1. Apparatus for controlling the temperature of a workpiece comprising:
platen body having a workpiece support surface;
a plug centrally disposed in a bore formed in the workpiece support surface, the plug having a first surface co-planar to the workpiece support surface and a lower surface opposite the first surface; and
a void defined between the lower surface of the plug and a bottom of the bore.
2. The apparatus of claim 1, wherein the plug and platen body have different rates of thermal conductivity.
3. The apparatus of claim 1, wherein the platen body further comprises a vent disposed therein, the vent fluidly coupling the void with an exterior of said platen body.
4. The apparatus of claim 1, wherein the plug rests on a step formed in the bore disposed in the platen body.
5. The apparatus of claim 1, wherein the plug is welded to the platen body.
6. The apparatus of claim 1 further comprising a thermal control assembly coupled to a side of the platen body opposite the workpiece support surface.
7. The apparatus of claim 1, wherein the thermal control assembly comprises:
at least one thermo-electric device; and
at least one jacket adapted to carry a heat transfer fluid adjacent the thermo-electric device.
8. Apparatus for controlling the temperature of a workpiece comprising:
first portion having a thermal conductivity and a workpiece support surface; and
a second portion centrally disposed in the workpiece support surface, the second portion having a surface co-planar to the workpiece support surface, the second portion having a thermal conductivity different than the thermal conductivity of the first portion.
9. The apparatus of claim 8, wherein the thermal conductivity of the first portion is higher than the thermal conductivity of the second portion.
10. Apparatus for controlling the temperature of a workpiece comprising:
platen body having a first surface and a second surface opposite the first surface;
a plug centrally disposed in a bore formed in the first surface, the plug having a first side and a second side opposite the first side;
workpiece support surface for supporting the workpiece defined by the first surface of the platen body and the first side of the plug;
a first thermal path disposed between the workpiece support surface and the second surface of the platen body, the first thermal path running between the first surface of the platen body and the second surface of the platen body; and
a second thermal path disposed between the workpiece support surface and the second surface of the platen body, the second thermal path running between the first side of the plug and the second surface of the platen body.
11. The apparatus of claim 10, wherein the plug and platen body have different rates of thermal conductivity.
12. The apparatus of claim 11, wherein a void is defined between second side the plug and a bottom of the bore disposed in the platen body, the second thermal path at least partially including the void.
13. The apparatus of claim 10, wherein a void is defined between second side the plug and a bottom of the bore disposed in the platen body, the second thermal path at least partially including the void.
14. A semiconductor wafer processing system comprising:
a process chamber having a base, walls and lid, said walls having internal passages;
a gas supply connected to said process chamber;
a coolant reservoir fluidly connected to said internal passages;
a showerhead centrally disposed beneath said lid, fluidly connected to said gas supply;
a platen disposed within said process chamber, the platen comprising:
platen body having a workpiece support surface;
a plug centrally disposed in a bore formed in the workpiece support surface, the plug having a first surface co-planar to the workpiece support surface and a lower surface opposite the first surface; and
a void defined between the lower surface of the plug and a bottom of the bore.
15. The apparatus of claim 14, wherein the plug and platen body have different rates of thermal conductivity.
16. The apparatus of claim 14, wherein the platen body further comprises a vent disposed therein, the vent fluidly coupling the void with an exterior said platen body.
17. The apparatus of claim 14, wherein the plug rests on a step formed in the bore disposed in the platen body.
18. The apparatus of claim 14, wherein the plug is welded to the platen body.
19. The apparatus of claim 14 further comprising a thermal control assembly coupled to a side of the platen body opposite the workpiece support surface.
20. The apparatus of claim 14, wherein the thermal control assembly comprises:
at least one thermo-electric device; and
at least one jacket adapted to carry a heat transfer fluid adjacent the thermo-electric device.
21. A semiconductor wafer processing system comprising:
a process chamber having a base, walls and lid, said walls having internal passages;
a gas supply connected to said process chamber;
a coolant reservoir fluidly connected to said internal passages;
a showerhead centrally disposed beneath said lid, fluidly connected to said gas supply;
a platen disposed within said process chamber, the platen comprising:
first portion having a thermal conductivity and a workpiece support surface; and
a second portion centrally disposed the workpiece support surface, the second portion having a first surface co-planar to the workpiece support surface and having a thermal conductivity different than the thermal conductivity of the first portion.
22. The apparatus of claim 21, wherein the thermal conductivity of the first portion is higher than the thermal conductivity of the second portion.
23. A semiconductor wafer processing system comprising:
a process chamber having a base, walls and lid, said walls having internal passages;
a gas supply connected to said process chamber;
a coolant reservoir fluidly connected to said internal passages;
a showerhead centrally disposed beneath said lid, fluidly connected to said gas supply;
a platen disposed within said process chamber, the platen comprising:
platen body having a first surface and a second surface opposite the first surface;
a plug centrally disposed in a bore formed in the first surface, the plug having a first side and a second side opposite the first side;
workpiece support surface for supporting the workpiece defined by the first surface of the platen body and the first side of the plug;
a first thermal path disposed between the workpiece support surface and the second surface of the platen body, the first thermal path running between the first surface of the platen body and the second surface of the platen body; and
a second thermal path disposed between the workpiece support surface and the second surface of the platen body, the second thermal path running between the first side of the plug and the second surface of the platen body.
24. The apparatus of claim 23, wherein the plug and platen body have different rates of thermal conductivity.
25. The apparatus of claim 24, wherein a void is defined between second side the plug and a bottom of the bore disposed in the platen body, the second thermal path at least partially including the void.
26. The apparatus of claim 23, wherein a void is defined between second side the plug and a bottom of the bore disposed in the platen body, the second thermal path at least partially including the void.
27. Apparatus for controlling the temperature of a workpiece comprising:
a workpiece support surface;
a first means for transferring heat at a first rate having at least a portion disposed co-planar to the workpiece support surface; and
a second means for transferring heat at a second rate different than the first rate having at least a portion disposed co-planar to the workpiece support surface.
28. The apparatus of claim 27, wherein the first rate is faster than the second rate.
29. The apparatus of claim 27, wherein the first means comprises at least a portion of a platen body.
30. The apparatus of claim 27, wherein the second means comprises a plug centrally disposed in a platen body.
31. The apparatus of claim 30, wherein the second means further comprises a gap disposed between the plug and the platen body.
32. The apparatus of claim 29, wherein the second means comprises:
a plug centrally disposed in the platen body and having a different rate of thermal conductivity than the platen body or a plug centrally disposed in the platen body and having a gap defined therebetween.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method, comprising:
displaying an image;
displaying a virtual loupe comprising a target region and a lens region,
wherein the lens region is displayed at a fixed distance from the target region,
wherein the lens region is displayed at a first orientation relative to the target region;
wherein the lens region is separate from the target region;
receiving a first user input selecting a first location, of the target region, on the image;
wherein a depiction of a first visual information associated with the first location is displayed within the target region;
wherein a magnified depiction of the first visual information is displayed within the lens region;
receiving a second user input moving the target region from the first location to a second location on the image;
in response to receiving the second user input,
moving the target region to the second location;
moving the lens region to concurrently maintain (1) the fixed distance of the lens region from the target region and (2) the first orientation of the lens region relative to the target region;
wherein a depiction of a second visual information associated with the second location is displayed within the target region;
wherein a magnified depiction of the second visual information is displayed within the lens region.
2. A storage device storing one or more sequences of instructions, wherein execution of the one or more sequences of instructions by one or more processors causes the one or more processors to perform the method steps as recited in claim 1.
3. A storage device storing one or more sequences of instructions, wherein execution of the one or more sequences of instructions by one or more processors causes the one or more processors to perform the method steps as recited in claim 1.
4. The method as recited in claim 1, further comprising:
receiving a third user input moving the target region to a third location on the image;
in response to receiving user input moving the target region to a third location, moving the target region to the third location;
determining that the first orientation of the lens region relative to the target region should be changed to a second orientation;
displaying the lens region at a second orientation relative to the target region and at the fixed distance from the target region;
wherein a depiction of a third visual information associated with the third location is displayed within the target region;
wherein a magnified depiction of the third visual information is displayed within the lens region.
5. A storage device storing one or more sequences of instructions, wherein execution of the one or more sequences of instructions by one or more processors causes the one or more processors to perform the method steps as recited in claim 4.
6. The method as recited in claim 4, wherein determining that the first orientation of the lens region relative to the target region should be changed to a second orientation comprises determining that displaying the lens region at the first orientation from the target region would result in the lens region being closer to a display edge than the target region.
7. A storage device storing one or more sequences of instructions, wherein execution of the one or more sequences of instructions by one or more processors causes the one or more processors to perform the method steps as recited in claim 6.
8. The method as recited in claim 4, wherein determining that the first orientation of the lens region relative to the target region should be changed to a second orientation comprises determining that displaying the lens region at the first orientation from the target region would result in the lens region not being fully displayed.
9. A storage device storing one or more sequences of instructions, wherein execution of the one or more sequences of instructions by one or more processors causes the one or more processors to perform the method steps as recited in claim 8.
10. The method as recited in claim 4, wherein the second orientation of the lens region relative to the target region is based on aligning the second orientation with a center of a display.
11. A storage device storing one or more sequences of instructions, wherein execution of the one or more sequences of instructions by one or more processors causes the one or more processors to perform the method steps as recited in claim 10.
12. The method as recited in claim 4, wherein the second orientation of the lens region relative to the target region is based on which sub-region of a display comprises the second location of the target region.
13. A storage device storing one or more sequences of instructions, wherein execution of the one or more sequences of instructions by one or more processors causes the one or more processors to perform the method steps as recited in claim 12.
14. The method as recited in claim 4, wherein displaying the lens region at a second orientation relative to the target region comprises displaying the lens region at intermediate locations between the first orientation relative to the target region and the second orientation relative to the target region.
15. A storage device storing one or more sequences of instructions, wherein execution of the one or more sequences of instructions by one or more processors causes the one or more processors to perform the method steps as recited in claim 14.