I claim:
1. An apparatus comprising:
a first and second pipe segment each having a core and a composite reinforcement circumferentially surrounding the core, each pipe segment further having a first end with a cutback region in which the core is exposed, the first and second pipe segments joined at their respective first ends; and
a joint tape overlaying the cutback region and adhering to the first and second pipe segments.
2. The apparatus of claim 1 wherein the core is comprised of a metal.
3. The apparatus of claim 1 further comprising:
a primer coated on the cut-back portion of the first ends to bind the joint tape to the first ends.
4. The apparatus of claim 1 wherein the joint tape comprises:
an resin saturated reinforcement tape extending circumferentially around the cutback region.
5. The apparatus of claim 4, wherein the resin reinforcement tape is comprised of woven, stitched or laid fabric.
6. The apparatus of claim 4, wherein the resin reinforcement tape is comprised of a warp-dominated fiber material.
7. The apparatus of claim 4 further comprising:
a veil extending circumferentially around the reinforcement lap.
8. The apparatus of claim 1 wherein the joint tape comprises:
an isopolyester resin; and
a plurality of glass fibers seated in the polyester resin.
9. The apparatus of claim 1, wherein the joint tape is further comprised of at least one line of hot melt running in a warp direction to stabilize a plurality of weft fibers.
10. An apparatus comprising:
a first and second pipe segment each having a core and a composite reinforcement means circumferentially surrounding the core to provide hoop strength, each pipe segment further having a first end with a cutback region in which the core is exposed, the first and second segments jointed at their respective first ends; and
a joint tape means circumferentially overlaying the first ends adjacent the cutback region to provide hoop strength.
11. The apparatus of claim 10 comprising:
means for binding the joint tape means to the first ends.
12. An apparatus comprising:
a first and second pipe segment each having a metallic core and a composite reinforcement circumferentially overlaying the metallic core, each pipe segment further having a first end with a cutback region in which the metallic core is exposed, the first and second segments jointed at their respective first ends; and
a joint tape circumferentially overlaying the first and second pipe segments at the cutback region to provide hoop reinforcement.
13. The apparatus of claim 12 further comprising:
a primer coated on the first ends at the cut-back portion to bind the composite joint tape to the first ends.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
We claim:
1. A method of forming Ball Grid Array (BGA) interconnections, comprising the steps of:
providing a first substrate and a second substrate, each having a plurality of conductive pads mounted thereon; and
applying a first mask to the first substrate and a second mask to the second substrate, wherein a first plurality of openings of the first and second masks expose selected conductive pads and have a diameter larger than a diameter of the conductive pads, and a second plurality of openings of the first and second masks expose selected conductive pads and have a diameter smaller than a diameter of the conductive pads.
2. The method of claim 1, further comprising the steps of:
applying a solder paste to the plurality of conductive pads within the first and second plurality of openings of the first mask of the first substrate and the second mask of the second substrate;
placing the conductive pads of the first substrate in a frame having solder balls therein;
reflowing the solder balls onto the conductive pads within the first and second plurality of openings of the first mask on the first substrate;
removing the first substrate, having solder balls attached thereto, from the frame;
aligning the plurality of conductive pads within the first and second plurality of openings of the second mask of the second substrate with the plurality of solder balls attached to the conductive pads within the first and second plurality of openings of the first mask of the first substrate; and
reflowing the solder balls.
3. The method of claim 1, wherein the first and second plurality of openings of the first and second masks having a diameter larger than the diameter of the conductive pads are located in high stress regions of the first and second substrates.
4. The method of claim 3, wherein the high stress regions of the first and second substrates are at the corners andor edges of the first and second substrates.
5. The method of claim 3, wherein the high stress regions of the first and second substrates are at the corners andor edges of a chip within the BGA package.
6. The method of claim 1, wherein the first and second plurality of openings of the first and second masks having a diameter smaller than the diameter of the conductive pads are located in low stress regions of the first and second substrates.
7. The method of claim 3, wherein the BGA interconnections are vertically elongated in the high stress regions.
8. The method of claim 1, wherein the plurality of conductive pads are copper.
9. The method of claim 1, wherein the first substrate is a circuit board.
10. The method of claim 1, wherein the second substrate is a chip module.
11. The method of claim 1, wherein the first and second masks comprise a non-wettable material.
12. The method of claim 11, wherein the non-wettable material is an epoxy.
13. The method of claim 2, wherein the frame is a graphite boat.
14. The method of claim 2, wherein the solder balls are the same size and have the same volume.
15. The method of claim 1, wherein approximately 80-90% of the openings of the first and second masks have a diameter smaller than a diameter of the conductive pads, and approximately 10-20% of the openings of the first and second masks have a diameter greater than a diameter of the conductive pads.
16. A semiconductor package having a series of Ball Grid Array (BGA) interconnections, wherein a plurality of the BGA interconnections are pad-defined solder joints and a plurality of the BGA interconnections are mask-defined solder joints.
17. The semiconductor package of claim 16, wherein the pad-defined solder joints are selectively placed in regions of high stress within the semiconductor package.
18. The semiconductor package of claim 16, wherein the mask-defined solder joints are located in regions of low stress within the semiconductor package.
19. The semiconductor package of claim 16, wherein an equilibrium height of the pad-defined solder joints is increased by the mask-defined solder joints.
20. A method of forming Ball Grid Array (BGA) interconnections having mixed solder profiles, comprising the steps of:
providing a first substrate and a second substrate;
applying a mask to at least one of the first and second substrates, wherein a plurality of openings in the mask produce pad-defined solder joints and a plurality of openings in the mask produce mask-defined solder joints.
21. The method of claim 20, further including the steps of:
applying solder to the openings of the mask;
reflowing the solder onto the first and second substrates.
22. The method of claim 20, wherein the plurality of openings in the mask producing pad-defined solder joints are selectively located in high stress areas of the first and second substrates.
23. A substrate having a series of Ball Grid Array (BGA) interconnections, wherein a plurality of the BGA interconnections are pad-defined solder joints and a plurality of the BGA interconnections are mask-defined solder joints.
24. The substrate of claim 23, wherein the pad-defined solder joints are located in high stress areas of the substrate.
25. The substrate of claim 24, wherein the high stress areas of the substrate are at the edges of the substrate.
26. The substrate of claim 24, wherein the high stress areas of the substrate are at the corners andor edges of the substrate.
27. The substrate of claim 23, wherein a majority of the BGA interconnections are mask-defined solder joints.
28. A solder mask, adapted to be coupled to a substrate having conductive pads thereon, the solder mask having a first plurality of openings and a second plurality of openings, wherein the first plurality of openings are larger than-the conductive pads and the second plurality of openings are smaller than the conductive pads.
29. The solder mask of claim 28, wherein the first plurality of openings are selectively located in high stress regions of the substrate.
30. The solder mask of claim 28, wherein a majority of the openings are selected from the second plurality of openings.