1. A composite material, comprising:
a ballistic fabric substrate comprising at least one surface comprising a layer of polymer coating comprising a foam comprising an acrylic resin and a polyurethane resin,
wherein polymer coating is applied on the surface in an amount ranging between 1-30 g of dry polymerized resin per square meter of substrate surface.
2. The composite material of claim 1, wherein the polymer coating is applied on one or both faces of the fabric substrate.
3. The composite material of claim 1, wherein a weight ratio, polyurethane resin:acrylic resin, by weight of dry resins, in the foam ranges between 1:20 and 1:1.
4. Composite The composite material of claim 1, wherein the ballistic fabric substrate comprises at least one fiber comprising at least one material selected from the group consisting of a polyvinyl alcohol, a polyacrylonitrile, a polybenzobisoxazole, a polyolefin, a polyimide, a polyaramide, a polyamide, carbon, a glass.
5. The composite material of claim 1, wherein the substrate comprises at least one selected from the group consisting of a unidirectional fabric, a multidirectional fabric, and a non-woven fabric.
6. A laminated multilayer system, comprising:
two or more layers of the composite material of claim 1; and
a layer of bonding material,
wherein the bonding material is interposed between the layers of the composite material.
7. The system of claim 6, comprising 2 to 4 layers of the composite material.
8. A multilayer packet, comprising:
a plurality of overlapped elements,
wherein each element comprises a layer of the composite material of claim 1
or
a laminated multilayer system comprising:
two or more layers of the composite material; and
a layer of bonding material,
wherein the bonding material is interposed between the layers of the composite material.
9. An article, comprising:
the laminated composite material of claim 1.
10. An article, comprising:
the multilayer system of claim 7.
11. An article, comprising:
the packet of claim 8.
12. A method for preparing the composite material of claim 1, the method comprising
(a) applying, through foaming, on at least one surface of a ballistic fabric substrate, a mixture comprising an acrylic resin and a polyurethane resin,
wherein the mixture is applied on the surface in an amount ranging between 1-30 g of dry polymerized resin per square meter of surface;
b) subjecting the composition to a polymerization treatment and forming on the surface a layer of polymer coating.
13. The method of claim 12, wherein a weight ratio, polyurethane resin:acrylic resin, by weight of dry resins, in the mixture ranges between 1:20 and 1:1.
14. The method of claim 12, wherein the polymerization treatment is carried out by heating at a temperature ranging between 130\xb0 C. and 210\xb0 C. for a period of time ranging between 1 and 3 minutes.
15. The method of claim 12, wherein, during the applying (a), the mixture has a density ranging between 100-220 gdm3.
16. The material of claim 1, wherein the polymer coating is applied on the surface in an amount ranging between 2-15 g of dry polymerized resin per square meter of substrate surface.
17. The material of claim 1, wherein the polymer coating is applied on the surface in an amount ranging between 2-10 g of dry polymerized resin per square meter of substrate surface.
18. The material of claim 1, wherein a weight ratio, polyurethane resin:acrylic resin, by weight of dry resins, in the foam ranges between 1:10 and 1:3.
19. The material of claim 1, the ballistic fabric substrate comprises at least one fiber comprising at least one material selected from the group consisting of aramide, para-aramide, and polyethylene.
20. The material of claim 1, wherein the ballistic fabric substrate comprises an aramide fibre, a para-aramid fibre, and a polyethylene fibre.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of manufacturing a wireless identification device, the method comprising:
supporting circuitry on a film substrate to provide a signal to identify the device in response to an interrogation signal;
coupling the circuitry to a power supply;
causing the circuitry to stop providing the signal to identify the device in response to receiving an off signal; and
flowing an encapsulant over the circuitry to define a housing including the encapsulant and the substrate.
2. A method of manufacturing a wireless identification device in accordance with claim 1 wherein the circuitry includes a backscatter transmitter.
3. A method of manufacturing a wireless identification device in accordance with claim 1, wherein the circuitry is configured to provide a backscatter signal to identify the device in response to the interrogation signal.
4. A method of manufacturing a wireless identification device in accordance with claim 1, wherein the substrate is a polyester substrate.
5. A method of manufacturing a radio frequency identification device, the method comprising:
supporting circuitry on a film substrate, the circuitry being configured to provide an RF backscatter signal to identify the device in response to an RF interrogation signal from an interrogator, the circuitry being configured to, in response to an off signal, stop providing the RF signal to identify the device in response to RF interrogation;
coupling the circuitry to a power supply; and
flowing an encapsulant over the circuitry to define a housing including the encapsulant and the substrate.
6. A method of manufacturing a radio frequency identification device in accordance with claim 5 wherein the circuitry includes volatile memory.
7. A method of manufacturing a radio frequency identification device in accordance with claim 5 wherein the power supply comprises a coil configured to receive power from an interrogator by magnetic coupling.
8. A method of manufacturing a radio frequency identification device in accordance with claim 5 wherein the substrate is a polyester film substrate.
9. A method of manufacturing a radio frequency identification device in accordance with claim 5 wherein the circuitry includes an integrated circuit including a transmitter and a receiver.
10. A method of manufacturing a radio frequency identification device in accordance with claim 9 wherein the circuitry includes printed thick film formed over the substrate.
11. A method of manufacturing a radio frequency identification device in accordance with claim 5 wherein the circuitry includes printed thick film formed over the substrate.
12. A method of manufacturing a radio frequency identification device in accordance with claim 5 wherein the circuitry is configured to provide the signal to identify the device to the interrogator by magnetic coupling.
13. A wireless identification device comprising:
a film substrate;
circuitry supported on the film substrate, the circuitry being configured to provide an wireless signal to identify the device in response to a wireless interrogation signal from an interrogator, the circuitry being further configured to, in response to an off signal, stop providing the wireless signal to identify the device in response to wireless interrogation;
a power supply coupled to the circuitry; and
an encapsulant over the circuitry and defining, with the film substrate, a housing.
14. A wireless identification device in accordance with claim 13 wherein the circuitry includes volatile memory.
15. A wireless identification device in accordance with claim 13 wherein the circuitry is configured to provide the signal to identify the device to the interrogator by magnetic coupling.
16. A wireless identification device in accordance with claim 13 wherein the circuitry includes a coil configured to receive power from an interrogator by magnetic coupling.
17. A wireless identification device in accordance with claim 13 wherein the substrate is a polyester film substrate.
18. A wireless identification device in accordance with claim 13 wherein the circuitry includes an integrated circuit including a transmitter and a receiver.
19. A wireless identification device in accordance with claim 18 wherein the circuitry includes printed thick film formed over the substrate.
20. A wireless identification device in accordance with claim 13 wherein the circuitry includes printed thick film formed over the substrate.
21. A method of using a wireless identification device including a film substrate; circuitry supported on the film substrate, the circuitry being configured to provide an wireless signal to identify the device in response to a wireless interrogation signal from an interrogator, the circuitry being further configured to, in response to an off signal, stop providing the wireless signal to identify the device in response to wireless interrogation; a power supply coupled to the circuitry; and an encapsulant over the circuitry and defining, with the film substrate, a housing, the method comprising:
receiving, at the device, a signal indicative of a desire by a user that the circuitry cease identifying the device to an interrogator; and
in response to the cease identifying signal, the circuitry ceasing to provide the wireless signal to identify the device responsive to wireless interrogation.
22. A method in accordance with claim 21 wherein the substrate is a polyester substrate.
23. A method in accordance with claim 21 wherein the circuitry includes volatile memory.
24. A method in accordance with claim 21 wherein the circuitry is configured to provide the signal to identify the device to the interrogator by magnetic coupling.
25. A method in accordance with claim 21 wherein the circuitry includes a coil configured to receive power from an interrogator by magnetic coupling.
26. A method in accordance with claim 21 wherein the circuitry includes an integrated circuit including a transmitter and a receiver.
27. A method in accordance with claim 26 wherein the circuitry includes printed thick film formed over the substrate.
28. A method in accordance with claim 21 wherein the circuitry includes printed thick film formed over the substrate.
29. A wireless identification device comprising:
means defining a flexible substrate;
circuitry supported on the film substrate, the circuitry including means for providing an wireless signal to identify the device in response to a wireless interrogation signal from an interrogator, the circuitry being further configured to, in response to an off signal, stop providing the wireless signal to identify the device in response to wireless interrogation;
means for supplying power supply to the circuitry; and
means, including an encapsulant over the circuitry, defining a housing with the film substrate.
30. A wireless identification device in accordance with claim 29 wherein the means defining a flexible substrate comprises polyester.
31. A wireless identification device in accordance with claim 29 wherein the circuitry includes volatile memory.
32. A wireless identification device in accordance with claim 29 wherein the circuitry is configured to provide the signal to identify the device to the interrogator by magnetic coupling.
33. A wireless identification device in accordance with claim 29 wherein the circuitry includes a coil configured to receive power from an interrogator by magnetic coupling.
34. A wireless identification device in accordance with claim 29 wherein the means defining a flexible substrate comprises a polyester film.
35. A wireless identification device in accordance with claim 29 wherein the circuitry includes an integrated circuit including a transmitter and a receiver.
36. A wireless identification device in accordance with claim 29 wherein the circuitry includes printed thick film formed over the substrate means.
37. A wireless identification device in accordance with claim 35 wherein the circuitry includes printed thick film formed over the substrate.