1. A semiconductor structure for dissipating heat away from a resistor having neighboring devices and interconnects, comprising:
a semiconductor substrate;
a resistor disposed above the semiconductor substrate; and
a thermal protection structure disposed above the resistor, the thermal protection structure having a plurality of heat dissipating elements, the plurality of heat dissipating elements having one end disposed in thermal conductive contact with the thermal protection structure and the other end in thermal conductive contact with the semiconductor substrate, the thermal protection structure for receiving heat generated by the resistor and the plurality of heat dissipating elements for dissipating the heat generated by the resistor through the semiconductor substrate.
2. The semiconductor structure of claim 1, further comprising an isolation region formed above the semiconductor substrate, wherein the resistor is formed above the isolation region.
3. The semiconductor structure of claim 1, wherein the thermal protection structure comprises a metal cap layer.
4. The semiconductor structure of claim 3, wherein the plurality of heat dissipating elements are disposed along the metal cap layer.
5. The semiconductor structure of claim 3, wherein the plurality of heat dissipating elements are disposed substantially around the metal cap layer.
6. The semiconductor structure of claim 3, wherein each of the plurality of heat dissipating elements comprises a contact stack.
7. The semiconductor structure of claim 3, wherein the plurality of heat dissipating elements comprise two or more contact bars, each of the contact bars running substantially parallel to a side edge of the metal cap layer.
8. The semiconductor structure of claim 1, wherein the thermal protection structure comprises a plurality of separated metal cap layers, each of the plurality of separated metal cap layers having one or more heat dissipating elements in thermal contact therewith.
9. The semiconductor structure of claim 1, further comprising one or more terminal contacts formed on ends of the resistor.
10. A resistor structure for reducing thermal impact on neighboring devices and interconnects, comprising:
a semiconductor substrate;
a resistor disposed above the semiconductor substrate; and
a thermal protection structure disposed above the resistor, the thermal protection structure having a plurality of heat dissipating elements, the plurality of heat dissipating elements having one end disposed in thermal conductive contact with the thermal protection structure and the other end in thermal conductive contact with the semiconductor substrate, the thermal protection structure for receiving heat generated by the resistor and the plurality of heat dissipating elements for dissipating the heat generated by the resistor through the semiconductor substrate.
11. The resistor structure of claim 10, wherein the resistor is formed from a material comprising one of polysilicon, tantalum nitride, titanium nitride, tungsten, aluminum alloy, titanium alloy or copper alloy.
12. The resistor structure of claim 10, wherein the thermal protection structure comprises a metal cap layer.
13. The resistor structure of claim 12, wherein the plurality of heat dissipating elements are disposed substantially around the metal cap layer.
14. The resistor structure of claim 12, wherein each of the plurality of heat dissipating elements comprises a contact stack.
15. The resistor structure of claim 12, wherein the plurality of heat dissipating elements comprise two or more contact bars, each of the contact bars running substantially parallel to a side edge of the metal cap layer.
16. A method for forming a semiconductor structure for dissipating heat away from a resistor and neighboring devices and interconnects, comprising:
providing a semiconductor substrate;
forming a resistor above the semiconductor substrate;
forming a thermal protection structure disposed above the resistor; and
forming a plurality of heat dissipating elements, the plurality of heat dissipating elements having one end disposed in thermal conductive contact with the thermal protection structure and the other end in thermal conductive contact with the semiconductor substrate, the thermal protection structure for receiving heat generated by the resistor and the plurality of heat dissipating elements for dissipating the heat generated by the resistor through the semiconductor substrate.
17. The method of claim 16, further comprising forming an isolation region above the semiconductor substrate, wherein the resistor is formed above the isolation region.
18. The method of claim 16, wherein the thermal protection structure comprises a metal cap layer.
19. The method of claim 18, wherein the plurality of heat dissipating elements are disposed substantially around the metal cap layer.
20. The method of claim 18, wherein each of the plurality of heat dissipating elements comprises a contact stack.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A composition, comprising:
a disinfectant;
an alkaline substance that imparts an alkaline pH to the composition; and
about 0.0001 wt % to about 0.01 wt % of a pH indicator dye that visually expresses a color at about the alkaline pH or a higher pH.
2. The composition of claim 1, wherein the alkaline substance is NaOH, KOH, or combinations thereof.
3. The composition of claim 1, wherein the pH indicator is thymolphthalien, bromothyol blue, phenolphthalein, or combinations thereof.
4. The composition of claim 1, wherein the alkaline pH is about 7.3 or higher.
5. The composition of claim 4, wherein the alkaline pH is about 12.0 to about 12.5.
6. The composition of claim 1, further comprising a surfactant.
7. The composition of claim 1, wherein the disinfectant includes an alcohol, an aldehyde, an oxidizing agent, a phenol, a peroxide, a quat, a hypochlorite, or combinations thereof.
8. The composition of claim 1, wherein the disinfectant includes:
about 0.5 wt % to about 8.0 wt % hydrogen peroxide, carbamide, urea, or combinations thereof;
about 0.5 wt % to about 8.0 wt % aliphatic ethoxylate;
about 5.0 wt % to about 20.0 wt % ethanol; and
about 0.5 wt % to about 8.0 wt % carbomer.
9. The composition of claim 1, wherein the disinfectant includes:
about 0.5 wt % to 8.0 wt % benzalkonium;
about 0.5 wt % to 8.0 wt % cocamidopropyl betaine;
about 0.5 wt % to 8.0 wt % polyquaternium;
about 0.5 wt % to 8.0 wt % tetramethylammonium hydroxide;
about 0.5 wt % to 8.0 wt % aliphatic ethoxylate;
about 5.0 wt % to 20.0 wt % ethanol; and
about 0.5 wt % to about 8.0 wt % carbomer.
10. The composition of claim 1, wherein the disinfectant includes:
about 0.5 wt % to 8.0 wt % NaOCl;
about 0.5 wt % to 5.0 wt % triethanolamine
about 0.5 wt % to 8.0 wt % cocamidopropyl betaine;
about 0.5 wt % to 8.0 wt % aliphatic ethoxylate; and
about 0.5 wt % to about 8.0 wt % carbomer; and
wherein the alkaline substance includes about 0.1 wt % to about 1.0 wt % NaOH.
11. The composition of claim 1, wherein the disinfectant includes:
about 10.0 wt % to 80.0 wt % ethanol, propanol, or combinations thereof;
about 5.0 wt % to 40.0 wt % water;
about 0.2 wt % to 4.0 wt % and biodegradable non-ionic surfactant;
about 0.2 wt % to 4.0 wt % anti-corrosive;
about 0.2 wt % to 4.0 wt % wetting agent;
about 0.2 wt % to 4.0 wt % chlorhexidine gluconate; and
about 0.1 wt % to 1.0 wt % propylene glycol.
12. A disinfecting composition, comprising:
about 10 wt % to about 80 wt % ethanol, propanol, or combinations thereof;
about 0.4 wt % to about 4.0 wt % chlorhexidine gluconate;
about 0.2 wt % to about 4.0 wt % non-ionic surfactant that includes ethylene oxide, propylene, or combinations thereof; and
about 0.0001 wt % to about 0.01 wt % pH indicator dye that visually expresses a color when the composition has an alkaline pH.
13. A disinfectant dispensing system, comprising:
a container suitable for housing a composition; and
a pump coupled to the container that includes a nozzle and that is in fluid communication with the composition, the pump being configured to dispense the composition from the nozzle by injecting air into the container to displace the composition;
wherein the composition includes:
a disinfectant;
an alkaline substance that imparts an alkaline pH to the composition, and
about 0.0001 wt % to about 0.01 wt % of a pH indicator dye that visually expresses a color at about the alkaline pH or a higher pH.
14. The disinfectant dispensing system of claim 13, wherein the pump includes a tube that extends into the container and is in fluid communication with the composition.
15. (canceled)
16. The disinfectant dispensing system of claim 13, wherein air enters the container only when the composition within the container is dispensed by the pump.
17. The disinfectant dispensing system of claim 13, wherein the container is made of plastic, glass, metal, or combinations thereof.
18. The disinfectant dispensing system of claim 13, wherein the container has an internal volume of about 8 mL to about 50 mL.
19. The disinfectant dispensing system of claim 13, wherein the air injected into the container contacts the composition within the container.
20. The disinfectant dispensing system of claim 13, wherein the pump is removably coupled to the container.
21. A method for disinfecting a surface, comprising:
spraying the composition of any of claim 1 on a surface; and
allowing sufficient time to pass such that the sprayed composition does not express a color.
22. The composition of claim 13, wherein the pH indicator dye in the container visually expresses the color after air has been injected into the container by the pump.
23. The disinfectant dispensing system of claim 13, wherein the alkaline substance is NaOH, KOH, or combinations thereof.
24. The disinfectant dispensing system of claim 13, wherein the pH indicator is thymolphthalien, bromothyol blue, phenolphthalein, or combinations thereof.
25. The disinfectant dispensing system of claim 13, wherein the alkaline pH is about 7.3 or higher.
25. The disinfectant dispensing system of claim 13, wherein the disinfectant includes a surfactant, an alcohol, an aldehyde, an oxidizing agent, a phenol, a peroxide, a quat, a hypochlorite, or combinations thereof.