1. A substrate polishing pad, having a polishing surface on a first side and a patterned surface on a second side, the patterned surface comprising:
(a) one or more raised portions defining a mounting surface; and
(b) a recessed area defined by the one or more raised portions.
2. The substrate polishing pad of claim 1, wherein the recessed area comprises a plurality of grooves.
3. The substrate polishing pad of claim 1, wherein at least a portion of the recessed area extends to a perimeter of the substrate polishing pad.
4. The substrate polishing pad of claim 1, wherein the substrate polishing pad comprises polyurethane.
5. The substrate polishing pad of claim 1, wherein the one or more raised portions comprise a plastic foam.
6. The substrate polishing pad of claim 1, wherein the one or more raised portions comprises a material selected from plastic, foam, rubber, and any combination thereof.
7. The substrate polishing pad of claim 1, wherein the one or more raised portions comprises a first material and the polishing surface comprises a second material.
8. The substrate polishing pad of claim 1, wherein the one or more raised portions comprise isolated protrusions.
9. The substrate polishing pad of claim 1, wherein the one or more raised portions comprise a first hydrostatic modulus at a first compressive pressure and the polishing surface comprises a second hydrostatic modulus at the first compressive pressure.
10. The substrate polishing pad of claim 9, wherein the first hydrostatic modulus is less than the second hydrostatic modulus.
11. The substrate polishing pad of claim 9, wherein the first hydrostatic modulus is less than about 400 psi per psi of the first compressive pressure and wherein the second hydrostatic modulus is greater than about 400 psi per psi of the first compressive pressure when the first compressive pressure is between about 2 to 20 psi.
12. A substrate polishing pad, comprising a polishing surface on a first side and a patterned surface on a second side, the patterned surface comprising a plurality of channels defining a recessed area and a raised mounting surface.
13. The substrate polishing pad of claim 12, wherein at least a portion of the plurality of channels extends to a perimeter of the substrate polishing pad to allow fluid communication between the portion of the plurality of channels and an environment of the substrate polishing pad.
14. The substrate polishing pad of claim 12, wherein the plurality of channels are concentrically disposed.
15. The substrate polishing pad of claim 12, wherein the substrate polishing pad comprises polyurethane.
16. The substrate polishing pad of claim 12, wherein the patterned surface comprises a plastic foam.
17. The substrate polishing pad of claim 12, wherein the plurality of channels comprise a plurality of non-intersecting pathways formed in the substrate polishing pad defining elongated slanted protrusions.
18. The substrate polishing pad of claim 12, wherein the plurality of channels comprise a plurality of intersecting pathways formed in the substrate polishing pad defining isolated slanted protrusions.
19. The substrate polishing pad of claim 12, wherein each channel of the plurality of channels is defined a bottom wall and by tapered sidewalls formed in the substrate polishing pad.
20. The substrate polishing pad of claim 19, wherein each of the tapered sidewalls and the bottom wall define an angle between about zero degrees and sixty degrees.
21. An apparatus for polishing a substrate, comprising:
(a) a rotatable platen; and
(b) a polishing pad disposed on the rotatable platen comprising a polishing surface on a first side and a patterned deflection surface on a second side.
22. The apparatus of claim 21, further comprising:
(a) a motor coupled to the rotatable platen; and
(b) one or more polishing heads rotatably mounted in facing relation to the rotatable platens.
23. The apparatus of claim 21, wherein the polishing surface comprises a first material and the patterned deflection surface comprises a second material.
24. The apparatus of claim 21, wherein the polishing pad comprises polyurethane.
25. The apparatus of claim 21, wherein the patterned deflection surface comprises a plastic foam.
26. The apparatus of claim 21, wherein the patterned deflection surface and the platen define a plurality of pathways.
27. The apparatus of claim 21, wherein at least a portion of the plurality of pathways extends to a perimeter of the polishing pad to allow fluid communication between the portion of the plurality of pathways and an environment of the polishing pad.
28. The apparatus of claim 21, wherein the patterned deflection surface comprises a plurality of slanted protrusions.
29. The apparatus of claim 21, wherein the patterned deflection surface comprises:
(a) one or more isolated raised portions disposed on the polishing pad and defining a mounting surface disposed on the platen; and
(b) a recessed area defined by the one or more isolated raised portions.
30. The apparatus of claim 29, wherein the one or more isolated raised portions comprise a first material and the polishing surface comprises a second material.
31. The apparatus of claim 29, wherein the one or more isolated raised portions comprise a material selected from plastic, foam, or rubber, and the polishing pad comprises polyurethane.
32. The apparatus of claim 29, wherein the one or more isolated raised portions comprise a first hydrostatic modulus at a first compressive pressure and the polishing pad comprises a second hydrostatic modulus at the first compressive pressure.
33. The apparatus of claim 32, wherein the first hydrostatic modulus is less than the second hydrostatic modulus.
34. The apparatus of claim 29, wherein the recessed area comprises a plurality of grooves.
35. The apparatus of claim 21, wherein the patterned deflection surface comprises a plurality of non-intersecting channels formed in the polishing pad.
36. The apparatus of claim 35, wherein the polishing pad comprises polyurethane.
37. The apparatus of claim 35, wherein at least a portion of the plurality of non-intersecting channels extends to a perimeter of the polishing pad to allow fluid communication between the portion of the plurality of non-intersecting channels and an environment of the polishing pad.
38. The apparatus of claim 35, wherein each of the channels of the plurality of non-intersecting channels are defined by a bottom wall and by tapered sidewalls formed on the substrate polishing pad.
39. The apparatus of claim 38, wherein each of the tapered sidewalls and the bottom wall define an angle between about zero degrees and sixty degrees.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A diffusion-bonded powder comprising iron or iron-based particles and particles diffusion-bonded to the iron or iron-based particles, where said particles diffusion-bonded to the iron or iron-based particles comprise an alloy of Cu and 5% to 15% by weight of Sn.
2. A powder according to claim 1, wherein 50% or 90% by weight are iron or iron-based particles.
3. A powder according to claim 1, wherein 10% to 50% by weight are particles diffusion-bonded to the iron or iron-based particles.
4. A powder according to claim 1, wherein the particles diffusion-bonded to the iron or iron-based particles comprise 85% to 95% by weight of Cu.
5. A powder according to claim 1, wherein the particles diffusion-bonded to the iron or iron-based particles have a particle size distribution where the average particle size by weight, X50 is 1-15 \u03bcm.
6. A powder according to claim 1, further comprising graphite added in an amount of 0.5-2% by weight.
7. A method of manufacturing a component comprising:
providing a powder according to claim 1,
compacting the powder at a pressure of 200-600 MPa thereby forming a powder compact, and
sintering the powder compact.
8. A method according to claim 7, further comprising, before compacting, mixing the powder with a lubricating agent.
9. A component manufactured at least partly from a powder according to claim 1.
10. A component manufactured by the method according to claim 7, having a surface concentration of bronze as defined in \u201cEvaluation method\u201d higher than the nominal concentration of bronze in the component.
11. A component according to claim 10 comprising a lubricant.
12. A component according to claim 10 having a density of between 5.5 and 6.5 gcm3.
13. A method for manufacturing a diffusion-bonded powder comprising the following steps:
providing a bronze powder having a median particle size distribution X50<15 \u03bcm,
mixing the bronze powder with an iron or iron-based powder having a particle size below 250 \u03bcm,
annealing the mixture at a temperature of 750-830\xb0 C. for a time of 15-180 minutes in a reducing atmosphere, and
crushing the annealed mixture to a powder and sieving the powder.
14. A method according to claim 13, wherein the bronze powder is an oxidized bronze.
15. A method according to claim 13, wherein the bronze powder has a median particle size distribution X50<10 \u03bcm.
16. A method according to claim 13, wherein a binder has been added to the mixture of bronze powder and iron or iron-based powder before annealing the mixture.
17. A powder according to claim 2, wherein 10% to 50% by weight are particles diffusion-bonded to the iron or iron-based particles.
18. A powder according to claim 1, wherein the particles diffusion-bonded to the iron or iron-based particles have a particle size distribution where the average particle size by weight, X50 is 1-10 \u03bcm.
19. A component according to claim 11 having a density of between 5.5 and 6.5 gcm3.
20. A method according to claim 14, wherein the bronze powder has a median particle size distribution X50<10 \u03bcm