What is claimed is:
1. A board for traversing a snow covered slope, comprising
an elongated body, and
a plurality of stiffeners coupled to said body and creating at least one bend axis spaced apart from an outer boundary of a conventional boot binding.
2. The board of claim 1 wherein said plurality of stiffeners are integrally formed with said board.
3. The board of claim 1 wherein said plurality of stiffeners are mounted on said board.
4. The board of claim 3 wherein said plurality of stiffeners are adapted to elevate a boot binding from said body.
5. The board of claim 1 wherein said plurality of stiffeners extend beyond an outer boundary of a conventional boot binding.
6. The board of claim 1 wherein said plurality of stiffeners create at least one other bend axis spaced apart from the outer boundary of a conventional boot binding.
7. The board of claim 1 further comprising a drive having a base, wherein said plurality of stiffeners extend outwardly from said base beyond an outer boundary of a conventional boot binding.
8. The board of claim 7 wherein said plurality of stiffeners extend from said base in a v-shaped pattern.
9. The board of claim 7 wherein said plurality of stiffeners laterally traverse said base.
10. A snowboard comprising
an elongated body, and
first, second, third and fourth bend-axes located along said body, said first and second bend axes are spaced apart at a distant that is greater than the width of a conventional binding, said third and fourth bend axes are spaced apart at a distant that is greater than the width of a conventional binding, and wherein said body is bendable about said bend axes.
11. The board of claim 10 further comprising a plurality of stiffeners.
12. The board of claim 11 wherein said plurality of stiffeners are integrally formed with said board.
13. The board of claim 11 wherein said plurality of stiffeners are coupled to said board.
14. The board of claim 13 wherein said plurality of stiffeners are adapted to elevate a boot binding from said body.
15. The board of claim 11 wherein said plurality of stiffeners extend beyond an outer boundary of a conventional boot binding.
16. The board of claim 11 further comprising a drive comprising a base, wherein said plurality of stiffeners extend outwardly from said base beyond an outer boundary of a conventional boot binding.
17. The board of claim 16 wherein said plurality of stiffeners extend from said base in a v-shaped pattern.
18. The board of claim 16 wherein said plurality of stiffeners are laterally traverse said base.
19. A drive system comprising
a base, and
first and second stiffeners coupled to said base, said first and second stiffeners including first, second, third, and fourth load-points, said first and second load-points and said third and fourth load-points, respectively, being spaced apart at a distance greater than the width of a conventional boot binding, said base being mountable on a body of a board such that said first and second load-points and said third and fourth load-points, respectively, are positioned adjacent opposing edges of the body of the board and the body of the board will bend about said load-points of said stiffeners.
20. The drive system of claim 19 wherein said drive system is insertable between the base of a binding and a boot of a rider.
21. The drive system of claim 19 wherein said first and second stiffeners, respectively, are generally transversely oriented relative to said base and positionable adjacent opposing edges of a board.
22. The drive system of claim 19 wherein said base extends substantially the width of a snowboard, and said first and second stiffeners form first and second elongated cross members located adjacent opposing ends of said base, wherein the ends of said first and second cross members, respectively, form said first and second load-points and said third and fourth load-points.
23. The drive system of claim 19 wherein said first stiffener comprises first and second fingers extending radially outwardly from said base and wherein said second stiffener comprises third and fourth fingers extending radially outwardly from said base.
24. The drive system of claim 23 wherein said first, second, third, and fourth load-points, respectively, are located adjacent the ends of said first, second, third, and fourth fingers, respectively.
25. The drive system of claim 19 wherein said base is pivotally mountable to a board.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for manufacturing a thin film transistor, comprising:
forming an insulating pattern layer on a substrate, wherein the insulating pattern layer has at least a protrusion;
forming at least a spacer and a plurality of amorphous semiconductor patterns separated from each other on the insulating pattern layer, wherein the spacer is formed at a side of the protrusion and connected between the amorphous semiconductor patterns;
crystallizing the spacer and the amorphous semiconductor patterns;
removing the protrusion and the insulating pattern layer under the spacer so that the spacer is suspended over the substrate as a beam structure having a plurality of corners;
sequentially forming a carrier tunneling layer, a carrier trapping layer and a carrier blocking layer over the substrate, wherein the carrier tunneling layer, the carrier trapping layer and the carrier blocking layer sequentially compliantly wrap the corners of the beam structure; and
forming a gate over the substrate, wherein the gate covers the beam structure and wraps the carrier blocking layer.
2. The method of claim 1, wherein the protrusion is a rectangular parallelepiped and the side of the protrusion is a long side of the rectangular parallelepiped.
3. The method of claim 2, wherein the amorphous semiconductor patterns cover two opposite short sides of the rectangular parallelepiped respectively.
4. The method of claim 1, wherein the beam structure possesses three corners.
5. The method of claim 1, further comprising:
converting the amorphous semiconductor patterns into a plurality of poly-semiconductor patterns after the amorphous semiconductor patterns are crystallized; and
performing an ion implantation on the poly-semiconductor patterns respectively connected to two ends of the beam structure so as to respectively form a source and a drain, wherein the beam structure is connected between the source and the drain.
6. The method of claim 1, wherein the material of the insulating pattern layer comprises semiconductor oxide or semiconductor nitride.
7. The method of claim 1, wherein the material of the amorphous semiconductor patterns comprises amorphous silicon, amorphous germanium or amorphous silicon germanium.
8. The method of claim 1, wherein, before the spacer is crystallized, the material of the spacer comprises amorphous silicon, amorphous germanium or amorphous silicon germanium.
9. The method of claim 1, wherein the material of the gate comprises metal or semiconductor.