1. A light fixture control system having a connection established with a light fixture to be driven by an output of a generator of a vehicle and a motor to be driven also by the output of the generator, and controlling a driving current provided to the light fixture and the motor, wherein the driving current to the motor is duty-controlled at the time of driving the light fixture.
2. The light fixture control system according to claim 1, wherein, based on a lapse of time after the duty control is started, an energization time is increased to provide the driving current to the motor.
3. The light fixture control system according to claim 1, wherein between the light fixture and the motor, a parallel connection is established with respect to the generator.
4. The light fixture control system according to claim 1, wherein the motor is a fan motor provided adjacent to a heat source.
5. The light fixture control system according to claim 4, wherein the heat source is a radiator of the vehicle, said fan motor being driven by the generator to air-cool the radiator.
6. The light fixture control system according to claim 5, further comprising a water temperature sensor for measuring water temperature of water in the radiator, said water temperature sensor providing temperature information to a control unit of the light fixture control system.
7. The light fixture control system according to claim 1, wherein no battery is provided in the light fixture control system.
8. The light fixture control system according to claim 1, further comprising a regulator, said regulator being connected to the generator to convert a voltage output from the generator into a voltage value required by the motor and light fixture.
9. A control system, comprising:
a control unit;
a generator;
a light fixture connected to said control unit and said generator, said light fixture being driven by an output of said generator;
a motor connected to said control unit and said generator, said motor being driven by an output of said generator,
wherein said control unit controls a driving current to the light fixture and the motor, and the driving current to the motor is duty-controlled at the time of driving the light fixture.
10. The control system according to claim 9, wherein, based on a lapse of time after the duty control is started, an energization time is increased to provide the driving current to the motor.
11. The control system according to claim 9, wherein between the light fixture and the motor, a parallel connection is established with respect to the generator.
12. The control system according to claim 9, wherein the motor is a fan motor provided adjacent to a heat source.
13. The control system according to claim 12, wherein the heat source is a radiator of a vehicle, said fan motor being driven by the generator to air-cool the radiator.
14. The control system according to claim 13, further comprising a water temperature sensor for measuring water temperature of water in the radiator, said water temperature sensor providing temperature information to the control unit.
15. The control system according to claim 9, wherein no battery is provided in the control system.
16. The control system according to claim 9, further comprising a regulator, said regulator being connected to the generator to convert a voltage output from the generator into a voltage value required by the motor and light fixture.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A light emitting diode (LED) package comprising:
a metal substrate that has one or more via holes formed therein;
an insulating layer that has one or more grooves and is formed on a surface of the metal substrate including inner surfaces of the via holes;
a plurality of metal patterns, of which at least one is formed on a top surface of the insulating layer and of which a different at least one is disposed in the one or more grooves, and which are electrically isolated from one another; and
an LED chip that is mounted on a metal pattern among the plurality of metal patterns,
wherein the metal pattern having the LED chip mounted thereon, among the plurality of metal patterns, is formed on the top surface of the metal substrate.
2. The LED package according to claim 1, wherein any one of the metal patterns formed at the bottom surface of the metal substrate is formed on the bottom surface of the metal substrate which is exposed by partially removing the insulating layer.
3. The LED package according to claim 1 further comprising: a wire that connects the LED chip to a metal pattern on which the LED chip is not mounted.
4. The LED package according to claim 1 further comprising:
a first wire that electrically connects the LED chip to a metal pattern on which the LED chip is not mounted; and
a second wire that electrically connects the LED chip to the metal pattern having the LED chip mounted thereon.
5. The LED package according to claim 1 further comprising:
first and second wires that electrically connect the LED chip to the metal patterns on which the LED chip is not mounted.
6. The LED package according to claim 1,
wherein the metal pattern having the LED chip mounted thereon among the plurality of metal patterns is formed on the top surface of a cavity formed by partially removing the metal substrate.
7. The LED package according to claim 1 further comprising:
a molding portion that covers the LED chip.
8. The LED package according to claim 1,
wherein the metal substrate is composed of aluminum.
9. The LED package according to claim 1,
wherein the insulating layer is formed through an anodizing process.
10. The LED package according to claim 3,
wherein the LED chip is a vertical LED chip.
11. The LED package according to claim 4,
wherein the LED chip is a horizontal LED chip.
12. The LED package according to claim 7,
wherein the molding portion is composed of any one selected from the group consisting of silicon resin, epoxy resin, and epoxy molding compound (EMC).
13. The LED package according to claim 7,
Wherein the molding portions is formed by any one of an injection molding method, a transfer molding method, and a pin gate molding method.
14. The LED package according to claim 7,
wherein the molding portion has a trapezoid, rectangular, or hemispherical cross-section shape.
15. The LED package according to claim 8,
wherein the anodizing process is performed using any one of organic acid, sulfuric acid, and mixed acid thereof.
16. A light emitting diode (LED) package comprising:
a metal substrate having one or more via holes formed therein;
an insulating layer having one or more grooves and formed on a surface of the metal substrate including inner surfaces of the via holes;
a plurality of metal patterns electrically isolated from one another, at least one of which is disposed on a top surface of the insulating layer and a different one of which is disposed in one of the grooves;
an LED chip that is mounted on a metal pattern among the plurality of metal patterns; and
at least one wire that electrically connects the LED chip to the metal patterns on which the LED chip is not mounted,
wherein the metal pattern connected to the at least one wire is formed on the top surface of the metal substrate which is exposed by partially removing the insulating layer.
17. An LED package comprising:
a metal substrate that has two or more via holes;
an insulating layer that has one or more grooves and is formed on a surface of the metal substrate including inner surfaces of the via holes;
a plurality of metal patterns electrically isolated from one another, at least one of which is disposed on a top surface of the insulating layer and at least a different one of which is disposed in one of the grooves; and
a LED chip that is mounted on one of the plurality of metal patterns,
wherein the metal pattern having the LED chip mounted thereon, is disposed on the top surface of the metal substrate.
18. The LED package according to claim 17,
wherein the metal pattern having the LED chip mounted thereon among the plurality of metal patterns is formed on the bottom surface of a cavity formed by partially removing the metal substrate.
19. The LED package according to claim 17 further comprising:
a wire that electrically connects the LED chip to a metal pattern on which the LED chip is not mounted.
20. The LED package according to claim 17,
wherein the LED chip is a vertical LED chip.
21. The LED package according to claim 17 further comprising:
first and second wires that electrically connect the LED chip to the metal patterns on which the LED chip is not mounted.
22. The LED package according to claim 17,
wherein the LED chip has a pair of connection elements formed on the bottom surface thereof, the connection elements being electrically connected to the metal patterns, respectively, which are electrically isolated from each other.
23. The LED package according to claim 17 further comprising:
a molding portion that covers the LED chip.
24. The LED package according to claim 17,
wherein the metal substrate is formed of aluminum.
25. The LED package according to claim 17,
wherein the insulating layer is formed through an anodizing process.
26. The LED package according to claim 17,
wherein the metal substrate has a cavity with a predetermined depth which is provided at a position where the LED chip is mounted.
27. The LED package according to claim 21,
wherein the LED chip has a pair of electrodes disposed in a same direction.
28. The LED package according to claim 22,
wherein the LED chip is a flip-chip LED chip.
29. A method of manufacturing an LED package, comprising:
forming a plurality of via holes passing through a metal substrate;
forming an insulating layer on a surface of the metal substrate including inner surfaces of the via holes;
partially exposing the top and bottom surfaces of the metal substrate by partially removing the insulating layer;
forming a metal layer on the insulating layer including the exposed portions of the metal substrate;
patterning the metal layer so as to form a plurality of metal patterns on the exposed portions of the metal substrate and the insulating layer, the metal patterns being electrically isolated from one another;
mounting LED chips on some metal patterns among the plurality of metal patterns; and
dicing the metal substrate such that each of the diced substrates includes one LED chip and one or more via holes.
30. The method according to claim 29,
wherein the LED chips are mounted on the metal patterns formed on the exposed top surface of the metal substrate.
31. The method according to claim 29 further comprising:
after the mounting of the LED chips;
forming wires which electrically connect the LED chips to the metal patterns; and
forming molding portions which cover the LED chips and the wires.
32. The method according to claim 29 further comprising:
after the exposing of the top and bottom surfaces of the metal substrate,
forming a cavity with a predetermined depth by etching the exposed top surface of the metal substrate.
33. The method according to claim 29,
wherein the dicing of the metal substrate is performed using a dicing blade or cutting mold.
34. The method according to claim 29,
wherein the metal substrate is formed of aluminum.
35. The method according to claim 29,
wherein the insulating layer is formed through an anodizing process.