1. A latching valve, comprising:
a housing;
a supply port defined in the housing;
a delivery port defined in the housing;
an exhaust port defined in the housing;
an apply port defined in the housing, the apply port being sealingly fluidly isolated from the supply port, the delivery port, and the exhaust port;
a release port defined in the housing, the release port being sealingly fluidly isolated from the supply port, the delivery port, and the exhaust port;
a bore defined in the housing, the supply port, the delivery port, the exhaust port, the apply port, and the release port fluidly communicating with the bore; and
a shuttle, sealingly and movably secured in the bore, set to one of an apply position and a release position as a function of respective pilot pressures at the apply and release ports, the delivery port fluidly communicating with the supply port while the shuttle is in the apply position, and the delivery port fluidly communicating with the exhaust port while the shuttle is in the release position.
2. The latching valve as set forth in claim 1, wherein:
the fluid communication between the delivery port and the supply port, while the shuttle is in the apply position, is via the bore and around the shuttle; and
the fluid communication between the delivery port and the exhaust port, while the shuttle is in the release position, is via the bore and around the shuttle.
3. The latching valve as set forth in claim 1, wherein the shuttle includes:
an apply piston having a face in fluid communication with the apply port; and
a release piston having a face in fluid communication with the release port.
4. The latching valve as set forth in claim 3, further including:
an inlet seat in the bore; and
an exhaust seat in the bore;
wherein the shuttle further includes:
a sealing member movably positioned between the inlet seat and the exhaust seat;
wherein the sealing member sealingly engages the exhaust seat while the shuttle is in the apply position; and
wherein the sealing member sealingly engages the inlet seat while the shuttle is in the release position.
5. The latching valve as set forth in claim 4, wherein the apply piston, the release piston, and the sealing member move together as a single unit.
6. The latching valve as set forth in claim 5, wherein:
the apply piston, the release piston, and the sealing member are secured together so the apply piston, the release piston, and the sealing member do not move relative to each other.
7. The latching valve as set forth in claim 6, wherein:
the release piston and the sealing member are secured to the apply piston via respective interference fits.
8. The latching valve as set forth in claim 4, wherein:
while the shuttle is in the release position, a difference in bore diameters at the inlet seat and the apply piston causes a pressure at the supply port to maintain the seal between the sealing member and the inlet seat.
9. The latching valve as set forth in claim 8, wherein:
a ratio of the bore diameter at the apply piston to the bore diameter at the inlet seat is greater than about 1.0.
10. The latching valve as set forth in claim 4, wherein:
while the shuttle is in the apply position, a difference in bore diameters at the exhaust seat and the apply piston causes a pressure at the supply port to maintain the seal between the sealing member and the exhaust seat.
11. The latching valve as set forth in claim 10, wherein:
a ratio of the bore diameter at the exhaust seat to the bore diameter at the apply piston is greater than about 1.0.
12. The latching valve as set forth in claim 1, wherein:
the shuttle is set to the apply position when the apply pilot pressure is applied to the apply port and no pilot pressure is applied to the release port; and
the shuttle is set to the release position when the release pilot pressure is applied to the release port and no pilot pressure is applied to the apply port.
13. The latching valve as set forth in claim 1, wherein:
the shuttle remains set to one of the apply position and the release position when the respective pilot pressures are applied to both the apply port and the release port.
14. A latching valve system, comprising:
a housing;
a supply port defined in the housing;
a delivery port defined in the housing;
an exhaust port defined in the housing;
an apply port defined in the housing, the apply port always being sealingly fluidly independent of the supply port, the delivery port, and the exhaust port;
an apply valve supplying an apply pilot pressure to the apply port as a function of a state of the apply valve;
a release port defined in the housing, the release port always being sealingly fluidly independent of the supply port, the delivery port, and the exhaust port;
a release valve supplying a release pilot pressure to the release port as a function of a state of the release valve;
a bore, defined in the housing, fluidly communicating with the supply port, the delivery port, the exhaust port, the apply port, and the release port; and
a shuttle, sealingly and movably secured in the bore, set to one of an apply position and a release position as a function of the respective apply and release pilot pressures at the apply and release ports, the delivery port fluidly communicating with the supply port while the shuttle is in the apply position, and the delivery port fluidly communicating with the exhaust port while the shuttle is in the release position.
15. The latching valve system as set forth in claim 14, wherein:
after the apply valve supplies the apply pilot pressure, the shuttle remains set to the apply position even after the apply pilot pressure is no longer supplied.
16. The latching valve system as set forth in claim 15, wherein:
after the apply valve supplies the apply pilot pressure, the shuttle remains set to the apply position until the apply valve exhausts the apply pilot pressure and the release valve supplies the release pilot pressure.
17. The latching valve system as set forth in claim 14, wherein:
the apply and release valves are respectively energized to supply the apply pressure and the release pressure; and
the apply and release valves are respectively de-energized to exhaust the apply pressure and the release pressure.
18. The latching valve system as set forth in claim 14, wherein:
an inlet seat is in the bore;
an exhaust seat is in the bore;
the shuttle includes:
an apply piston having a face in fluid communication with the apply port;
a release piston having a face in fluid communication with the release port; and
a sealing member movably positioned between the inlet seat and the exhaust seat, the apply piston, the release piston, and the sealing member moving together as a single unit;
the sealing member sealingly engages the exhaust seat while the shuttle is in the apply position; and
the sealing member sealingly engages the inlet seat while the shuttle is in the release position.
19. A method of controlling a latching valve system, comprising:
determining whether one of a delivery pressure and an exhaust pressure is desired at a delivery port;
if the exhaust pressure is desired at the delivery port:
ensuring an apply pilot pressure is simultaneously not supplied at an apply port and against a face of an apply piston in fluid communication with the apply port;
after the ensuring the apply pilot pressure is not supplied, applying a release pilot pressure at a release port and against a face of a release piston to move the release piston, a sealing member, and the apply piston together as a single unit in a bore so that the single unit is in a release position in the bore and the sealing member seals against an inlet seat in the bore;
creating a fluid communication path between the delivery port and an exhaust port, with the single unit in the path of the fluid communication between the delivery port and the exhaust port when the single unit is in the release position, the path of fluid communication between the delivery port and the exhaust port being sealingly independent of the apply port and the release port;
once the single unit is in the release position in the bore, removing the release pilot pressure from the release port; and
supplying a supply pressure at a supply port for acting on the apply piston and the sealing member to maintain the single unit in the release position.
20. The method of controlling a latching valve system as set forth in claim 19, further including:
if the delivery pressure is desired at the delivery port:
ensuring a release pilot pressure is simultaneously not supplied at the release port and against the face of the release piston in fluid communication with the release port;
after the ensuring the release pilot pressure is not supplied, applying the apply pilot pressure at the apply port and against the face of the apply piston to move the single unit in the bore so that the single unit is in an apply position in the bore and the sealing member seals against an exhaust seat in the bore;
creating a fluid communication path between the delivery port and the supply port, with the single unit in the path of the fluid communication between the delivery port and the supply port when the single unit is in the apply position, the path of fluid communication between the delivery port and the supply port being sealingly independent of the apply port and the release port;
once the single unit is in the apply position in the bore, removing the apply pilot pressure from the apply port; and
supplying the supply pressure at the supply port for acting on the apply piston and the sealing member to maintain the single unit in the apply position.
21. The method of controlling a latching valve system as set forth in claim 20, wherein:
if the exhaust pressure is desired at the delivery port:
the step of ensuring the apply pilot pressure is simultaneously not supplied at the apply port and against the face of an apply piston includes: de-energizing an apply valve;
the step of applying the release pilot pressure at the release port includes: energizing a release valve associated with the release port; and
the step of removing the release pilot pressure from the release port includes: de-energizing the release valve; and
if the delivery pressure is desired at the delivery port:
the step of ensuring the release pilot pressure is simultaneously not supplied at the release port and against the face of the release piston includes:
de-energizing the release valve;
the step of applying the apply pilot pressure at the apply port and against the face of the apply piston includes: energizing the apply valve; and
the step of removing the apply pilot pressure from the apply port includes: de-energizing the apply valve.
22. A latching valve system, comprising:
a housing;
a supply port defined in the housing;
a delivery port defined in the housing;
an exhaust port defined in the housing;
an apply port defined in the housing, the apply port being sealingly fluidly isolated from the supply port, the delivery port, and the exhaust port;
an apply valve supplying an apply pilot pressure to the apply port as a function of a state of the apply valve;
a release port defined in the housing, the release port being sealingly fluidly isolated from the supply port, the delivery port, and the exhaust port;
a release valve supplying a release pilot pressure to the release port as a function of a state of the release valve;
a bore, defined in the housing, fluidly communicating with the supply port, the delivery port, the exhaust port, the apply port, and the release port; and
a shuttle, sealingly and movably secured in the bore, set to one of an apply position and a release position as a function of the respective apply and release pilot pressures at the apply and release ports, the delivery port fluidly communicating with the supply port while the shuttle is in the apply position, and the delivery port fluidly communicating with the exhaust port while the shuttle is in the release position.
23. The latching valve system as set forth in claim 22, wherein:
at least one of the supply valve and release valve is a pneumatic valve.
24. The latching valve system as set forth in claim 22, wherein:
at least one of the supply valve and release valve is a solenoid valve.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
IWe claim:
1. An end effector for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
a member including a first surface and a plurality of apertures in the first surface configured to flow a conditioning solution to the polishing pad; and
a plurality of contact elements projecting from the first surface.
2. The end effector of claim 1 wherein the apertures in the plurality of apertures are arranged in a generally uniform pattern to flow the conditioning solution generally uniformly across a portion of the polishing pad proximate to the first surface.
3. The end effector of claim 1 wherein the apertures in the plurality of apertures extend generally transverse to the first surface of the member to flow the conditioning solution to the first surface.
4. The end effector of claim 1 wherein the member further includes a manifold, and wherein the plurality of apertures is in fluid communication with the manifold.
5. The end effector of claim 1, further comprising a spray nozzle coupled to the member, the spray nozzle being configured to spray the conditioning solution onto the polishing pad proximate to the member.
6. The end effector of claim 1 wherein the plurality of apertures comprises a plurality of first apertures in a first region of the member and a plurality of second apertures in a second region of the member, wherein the plurality of first apertures is configured to provide a first volume of conditioning solution to the polishing pad, and wherein the plurality of second apertures is configured to provide a second volume different than the first volume of conditioning solution to the polishing pad.
7. The end effector of claim 1 wherein the plurality of contact elements comprises abrasive particles.
8. The end effector of claim 1 wherein the plurality of contact elements comprises raised features.
9. An end effector for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
a plate including a first surface, a second surface opposite the first surface, a plurality of apertures extending from the first surface to the second surface, and fluid fittings at the apertures through which a conditioning solution can flow; and
a plurality of contact elements projecting from the first surface.
10. The end effector of claim 9 wherein the apertures in the plurality of apertures are arranged in a generally uniform pattern.
11. The end effector of claim 9, further comprising a spray nozzle coupled to the plate, the spray nozzle being configured to spray conditioning solution onto the polishing pad proximate to the plate.
12. The end effector of claim 9 wherein the plurality of apertures comprises a plurality of first apertures in a first region of the plate and a plurality of second apertures in a second region of the plate, wherein the plurality of first apertures is configured to provide a first volume of conditioning solution to the polishing pad, and wherein the plurality of second apertures is configured to provide a second volume different than the first volume of conditioning solution to the polishing pad.
13. A conditioner for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
an end effector including a first surface and a plurality of contact elements projecting from the first surface; and
a spray nozzle proximate to the end effector, the spray nozzle being configured to spray a conditioning solution onto the polishing pad.
14. The conditioner of claim 13, further comprising an arm coupled to the end effector, wherein the spray nozzle is coupled to the arm to dispense the conditioning solution onto the polishing pad.
15. The conditioner of claim 13 wherein the spray nozzle is a first spray nozzle configured to spray the conditioning solution in a first direction, wherein the conditioner further comprises an arm coupled to the end effector, the arm having a second spray nozzle configured to spray the conditioning solution in a second direction different than the first direction.
16. The conditioner of claim 13 wherein the spray nozzle is a first spray nozzle configured to spray the conditioning solution at a first mean radius, wherein the conditioner further comprises an arm coupled to the end effector, the arm having a second spray nozzle configured to spray the conditioning solution at a second mean radius different than the first mean radius.
17. The conditioner of claim 13 wherein the end effector further includes a second surface opposite the first surface, and wherein the spray nozzle is coupled to the second surface.
18. A conditioner for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
an arm including at least one spray nozzle configured to spray a conditioning solution onto the polishing pad; and
an end effector coupled to the arm, the end effector including a first surface and a plurality of contact elements projecting from the first surface.
19. The conditioner of claim 18 wherein the at least one spray nozzle comprises a first spray nozzle configured to spray the conditioning solution onto the polishing pad at a first mean radius and a second spray nozzle configured to spray the conditioning solution onto the polishing pad at a second mean radius different than the first mean radius.
20. The conditioner of claim 18 wherein the at least one spray nozzle comprises a first spray nozzle configured to spray the conditioning solution onto the polishing pad in a first direction and a second spray nozzle configured to spray the conditioning solution onto the polishing pad in a second direction different than the first direction.
21. The conditioner of claim 18 wherein the arm is configured to sweep the end effector across the polishing pad, and wherein the at least one spray nozzle is configured to dispense the conditioning solution across the polishing pad.
22. An apparatus for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
an end effector having a first surface and a plurality of contact elements projecting from the first surface; and
a means for providing an approximately equal volume of conditioning solution between the polishing pad and the first surface of the end effector at a first radius of the polishing pad and at a second radius different from the first radius of the polishing pad.
23. The apparatus of claim 22 wherein the means for providing comprises a spray nozzle at least proximate to the end effector.
24. The apparatus of claim 22 wherein the means for providing comprises an arm having a spray nozzle for spraying conditioning solution onto the polishing pad, wherein the arm is coupled to the end effector.
25. The apparatus of claim 22 wherein the means for providing comprises a micro-device workpiece carrier having a spray nozzle for spraying conditioning solution onto the polishing pad, wherein the micro-device workpiece carrier is movable over the polishing pad.
26. An apparatus for conditioning a polishing pad used in polishing micro-device workpieces, comprising:
a table having a support surface;
a polishing pad coupled to the support surface of the table;
a source of conditioning solution; and
a conditioner including an end effector and a drive system coupled to the end effector, the end effector having a first surface, a plurality of apertures configured to flow a conditioning solution to the polishing pad, and a plurality of contact elements projecting from the first surface, wherein the plurality of apertures is operatively coupled to the source of conditioning solution, and wherein the conditioner andor the table is movable relative to the other to rub the plurality of contact elements against the polishing pad.
27. The apparatus of claim 26 wherein the apertures in the plurality of apertures of the end effector are arranged in a generally uniform pattern to flow the conditioning solution generally uniformly across a portion of the polishing pad proximate to the first surface.
28. The apparatus of claim 26 wherein the conditioner further includes a manifold, and wherein the plurality of apertures of the end effector is in fluid communication with the manifold.
29. The apparatus of claim 26, further comprising a spray nozzle coupled to the conditioner, the spray nozzle being configured to spray the conditioning solution onto the polishing pad proximate to the end effector.
30. The apparatus of claim 26 wherein the plurality of apertures of the end effector is in the first surface of the end effector.
31. The apparatus of claim 26 wherein the plurality of apertures of the end effector comprises a plurality of first apertures in a first region of the first surface and a plurality of second apertures in a second region of the first surface, wherein the plurality of first apertures is configured to provide a first volume of conditioning solution to the polishing pad, and wherein the plurality of second apertures is configured to provide a second volume different than the first volume of conditioning solution to the polishing pad.
32. The apparatus of claim 26, further comprising an arm coupled to the conditioner to move the conditioner across the polishing pad, wherein the arm includes a spray nozzle to spray the conditioning solution onto the polishing pad.
33. An apparatus for conditioning a polishing pad used in polishing micro-device workpieces, comprising:
a table having a support surface;
a polishing pad coupled to the support surface of the table;
a source of conditioning solution; and
a conditioner including an end effector, a spray nozzle proximate to the end effector, and a drive system coupled to the end effector, the end effector having a first surface and a plurality of contact elements projecting from the first surface, wherein the spray nozzle is operatively coupled to the source of conditioning solution and configured to spray a conditioning solution onto the polishing pad, and wherein the conditioner andor the table is movable relative to the other to rub the plurality of contact elements against the polishing pad.
34. The apparatus of claim 33 wherein the conditioner further includes an arm coupled to the end effector, and wherein the spray nozzle is coupled to the arm to dispense the conditioning solution onto the polishing pad.
35. The apparatus of claim 33 wherein the end effector further includes a second surface opposite the first surface, and wherein the spray nozzle is coupled to the second surface.
36. An apparatus for conditioning a polishing pad used in polishing micro-device workpieces, comprising:
a table having a support surface;
a polishing pad coupled to the support surface of the table;
a source of conditioning solution; and
a conditioner including an arm, an end effector coupled to the arm, and a drive system coupled to the arm, the arm having at least one spray nozzle operatively coupled to the source of conditioning solution and configured to spray a conditioning solution onto the polishing pad, the end effector having a first surface and a plurality of contact elements projecting from the first surface, wherein the conditioner andor the table is movable relative to the other to rub the plurality of contact elements against the polishing pad.
37. The apparatus of claim 36 wherein the at least one spray nozzle includes a first spray nozzle configured to spray the conditioning solution onto the polishing pad at a first mean radius and a second spray nozzle configured to spray the conditioning solution onto the polishing pad at a second mean radius different than the first mean radius.
38. The apparatus of claim 36 wherein the at least one spray nozzle includes a first spray nozzle configured to spray in a first direction and a second spray nozzle configured to spray in a second direction different than the first direction.
39. The apparatus of claim 36 wherein the arm is configured to sweep the end effector across the polishing pad, and wherein the at least one spray nozzle is configured to dispense the conditioning solution across the polishing pad.
40. An apparatus for conditioning a polishing pad used in polishing micro-device workpieces, comprising:
a table having a support surface;
a polishing pad coupled to the support surface of the table;
a source of conditioning solution;
a micro-device workpiece carrier including a spray nozzle operatively coupled to the source of conditioning solution by a fluid line and configured to flow a conditioning solution onto the polishing pad during conditioning; and
a conditioner including an end effector and a drive system coupled to the end effector, the end effector having a first surface and a plurality of contact elements projecting from the first surface, wherein the conditioner andor the table is movable relative to the other to rub the plurality of contact elements against the polishing pad.
41. The apparatus of claim 40 wherein the micro-device workpiece carrier is movable to flow the conditioning solution across the polishing pad.
42. The apparatus of claim 40 wherein the micro-device workpiece carrier is movable with the conditioner to flow conditioning solution onto the polishing pad proximate to the conditioner.
43. An apparatus for conditioning a polishing pad used in polishing micro-device workpieces, comprising:
a table having a support surface;
a polishing pad coupled to the support surface of the table;
a fluid arm positioned proximate to the polishing pad, the fluid arm having a first spray nozzle, a second spray nozzle, and a fluid manifold in fluid communication with the first and second spray nozzles, wherein the first spray nozzle is configured to flow a conditioning solution onto the polishing pad at a first mean radius, and wherein the second spray nozzle is configured to flow the conditioning solution onto the polishing pad at a second mean radius different from the first mean radius; and
a conditioner including an end effector and a drive system coupled to the end effector, the end effector having a first surface and a plurality of contact elements projecting from the first surface, wherein the conditioner andor the table is movable relative to the other to rub the plurality of contact elements against the polishing pad.
44. The apparatus of claim 43 wherein the first spray nozzle is configured to flow the conditioning solution at a first flow rate and the second spray nozzle is configured to flow the conditioning solution at a second flow rate different from the first flow rate.
45. An apparatus for conditioning a planarizing surface of a polishing pad, comprising:
a source of conditioning solution;
an arm;
an end effector carried by the arm, the end effector having a contact surface and a plurality of abrasive elements projecting from the contact surface; and
a fluid dispenser on the arm andor the end effector, the fluid dispenser being operatively coupled to the source of conditioning solution by a fluid line.
46. The apparatus of claim 45 wherein the fluid dispenser comprises an aperture in the contact surface of the end effector.
47. The apparatus of claim 45 wherein the fluid dispenser comprises a spray nozzle on the arm andor the end effector.
48. The apparatus of claim 45 wherein the fluid dispenser is configured to dispense conditioning solution onto the polishing pad proximate to the end effector.
49. A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
rubbing a plurality of contact elements on a surface of an end effector against a planarizing surface of the polishing pad; and
flowing a conditioning solution through apertures in the end effector and onto the planarizing surface of the polishing pad.
50. The method of claim 49 wherein flowing the conditioning solution comprises disposing the conditioning solution between the surface of the end effector and the polishing pad.
51. The method of claim 49 wherein flowing the conditioning solution comprises:
disposing a first volume of conditioning solution between the polishing pad and the surface of the end effector at a first radius on the polishing pad; and
disposing a second volume of conditioning solution between the polishing pad and the surface of the end effector at a second radius different from the first radius on the polishing pad, wherein the second volume is at least approximately equal to the first volume.
52. The method of claim 49 wherein flowing the conditioning solution comprises:
disposing conditioning solution having a first concentration of active chemicals between the polishing pad and the surface of the end effector at a first radius on the polishing pad; and
disposing conditioning solution having a second concentration of active chemicals between the polishing pad and the surface of the end effector at a second radius different from the first radius on the polishing pad, wherein the second concentration is at least approximately equal to the first concentration.
53. The method of claim 49 wherein flowing the conditioning solution comprises passing the conditioning solution through a manifold in the end effector.
54. The method of claim 49 wherein flowing the conditioning solution comprises passing the conditioning solution through apertures in the surface of the end effector.
55. The method of claim 49, further comprising dispensing conditioning solution from a spray nozzle on an arm coupled to the end effector.
56. A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
rubbing a plurality of contact elements of an end effector of a conditioner against a planarizing surface of the polishing pad; and
flowing a conditioning solution through a spray nozzle of the conditioner and onto the planarizing surface of the polishing pad.
57. The method of claim 56 wherein flowing the conditioning solution comprises:
disposing a first volume of conditioning solution between the polishing pad and the end effector at a first radius on the polishing pad; and
disposing a second volume of conditioning solution between the polishing pad and the end effector at a second radius different than the first radius on the polishing pad, wherein the second volume is at least approximately equal to the first volume.
58. The method of claim 56 wherein flowing the conditioning solution comprises:
disposing conditioning solution having a first concentration of active chemicals between the polishing pad and the end effector at a first radius on the polishing pad; and
disposing conditioning solution having a second concentration of active chemicals between the polishing pad and the end effector at a second radius different than the first radius of the polishing pad, wherein the second concentration is at least approximately equal to the first concentration.
59. The method of claim 56 wherein flowing the conditioning solution comprises disposing the conditioning solution between the end effector and the polishing pad.
60. The method of claim 56 wherein the spray nozzle is a first spray nozzle, and wherein flowing the conditioning solution comprises:
flowing the conditioning solution through the first spray nozzle and onto the polishing pad at a first mean radius; and
flowing the conditioning solution through a second spray nozzle and onto the polishing pad at a second mean radius different than the first mean radius.
61. The method of claim 56 wherein the spray nozzle is a first spray nozzle, and wherein flowing the conditioning solution comprises:
flowing the conditioning solution through the first spray nozzle in a first direction; and
flowing the conditioning solution through the second spray nozzle in a second direction different than the first direction.
62. A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
rubbing a plurality of contact elements of an end effector against a planarizing surface of the polishing pad; and
flowing a conditioning solution through a spray nozzle of a micro-device workpiece carrier and onto the planarizing surface of the polishing pad.
63. The method of claim 62 wherein flowing the conditioning solution comprises sweeping the micro-device workpiece carrier across the polishing pad to dispense conditioning solution across the polishing pad.
64. The method of claim 62 wherein flowing the conditioning solution comprises:
disposing a first volume of conditioning solution between the polishing pad and the end effector at a first radius on the polishing pad; and
disposing a second volume of conditioning solution between the polishing pad and the end effector at a second radius different than the first radius on the polishing pad, wherein the second volume is at least approximately equal to the first volume.
65. The method of claim 62 wherein flowing the conditioning solution comprises:
disposing conditioning solution having a first concentration of active chemicals between the polishing pad and the end effector at a first radius on the polishing pad; and
disposing conditioning solution having a second concentration of active chemicals between the polishing pad and the end effector at a second radius different than the first radius on the polishing pad, wherein the second concentration is at least approximately equal to the first concentration.
66. The method of claim 62 wherein flowing the conditioning solution comprises disposing the conditioning solution between the end effector and the polishing pad.
67. A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
rubbing a plurality of contact elements of an end effector against a planarizing surface of the polishing pad;
flowing conditioning solution through a first spray nozzle of a fluid arm and onto a planarizing surface of the polishing pad at a first mean radius; and
flowing conditioning solution through a second spray nozzle of the fluid arm and onto the planarizing surface of the polishing pad at a second mean radius different than the first mean radius.
68. The method of claim 67 wherein:
flowing the conditioning solution through the first spray nozzle comprises disposing a first volume of conditioning solution between the polishing pad and the end effector at a first radius on the polishing pad; and
flowing the conditioning solution through the second spray nozzle comprises disposing a second volume of conditioning solution between the polishing pad and the end effector at a second radius different than the first radius on the polishing pad, wherein the second volume is at least approximately equal to the first volume.
69. The method of claim 67 wherein:
flowing the conditioning solution through the first spray nozzle comprises disposing conditioning solution having a first concentration of active chemicals between the polishing pad and the end effector at a first radius on the polishing pad; and
flowing the conditioning solution through the second spray nozzle comprises disposing conditioning solution having a second concentration of active chemicals between the polishing pad and the end effector at a second radius different than the first radius on the polishing pad, wherein the second concentration is at least approximately equal to the first concentration.
70. A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
disposing a first volume of conditioning solution between the polishing pad and an end effector at a first radius proximate to a center of the polishing pad; and
disposing a second volume of conditioning solution between the polishing pad and the end effector at a second radius proximate to a perimeter of the polishing pad, wherein the second volume is at least approximately equal to the first volume.
71. The method of claim 70 wherein disposing the first volume of conditioning solution comprises flowing the conditioning solution through apertures in the end effector.
72. The method of claim 70 wherein disposing the first volume of conditioning solution comprises flowing the conditioning solution through a spray nozzle proximate to the end effector.
73. The method of claim 70 wherein disposing the first volume of conditioning solution comprises flowing the conditioning solution through a spray nozzle coupled to a micro-device workpiece carrier.
74. A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
disposing conditioning solution having a first concentration of active chemicals between the polishing pad and an end effector at a first radius proximate to a center of the polishing pad; and
disposing conditioning solution having a second concentration of active chemicals between the polishing pad and the end effector at a second radius proximate to a perimeter of the polishing pad, wherein the second concentration is at least approximately equal to the first concentration.
75. The method of claim 74 wherein disposing conditioning solution having the first concentration comprises flowing conditioning solution through apertures in the end effector.
76. The method of claim 74 wherein disposing conditioning solution having the first concentration comprises flowing conditioning solution through a spray nozzle proximate to the end effector.
77. The method of claim 74 wherein disposing conditioning solution having the first concentration comprises flowing conditioning solution through a spray nozzle coupled to a micro-device workpiece carrier.
78. A method for conditioning a polishing pad used in polishing a micro-device workpiece, comprising:
rubbing a plurality of contact elements of an end effector carried by an arm against a planarizing surface of the polishing pad; and
flowing a conditioning solution through a fluid dispenser on the arm andor the end effector.
79. The method of claim 78 wherein flowing the conditioning solution comprises passing the conditioning solution through a spray nozzle and onto the polishing pad.
80. The method of claim 78 wherein flowing the conditioning solution comprises passing the conditioning solution through apertures in the end effector.
81. The method of claim 78, further comprising sweeping the end effector across the polishing pad and dispensing the conditioning solution across the polishing pad.