1. A dipole antenna, comprising:
a substrate, made of a dielectric material, wherein said substrate has a first surface and a second surface which is essentially parallel to said first surface;
a first radiator, formed on said first surface;
a second radiator, formed on a portion of said second surface, wherein said portion of said second surface is not overlapped with an area of said second surface on which said first radiator is projected;
a first feeding point, installed on one end of said first radiator near said second radiator; and
a second feeding point, installed on the area of said first surface adjacent to said first feeding point, wherein said second feeding point is electrically connected to said second radiator, wherein
said substrate comprises at least one first metallic layer aligned with said first radiator; and at least one second metallic layer aligned with said second radiator, and said second metallic layer is electrically connected to said second radiator.
2. The dipole antenna of claim 1, wherein said substrate is a printed circuit board.
3. The dipole antenna of claim 2, wherein said first radiator and said second radiator are printed on said printed circuit board.
4. The dipole antenna of claim 1, wherein said first radiator is essentially identical to said second radiator in geometrical shape.
5. The dipole antenna of claim 1, wherein said first radiator and said second radiator are essentially rectangular.
6. The dipole antenna of claim 1, wherein said first radiator and said second radiator are skew-symmetrical to each other on said substrate.
7. The dipole antenna of claim 7, wherein said substrate is a multi-layered structure containing said first metallic layer and said second metallic layer.
8. The dipole antenna of claim 1, wherein said second feeding point, said second metallic layer and said second radiator are electrically connected by means of a via.
9. The dipole antenna of claim 1, wherein said substrate is a multi-layered printed circuit board.
10. A dipole antenna, comprising:
a substrate, made of a dielectric material, wherein said substrate has a first surface and a second surface which is essentially parallel to said first surface, said substrate comprising:
at least one first metallic layer, which is aligned with a first radiator; and
at least one second metallic layer, which aligned with a second radiator, and said second metallic layer is electrically connected to said second radiator;
said first radiator is formed on said first surface;
said second radiator is formed on a portion of said second surface, wherein said portion of said second surface is not overlapped with an area of said second surface on which said first radiator is projected;
a first feeding point, installed on one end of said first radiator near said second radiator; and
a second feeding point, installed on an area of said first surface adjacent to said first feeding point, wherein said second feeding point is electrically connected to said second radiator.
11. The dipole antenna of claim 10, wherein said substrate is a printed circuit board.
12. The dipole antenna of claim 11, wherein said first radiator and said second radiator are printed on said printed circuit board.
13. The dipole antenna of claim 10, wherein said first radiator is essentially identical to said second radiator in geometrical shape.
14. The dipole antenna of claim 10, wherein said first radiator and said second radiator are essentially rectangles.
15. The dipole antenna of claim 10, wherein said first radiator and said second radiator are skew-symmetrical to each other in said substrate.
16. The dipole antenna of claim 10, wherein said substrate is a multi-layered structure containing said first metallic layer and said second metallic layer.
17. The dipole antenna of claim 10, wherein said second feeding point, said second metallic layer and said second radiator are electrically connected by means of a via.
18. The dipole antenna of claim 10, wherein said substrate is a multi-layered printed circuit board.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for manufacturing an electronic device, said method comprising:
electroless plating an electronic device having an embedded interconnect structure with an electroless Ni\u2014B plating liquid to form a protective layer of a Ni\u2014B alloy film having a thickness of 10 to 100 nm selectively on a surface of an interconnect of said electronic device;
wherein said electroless Ni\u2014B plating liquid comprises nickel ions, a complex agent for nickel ions, a reducing agent for nickel ions, and ammonium ions (NH4+).
2. The method according to claim 1, wherein said Ni\u2014B alloy film has an FCC crystalline structure.
3. The method according to claim 1, wherein said Ni\u2014B alloy film has a boron content within the range from 0.01 at % to 10 at %.
4. The method according to claim 1, wherein said ammonium ions are prepared from ammonia water.
5. The method according to claim 1, wherein a pH of said electroless Ni\u2014B plating liquid is adjusted within the range from 8 to 12.
6. The method according to claim 1, wherein a temperature of said electroless Ni\u2014B plating liquid is adjusted within the range from 50\xb0 C. to 90\xb0 C.