What is claimed is:
1. A method of cutting off a fuse electrode among a plurality of fuse electrodes extending parallel to each other, comprising the steps of:
setting cutting positions on adjacent fuse electrodes to positions which are different from each other in a direction in which the fuse electrodes extend; and
applying a laser beam to each of said cutting positions to cut off each of said adjacent fuse electrodes.
2. A method of cutting off a fuse electrode among a plurality of fuse electrodes extending parallel to each other and including adjacent fuse electrodes disposed in respective layers which are different from each other, comprising the steps of:
focusing a laser beam onto a fuse electrode in one of the layers to be cut off; and
cutting off only said fuse electrode onto which said laser beam is focused, with the laser beam at a predetermined position thereon.
3. An apparatus for cutting off a fuse electrode among a plurality of fuse electrodes extending parallel to each other and disposed in an integrated circuit device, comprising:
a holding stage for holding said integrated circuit device in a predetermined position;
a laser unit for applying a laser beam to cut off the fuse electrode to said integrated circuit device held by said holding stage;
a slide unit for moving said holding stage in a predetermined direction; and
an operation controller for setting cutting positions on adjacent fuse electrodes to positions which are different from each other in a direction in which the fuse electrodes extend, and controlling said laser unit and said slide unit to apply a laser beam to each of said cutting positions.
4. An apparatus for cutting off a fuse electrode among a plurality of fuse electrodes extending parallel to each other and disposed in an integrated circuit device, said fuse electrodes including adjacent fuse electrodes disposed in respective layers which are different from each other, comprising:
a holding stage for holding said integrated circuit device in a predetermined position;
a laser unit for applying a laser beam to cut off the fuse electrode to said integrated circuit device held by said holding stage;
a slide unit for moving said holding stage in a predetermined direction; and
an operation controller for controlling said laser unit and said slide unit to apply a laser beam to the fuse electrode, and controlling said laser unit to focus the laser beam onto only the fuse electrode to be cut off.
5. An integrated circuit device comprising:
a plurality of fuse electrodes extending parallel to each other; and
a plurality of windows associated respectively with said fuse electrodes, said windows including windows associated respectively with adjacent ones of said fuse electrodes and disposed in respective positions which are different from each other in a direction in which the fuse electrodes extend, said windows being defined by an insulating film having a thickness which allows a laser beam to pass therethrough to cut off the fuse electrodes.
6. The integrated circuit device according to claim 5, wherein said insulating film includes a region other than said windows, said region having a thickness which prevents said laser beam from damaging the fuse electrodes.
7. An integrated circuit device comprising:
a plurality of fuse electrodes extending parallel to each other and including adjacent fuse electrodes disposed in respective layers which are different from each other; and
a cover layer disposed on said fuse electrodes and comprising an insulating film having a thickness which allows a laser beam to pass therethrough to cut off the fuse electrodes.
8. A method of manufacturing an integrated circuit device having a plurality of fuse electrodes extending parallel to each other, a plurality of windows associated respectively with said fuse electrodes, said windows including windows associated respectively with adjacent ones of said fuse electrodes and disposed in respective positions which are different from each other in a direction in which the fuse electrodes extend, said windows being defined by an insulating film having a thickness which allows a laser beam to pass therethrough to cut off the fuse electrodes, and a logic circuit having a wiring pattern, said method comprising the steps of:
fabricating said fuse electrodes together with the wiring pattern of said logic circuit;
growing an insulating layer on said fuse electrodes and said wiring pattern; and
defining a contact hole and said windows in said insulating layer, said contact hole reaching said wiring pattern.
9. The method according to claim 8, wherein said step of growing an insulating layer comprises the step of growing said insulating layer to a thickness which prevents said laser beam from damaging the fuse electrodes, in a region other than said windows.
10. A method of manufacturing an integrated circuit device comprising a plurality of fuse electrodes extending parallel to each other and including adjacent fuse electrodes disposed in respective layers which are different from each other, a cover layer disposed on said fuse electrodes and comprising an insulating film having a thickness which allows a laser beam to pass therethrough to cut off the fuse electrodes, and a logic circuit having a plurality of wiring patterns disposed in respective layers, said method comprising the steps of:
fabricating said wiring pattern and said fuse electrodes together in each of said layers;
defining a contact hole reaching the wiring pattern in one of said layers, and removing the insulating film over the fuse electrodes in the same layer as said one of the layers while leaving predetermined thickness thereof; and
depositing a cover layer having a predetermined thickness over the fuse electrodes in each of the layers.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electrical connector for use in forming a terminal connection, comprising:
a) a terminal post for receiving at least one wire lead to be welded thereto;
b) a sleeve for covering said at least one wire lead and for being welded thereto; and
c) a foldable strap formed integrally with said terminal post and said sleeve and extending between said terminal post and said sleeve for positioning said sleeve respective of said at least one wire lead.
2. A connector in accordance with claim 1 further comprising a spade lug formed integrally of said connector.
3. A connector in accordance with claim 1 wherein said connector is formed by stamping a blank from sheet stock and subsequent folding of said blank.
4. An electrical device comprising a wire lead attached to an electrical connector, wherein said connector includes
a terminal post for receiving at least one wire of said wire lead to be welded thereto,
a sleeve for covering said at least one wire for being welded thereto, and
a foldable strap formed integrally with said terminal post and said sleeve and extending between said terminal post and said sleeve for positioning said sleeve respective of said at least one wire.