers the semiconductor chip, the recessed peripheral surface of the second side of the chip mounting substrate, and the at least one recessed second surface of the second side of the leads, while the central surface of the second side of the chip mounting substrate and the at least one first surface of the second side of the leads are exposed at a horizontal first exterior surface of the package body.
2. The semiconductor package of claim 1, wherein the second side of each lead includes a plurality of the horizontal first surfaces and horizontal second surfaces, and the first surfaces of the leads collectively form rows and columns at the first exterior surface of the package body.
3. The semiconductor package of claim 1, wherein a surface of the semiconductor chip is exposed at an exterior surface of the package body.
4. The semiconductor package of claim 1, wherein the active surface of the semiconductor chip includes at least one central input-output pad inward of the peripheral input-output pads, and the at least one central input-output pad faces and is electrically connected to the first side of the chip mounting substrate.
5. The semiconductor package of claim 4, where the peripheral input-output pads and the at least one central input-output pad of the chip are each electrically connected to the first side of the lead or the first side of the chip mounting substrate, respectively, by a reflowed metal ball.
6. The semiconductor package of claim 5, further comprising a discrete insulative layer on the first side of each of the leads and the first side of the chip mounting substrate, wherein the insulative layer is covered by the encapsulating material and the respective reflowed metal ball extends through an opening in the respective insulative layer.
7. The semiconductor package of claim 4, where the peripheral input-output pads and the at least one central input-output pad of the chip are each electrically connected to the first side of the lead or the first side of the chip mounting substrate, respectively, by an anisotropic conductive film.
8. The semiconductor package of claim 1, where the peripheral input-output pads of the chip are each electrically connected to the first side of the respective lead by a reflowed metal ball.
9. The semiconductor package of claim 8, further comprising a discrete insulative layer on the first side of each of the leads, wherein the insulative layer is covered by the encapsulating material and the respective reflowed metal ball extends through an opening in the respective insulative layer.
10. The semiconductor package of claim 1, where the peripheral input-output pads of the chip are each electrically connected to the first side of the respective lead by an anisotropic conductive film.
11. The semiconductor package of claim 1, further comprising a conductive ball fused to each exposed second surface of the second side of the leads.
12. The semiconductor package of claim 2, further comprising a conductive ball fused to each exposed first surface of the second side of the leads.
13. The semiconductor package of claim 11, wherein a conductive paste or a plurality of conductive balls are on the central surface of the second side of the chip mounting substrate.
14. A semiconductor package comprising:
a plurality of horizontal metal leads, each lead having a first side, and an opposite second side having at least one horizontal first surface and at least one horizontal second surface recessed from the first surface;
a chip mounting substrate having a first side and an opposite second side, said second side having a horizontal central surface and a horizontal peripheral surface fully around and recessed from the central surface;
a semiconductor chip in a flip chip electrical connection with the first side of the leads and the first side of the chip mounting substrate; and
a package body formed of a hardened encapsulating material, wherein the encapsulating material covers the semiconductor chip, the recessed peripheral surface of the second side of the chip mounting substrate, and the recessed second surface of the second side of the leads, while the central surface of the second side of the chip mounting substrate and the at least one first surface of the second side of the leads are exposed at a horizontal first exterior surface of the package body.
15. The semiconductor package of claim 14, further comprising a discrete insulative layer on the first side of the leads and the first side of the chip mounting substrate, wherein the insulative layer is covered by the encapsulating material, and the chip is electrically connected to the first side of the respective lead and the first side of the chip mounting substrate through an opening in the respective insulating layer.
16. A semiconductor package comprising:
a plurality of horizontal metal leads, each lead having a first side, and an opposite second side having at least one horizontal first surface and at least one horizontal second surface recessed from the first surface;
a chip mounting substrate having a first side and an opposite second side, said second side having a horizontal central surface and a horizontal peripheral surface fully around and recessed from the central surface;
a plurality of insulative layers, wherein a respective one of the insulative layers is on the first side of the leads and the first side of the chip mounting substrate;
a semiconductor chip in a flip chip electrical connection with the first side of the leads and the first side of the chip mounting substrate through the respective insulative layer; and
a package body formed of a hardened encapsulating material, wherein the encapsulating material covers the semiconductor chip and the insulative layers, the recessed peripheral surface of the second side of the chip mounting substrate, and the recessed second surface of the second side of the leads, while said central surface of the second side of the chip mounting substrate and the at least one first surface of the second side of the leads are exposed at a horizontal first exterior surface of the package body.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An image support device comprising a frame and an interior support surface within the frame, the interior support surface having a front face, a back surface, a bottom and a top,
the support surface having secured thereto a visible light transmitting panel,
the light transmitting panel having a hinge towards the bottom of the support surface enabling a top of the light transmitting panel to be pulled away from the support surface in a non-destructive manner to create an opening behind the light transmitting panel;
the opening behind the light transmitting panel being able to return by elastic or spring tension to provide tension to an image placed behind the light transmitting panel; and
the top or the back of the interior support surface having at least part of a wall connecting system attached thereto,
wherein the front face of the light transmitting panel forms a living hinge with a flat back panel that is secured to the support surface such that when the top of the light transmitting panel is pulled forward, the flat back panel remains secured to the interior support surface, wherein the light transmitting panel comprises a light transmitting polymer having a white light transmission optical density of less than 0.2, wherein the light transmitting panel and the flat back panel have a height that is between 2.5 and 6 inches and the top of the light transmitting panel can be pulled forward to create an opening of at least 0.25 inches without visibly cracking the living hinge after 500 repetitions of opening and closing to form a gap of 0.25 inches, wherein the top of the light transmitting panel rests against a resistant surface by elastic tension in the living hinge and no physical restraints are present that otherwise directly contact or restrain the top edge, wherein the wall connecting device comprises a first component comprising an elongate wire, string, cord or cable, and wherein the wall connecting device further comprises a continuous, coiled flexible material that has coils of the continuous, coiled flexible material looped through the first component to that when the continuous, coiled flexible material is supported, the first component is tensed and the device is supported.
2. The device of claim 1 wherein the top of the light transmitting panel rests against a resistant surface by elastic tension in the living hinge and no physical restraints are present that otherwise directly contact or restrain the top edge.
3. An image support device comprising a frame and an interior support surface within the frame, the interior support surface having a front face, a back surface, a bottom and a top,
the support surface having secured thereto a visible light transmitting panel,
the light transmitting panel having a hinge towards the bottom of the support surface enabling a top of the light transmitting panel to be pulled away from the support surface in a non-destructive manner to create an opening behind the light transmitting panel;
the opening behind the light transmitting panel being able to return by elastic or spring tension to provide tension to an image placed behind the light transmitting panel; and
the top or the back of the interior support surface having at least part of a wall connecting system attached thereto,

wherein the front face of the light transmitting panel forms a living hinge with a flat back panel that is secured to the support surface such that when the top of the light transmitting panel is pulled forward, the flat back panel remains secured to the interior support surface, wherein the light transmitting panel comprises a light transmitting polymer having a white light transmission optical density of less than 0.2, wherein an opaque layer is secured to a surface of the flat back panel.
4. The device of claim 3 wherein the wall connecting device further comprises a continuous, coiled flexible material that has coils of the continuous, coiled flexible material looped through the first component to that when the continuous, coiled flexible material is supported, the first component is tensed and the device is supported.
5. The device of claim 3 wherein the top of the light transmitting panel rests against a resistant surface by elastic tension in the living hinge and no physical restraints are present that otherwise directly contact or restrain the top edge.
6. The device of claim 4 wherein the top of the light transmitting panel rests against a resistant surface by elastic tension in the living hinge and no physical restraints are present that otherwise directly contact or restrain the top edge.
7. An image support device comprising a frame and an interior support surface within the frame, the interior support surface having a front face, a back surface, a bottom and a top,
the support surface having secured thereto a visible light transmitting panel,
the light transmitting panel having a hinge towards the bottom of the support surface enabling a top of the light transmitting panel to be pulled away from the support surface in a non-destructive manner to create an opening behind the light transmitting panel;
the opening behind the light transmitting panel being able to return by elastic or spring tension to provide tension to an image placed behind the light transmitting panel; and
the top or the back of the interior support surface having at least part of a wall connecting system attached thereto,