I claim:
1. An electrical machine comprising
an electrical component comprising a stator component and a rotor component, said rotor component being arranged to rotate about an axis of rotation,
a housing having a first housing wall which surrounds said electrical component, said housing having an accommodation space radially outside of said first wall with respect to said axis of rotation, and
power electronics for controlling said electrical machine, said power electronics comprising individual components arranged inside the accommodation space.
2. The electrical machine as claimed in claim 1 wherein, the housing has a second housing wall which extends radially outward from the first housing wall in order to bound the accommodation space.
3. The electrical machine as claimed in claim 2, wherein, the housing further comprises at least one cover element opposite the first housing wall and opposite the second housing wall.
4. The electrical machine as claimed in claim 2 further comprising at least one cooling opening in at lest one of the first and second housing walls.
5. The electrical machine as claimed in 2 further comprising at least one cooling channel in at least one of said first and second housing walls.
6. The electrical machine as claimed in claim 1, wherein, the housing has at least one opening which provides access to said accommodation space.
7. The electrical machine as claimed in claim 1, wherein, the individual components comprise at least one capacitor mounted on at least one of said first and second housing walls.
8. The electrical machine as claimed in claim 1, wherein, the individual components comprise at least one power semiconductor mounted on at least one of said first and second housing walls.
9. The electrical machine as claimed in claim 8 further comprising at least one clamping connection for clamping said at least one power semiconductor to said at least one of said first and second housing walls.
10. The electrical machine as claimed in claim 8, wherein, the at least one power semiconductor is mounted on the first housing wall, and the first housing wall is planar wherein the at least one power semiconductor is mounted.
11. The electrical machine as claimed in one of claim 1, wherein, the power electronics comprise a power busbar system (67).
12. The electrical machine as claimed in claim 11, wherein, the stator component comprises at least one connecting contact, and the power busbar system is connected to the at least one connecting contact.
13. The electrical machine as claimed in claim 8, wherein, the power electronics comprise a drive device for the at least one power semiconductor.
14. The electrical machine as claimed in claim 1, wherein, the power electronics comprise a control device.
15. The electrical machine as claimed in claim 13, wherein, at lest one of the power busbar system and the drive device comprises of a busbar.
16. The electrical machine as claimed in one of claim 13, wherein, at least one of the power busbar system the drive device comprises a current measurement device.
17. The electrical machine as claimed in claim 1, wherein, the housing comprises has at least one cable connection for electrical connection of the power electronics to external components.
18. The electrical machine as claimed in claim 1, wherein the housing comprises has at least one cooling connection for connection to a cooling device.
19. The electrical machine as claimed in claim 1, further comprising a fixing device for at least temporarily fixing the housing on the electrical component.
20. The electrical machine as claimed claim 1, wherein the width of the housing matches the width of the electrical machine.
21. The electrical machine as claimed in claim 1, wherein the housing comprises a connecting flange.
22. A drive arrangement for a vehicle, said drive arrangement comprising an engine, a transmission, and an electrical machine arranged between the engine and the transmission, said electrical machine comprising
an electrical component comprising a stator component and a rotor component, said rotor component being arranged to rotate about an axis of rotation,
a housing having a first housing wall which surrounds said electrical component, said housing having an accommodation space radially outside of said first wall with respect to said axis of rotation, and
power electronics for controlling said electrical machine, said power electronics comprising individual components arranged inside the accommodation space.
23. The drive arrangement as claimed in claim 22, wherein, the housing is connected on one side to the engine and on the other side to the transmission.
24. The drive arrangement as claimed in claim 22, wherein, the electrical machine is a starter-generator.
25. The drive arrangement as claimed in one of claim 22, wherein, the power electronics are connected to a vehicle on-board electrical power supply system. The drive arrangement as claimed in claim 22, wherein the electrical machine is connected to a cooling circuit for the engine.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A circuit device, comprising:
a circuit substrate;
a first heat spreader arranged on an upper surface of the circuit substrate;
a first semiconductor element fixed to an upper surface of the first heat spreader;
a second heat spreader arranged, next to the first heat spreader, on the upper surface of the circuit substrate; and
a second semiconductor element fixed to an upper surface of the second heat spreader; and
a sealing resin body sealing the first and second heat spreaders and the first and second semiconductor elements,
wherein, in plan view of the circuit device, the first heat spreader is larger than the first semiconductor element and the second heat spreader is larger than the second semiconductor element,
in the plan view, a position of the first semiconductor element relative to the first heat spreader is different from a position of the second semiconductor element relative to the second heat spreader, and
the circuit device is configured to operate as a separated and completed device that includes the first and second semiconductor elements and the first and second heat spreaders.
2. The circuit device according to claim 1, wherein in the plan view, a lateral edge of the first heat spreader and a lateral edge of the second heat spreader lie along a line extending in a first direction, and the first and second semiconductor elements are shifted from each other in a second direction perpendicular to the first direction.
3. The circuit device according to claim 2, wherein the first semiconductor element includes a first transistor and a first diode connected in parallel to the first transistor, the second semiconductor element includes a second transistor and a second diode connected in parallel to the second transistor, the first transistor and the first diode are aligned in the second direction, and the second transistor and the second diode are aligned in the second direction but in a reverse order with respect to the first transistor and the first diode.
4. The circuit device according to claim 3, wherein the first transistor and the second transistor are insulated gate bipolar transistors configured to operate as an inverter circuit.
5. The circuit device according to claim 3, wherein a circuit element is arranged between the first heat spreader and the second heat spreader.
6. The circuit device according to claim 3, further comprising a slit formed in the circuit substrate in a region between the first heat spreader and the second heat spreader.
7. The circuit device according to claim 1, further comprising a third heat spreader arranged, next to the second heat spreader, on the upper surface of the circuit substrate, and a third semiconductor element fixed to an upper surface of the third heat spreader, wherein the first, second and third heat spreaders are aligned in a first direction, and the first, second and third semiconductor elements are shifted from each other in a second direction perpendicular to the first direction.
8. The circuit device according to claim 1, wherein the circuit substrate, the first heat spreader and the first semiconductor element are stacked in this order, and the circuit substrate, the second heat spreader and the second semiconductor element are stacked in this order.