1. A method for manufacturing a capacitor, comprising:
forming a first electrode, wherein forming the first electrode comprises:
forming a first hole in a semiconductor substrate by patterning the semiconductor substrate;
forming a barrier metal on an inner wall of the first hole;
forming a first metal material in the first hole; and
planarizing the first metal material;
forming a first insulation layer on the semiconductor substrate including the first electrode, patterning the first insulation layer to form a second hole aligned with the first hole and a bottom electrode hole;
forming a second electrode, wherein forming the second electrode comprises:
forming a barrier metal on an inner wall of the second hole and the bottom electrode hole;
forming a second metal material in the second hole and the bottom electrode; and
planarizing the second metal material;
forming a dielectric layer on the first insulation layer;
forming top electrodes, wherein forming top electrodes comprises:
forming a second insulation layer on the dielectric insulation layer;
patterning the second insulation layer to form a plurality of top electrode holes;
forming a barrier metal on inner walls of the top electrode holes;
forming a third metal material in the top electrode holes; and
planarizing the third metal material;
forming a passivation layer on the second insulation layer; and
performing a back grind process to expose the first electrode at a bottom surface of the semiconductor substrate.
2. The method according to claim 1, wherein the first hole has a depth of about 50\u02dc500 \u03bcm, and a critical dimension (CD) of about 1\u02dc10 \u03bcm.
3. The method according to claim 1, wherein the barrier metal includes at least one of Ti, TiN, TiTiN, Ta, TaN, TaTaN, TaNTa, Co, Co compound, Ni, Ni compound, W, W compound, and a nitride material, and is deposited with a thickness of about 20\u02dc1000 \u212b using a metal thin film deposition method, the metal thin film deposition method including Physical Vapor Deposition (PVD), Sputtering, Evaporation, Laser Ablation, Atomic Layer Deposition (ALD), or Chemical Vapor Deposition (CVD).
4. The method according to claim 1, wherein:
the first metal material comprises at least one of Al, Al compound, Cu, Cu compound, W, and W compound, the first metal material being formed to have a thickness of about 50\u02dc900 \u03bcm, on the basis of a flat panel, in the first hole using a metal thin film deposition method, the metal thin film deposition method including Physical Vapor Deposition (PVD), Sputtering, Evaporation, Laser Ablation, Electro Copper plating (ECP), Atomic Layer Deposition (ALD), and Chemical Vapor Deposition (CVD); and
wherein planarizing the metal material comprises performing a Chemical Mechanical Polishing (CMP) process or an etch back process.
5. The method according to claim 1, wherein the first insulation layer includes at least one of SiO2, borophosphosilicate glass (BPSG), tetraethyl orthosilicate (TEOS), SiN, and a Low-k material, and is formed to have a thickness of about 50\u02dc10000 \u212b using an electric furnace, a Chemical Vapor Deposition (CVD) apparatus, or a Physical Vapor Deposition (PVD) apparatus.
6. The method according to claim 1, wherein:
the second metal material comprises at least one of Al, Al compound, Cu, Cu compound, W, and W compound, the second metal material being formed to have a thickness of about 100\u02dc15000 \u03bcm, on the basis of a flat panel, in the second hole and the bottom electrode hole using a metal thin film deposition method, the metal thin film deposition method including Physical Vapor Deposition (PVD), Sputtering, Evaporation, Laser Ablation, Electro Copper plating (ECP), Atomic Layer Deposition (ALD), and Chemical Vapor Deposition (CVD); and
wherein planarizing the second metal material comprises performing a Chemical Mechanical Polishing (CMP) process or an etch back process.
7. The method according to claim 1, wherein the dielectric layer includes at least one of SiN, SiO2, borophosphosilicate glass (BPSG), and tetraethyl orthosilicate (TEOS), and is formed to have a thickness of about 5\u02dc5000 \u212b using a metal thin film deposition method in an electric furnace, a Chemical Vapor Deposition (CVD) apparatus, or a Physical Vapor Deposition (PVD) apparatus.
8. The method according to claim 1, wherein the second insulation layer includes at least one of SiO2, borophosphosilicate glass (BPSG), tetraethyl orthosilicate (TEOS), SiN, and a Low-K material, and is formed to have a thickness of about 50\u02dc10000 \u212b using a metal thin film deposition method including Chemical Vapor Deposition (CVD) or Physical Vapor Deposition (PVD).
9. The method according to claim 1, wherein the passivation layer includes at least one of SiO2, borophosphosilicate glass (BPSG), tetraethyl orthosilicate (TEOS), and SiN, and is formed to have a thickness of about 0.3\u02dc5 \u03bcm using a metal thin film deposition method in an electric furnace, a Chemical Vapor Deposition (CVD) apparatus, or a Physical Vapor Deposition (PVD) apparatus.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A computer-implemented method for applying a design to a slide, comprising:
selecting a new design to apply to a slide; wherein the slide includes a layout;
determining an equivalent layout for the slide by comparing the slide’s layout to a layout that is associated with the new design; and
applying the equivalent layout to the slide by mapping the placeholders on the slide to the equivalent layout so that the position of the placeholders on the new slide does not overlap the background content associated with the new design.
2. The method of claim 1, further comprising maintaining any exceptions that are associated with the slide when the equivalent layout is applied to the slide.
3. The method of claim 1, wherein determining the equivalent layout, comprises comparing characteristics that are associated with the slide with characteristics associated with a layout that is associated with the new design.
4. The method of claim 3, further comprising determining at least one of: the name of the layout and the number of the placeholders.
5. The method of claim 1, wherein determining the equivalent layout comprises utilizing at least one of the following determined characteristics: a function of the placeholder and a type of the placeholder.
6. The method of claim 1, further comprising determining when a placeholder on the slide is an equivalent type to a placeholder on the layout associated with the new design.
7. The method of claim 1, further comprising determining when a placeholder on the slide is an equal type to a placeholder on the layout associated with the new design.
8. The method of claim 1, wherein applying the equivalent layout to the slide comprises moving content from placeholders within the slide to placeholders on a new slide that is based on the determined equivalent layout.
9. A computer-readable medium having computer-executable instructions for applying a new design to a slide, the instructions comprising:
matching the slide’s layout with an equivalent layout that is associated with the new design; and
applying the equivalent layout to the slide by mapping the placeholders on the slide to the equivalent layout so that the position of the placeholders on the new slide does not overlap the background content associated with the new design.
10. The computer-readable medium of claim 9, wherein matching the slide’s layout with the equivalent layout that is associated with the new design, comprises determining whether some characteristics associated with the slide are substantially similar to characteristics associated with the new design.
11. The computer-readable medium of claim 10, wherein determining whether some characteristics associated with the slide are substantially similar to characteristics associated with the new design, comprises determining at least one of: the name of the layout and the number of the placeholders.
12. The computer-readable medium of claim 11, wherein determining the equivalence of the placeholders comprises determining when a placeholder on the slide is an equivalent type to a placeholder on a layout associated with the new design.
13. The computer-readable medium of claim 11, wherein determining the equivalence of the placeholders comprises determining when a placeholder on the slide is an equal type to a placeholder on a layout associated with the new design.
14. The computer-readable medium of claim 11, wherein applying the equivalent layout to the slide comprises moving content from the placeholders within the slide to placeholders on a slide that is based on the equivalent layout.
15. The computer-readable medium of claim 11, wherein matching the slide’s layout with the equivalent layout associated with the new design comprises comparing at least one layout associated with the new design to the slide’s layout.
16. The computer-readable medium of claim 11, further comprising copying the slide’s layout to the new design when it is determined that the equivalent layout does not exist.
17. The computer-readable medium of claim 11, further comprising removing any layouts from a design that do not have any dependent slides.
18. An apparatus for applying a new design to a slide, comprising:
a processor and a computer-readable storage that are configured to perform actions comprising;
means for determining an equivalent layout to a slide’s layout by comparing the slide’s layout to a layout that is associated with the new design; and
means for applying the equivalent layout to the slide by mapping the placeholders on the slide to the equivalent layout so that the position of the placeholders on the new slide does not overlap the background content associated with the new design.
19. The apparatus of claim 18, wherein the means for determining the equivalent layout to a slide’s layout comprises means for determining when each placeholder within the slide’s layout is substantially similar to each of the placeholders within a layout that is associated with the new design.
20. The apparatus of claim 18, wherein the means for determining when each placeholder within the slide’s layout is substantially similar to each of the placeholders within a layout that is associated with the new design comprises, means for determining names associated with the layouts, means for determining equivalence of placeholders, and means for determining a number of placeholders.