1461103609-fb4192a3-ead8-44f6-9fa1-bd7217afec80

1. A method for manufacturing a solar cell module, comprising the steps of:
sequentially forming a transparent electrode layer, a semiconductor layer, and a metal electrode layer on a main surface of a transparent substrate;
forming a resin layer on the metal electrode layer;
exposing a part of the metal electrode layer in a pinhole which is formed in the resin layer by applying a voltage across the transparent electrode layer and the metal electrode layer in a direction opposite to a direction of a photo-electromotive force to be generated in the semiconductor layer; and
removing the part of the metal electrode layer by etching the part of the metal electrode layer using the resin layer as a mask.
2. A method for manufacturing a solar cell module, comprising the steps of:
sequentially forming a transparent electrode layer, a semiconductor layer, and a metal electrode layer on a main surface of a transparent substrate;
forming a first pinhole in the metal electrode layer by applying a voltage across the transparent electrode layer and the metal electrode layer in a direction opposite to a direction of a photo-electromotive force to be generated in the semiconductor layer;
forming a resin layer on the metal electrode layer and in the first pinhole;
exposing a part of the metal electrode layer in a second pinhole which is formed in the resin layer by applying the reverse voltage across the transparent electrode layer and the metal electrode layer; and
removing the part of the metal electrode layer by etching the part of the metal electrode layer using the resin layer as a mask.
3. The method for manufacturing a solar cell module according to claim 2, wherein
the semiconductor layer has a first semiconductor layer, a transparent electrically conductive layer, and a second semiconductor layer which are sequentially formed on the transparent electrode, and
in the step of forming the first pinhole, the first pinhole penetrates through at least the metal electrode layer and the second semiconductor layer.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A coupling unit for electrically coupling a performance board on which an electronic device is mounted and a tester control unit for generating a control signal for controlling a test of said electronic device, comprising:
a board containing unit for containing a test board electrically coupled to said tester control unit such that said test board is replaceable in one of a plurality of holding positions;
a coupling cable whose one end is coupled to said test board held in said one of said plurality of holding positions and another end is coupled to said performance board; and
a holding member, detachably fastened to said board containing unit on one of a plurality of fixing positions of said board containing unit and detachably fastened to said test board, configured to hold said test board in said one of said plurality of holding positions that is determined by said one of said plurality of fixing positions.
2. A coupling unit as claimed in claim 1, further comprising a control unit cable whose one end is coupled to said test board held in said one of said plurality of holding positions and the other end is coupled to said tester control unit.
3. A coupling unit as claimed in claim 1, further comprising a guide member detachably disposed on an installation position of said board containing unit in response to said one of said plurality of fixing positions on which said holding member is fixed, for guiding a side of said test board when said test board is inserted into said one of said plurality of holding positions of said board containing unit.
4. A coupling unit as claimed in claim 1, wherein said board containing unit has a plurality of holes formed in a row in response to each of said plurality of fixing positions on a surface thereof to which said holding member is attached, and said holding member comprises a projection for engagement with one of said holes.
5. A coupling unit as claimed in claim 1, wherein said board containing unit contains a plurality of said test boards, and said coupling unit further comprises an inter-board cable of which both ends are coupled to said different test boards, respectively.
6. A coupling unit as claimed in claim 1, wherein said board containing unit contains a plurality of said test boards, and said coupling unit further comprises a coupling board coupled to said test boards.
7. A coupling unit as claimed in claim 6, further comprising a control unit cable of which one end is coupled to said test board and the other end is coupled to said tester control unit, wherein said coupling board is electrically coupled to said test boards and said control unit cable.
8. The coupling unit of claim 1, wherein a first end of the test board is connected to the holding member and a second end of the test board is connected to a control unit cable.
9. The coupling unit of claim 8, wherein the first end of the test board is located near the electronic device.
10. The coupling unit of claim 1, wherein the holding member is fixed on an upper surface of the board containing unit with a fixing screw.
11. The coupling unit of claim 10, wherein the holding member is positioned on the upper surface of the board containing unit with a positioning pin.
12. The coupling unit of claim 11, wherein the positioning pin is located on an outer side of the board containing unit.
13. The coupling unit of claim 1, wherein the holding member is positioned on an upper surface of the board containing unit with a positioning pin.
14. The coupling unit of claim 1, wherein the test board is held by a guide member.
15. The coupling unit of claim 14, wherein the guide member comprises a groove.
16. A test head for detachably fixing a test board electrically coupled to a tester control unit for generating a control signal for controlling a test of an electronic device, comprising:
a board containing unit for containing said test board to be replaceable in one of a plurality of holding positions;
a holding member, detachably fastened to said board containing unit on one of a plurality of fixing positions of said board containing unit and detachably fastened to said test board, configured to hold said test board in said one of said plurality of holding positions that is determined by said one of said plurality of fixing positions; and
a control unit cable of which one end is coupled to said test board held in said one of said plurality of holding positions and another end is coupled to said tester control unit.
17. The test head of claim 16, wherein a first end of the test board is connected to the holding member and a second end of the test board is connected to the control unit cable.
18. The test head of claim 17, wherein the first end of the test board is located near the electronic device.
19. The test head of claim 16, wherein the holding member is fixed on an upper surface of the board containing unit with a fixing screw.
20. The test head of claim 19, wherein the holding member is positioned on the upper surface of the board containing unit with a positioning pin.
21. The test head of claim 20, wherein the positioning pin is located on an outer side of the board containing unit.
22. The test head of claim 16, wherein the holding member is positioned on an upper surface of the board containing unit with a positioning pin.
23. The test head of claim 16, wherein the test board is held by a guide member.
24. The test head of claim 23, wherein the guide member comprises a groove.
25. A test apparatus for testing an electronic device, comprising:
a tester control unit for generating a control signal for controlling a test of said electronic device;
a test board electrically coupled to said tester control unit;
a board containing unit for containing said test board electrically coupled to said tester control unit such that said test board is replaceable on one of a plurality of holding positions;
a holding member, detachably fastened to said board containing unit on one of a plurality of fixing positions of said board containing unit and detachably fastened to said test board, configured to hold said test board in said one of said plurality of holding positions that is determined by said one of said plurality of fixing positions; and
a coupling cable of which one end is coupled to said test board held in said one of said plurality of holding positions and another end is coupled to said performance board.
26. The test apparatus of claim 25, wherein a first end of the test board is connected to the holding member and a second end of the test board is connected to a control unit cable.
27. The test apparatus of claim 26, wherein the first end of the test board is located near the electronic device.
28. The test apparatus of claim 25, wherein the holding member is fixed on an upper surface of the board containing unit with a fixing screw.
29. The test apparatus of claim 28, wherein the holding member is positioned on the upper surface of the board containing unit with a positioning pin.
30. The test apparatus of claim 29, wherein the positioning pin is located on an outer side of the board containing unit.
31. The test apparatus of claim 25, wherein the holding member is positioned on an upper surface of the board containing unit with a positioning pin.
32. The test apparatus of claim 25, wherein the test board is held by a guide member.
33. The test head of claim 32, wherein the guide member comprises a groove.