What is claimed is:
1. An apparatus for providing an encapsulation material to devices mounted on a substrate simultaneously, said apparatus comprising:
two substrates each having at least two electronic device mounted on one side thereof, each said substrate having a thickness, having a first side having said electronic components mounted thereon, and having an opposing backside having a planar surface having at least one of an array of conductive terminals, and pads thereon;
an upper mold plate and a mating lower mold plate, each mold plate having a mold cavity portion, the mold cavity portion in each said upper and lower mold plates comprising a mold cavity receiving a portion of said substrates, each portion of said substrates having said electronic components thereon for encapsulating each of said electronic components, portions of each substrate of said two electronic devices situated backside-to-backside in said mold cavity;
a force-applying device for applying a force to said upper mold plate and said lower mold plate about portions of said substrate of an intervening first electronic device of said two electronic devices and said substrate of an intervening second electronic device of said two electronic devices situated backside-to backside, said mold cavity portion of said upper mold plate forming a first mold cavity over at least a portion of one of said first and second electronic devices and said mold cavity portion of said lower mold plate forming a second mold cavity over at least a portion of the other of said first electronic device and second electronic device of said two electronic devices;
at least one passageway in each said upper mold plate and said lower mold plate for separately introducing material into said first mold cavity and said second mold cavity to encapsulate one side of each said first electronic device and said second electronic device of said two electronic devices; and
at least one passageway connected to each of said first and second mold cavities for venting gases from each of said first and second mold cavities.
2. The apparatus of claim 1, wherein said apparatus comprises an injection molding apparatus for providing an encapsulation material to encapsulate said at least two electrical devices of each of said two substrates.
3. An apparatus for providing encapsulation material to devices on a substrate, said apparatus comprising:
two electronic devices, each electronic device having electronic components mounted on a front side of a substrate thereof, a first electronic device of said two electronic devices and a second electronic device of said two electronic devices having one of a conductor-grid-array and pads on said opposing backside of said substrate thereof;
an upper mold plate and a mating lower mold plate, each mold plate having a mold cavity portion, said mold cavity portion in each said upper and lower mold plates comprising a mold cavity encapsulating at least a portion of each substrate having said electronic components thereon, said two electronic devices situated backside of said substrate of one of said two electronic devices to backside of said substrate of the other of said two electronic devices in said mold cavity;
a force-applying device for applying a force to said upper mold plate and said lower mold plate about said substrate of an intervening first electronic device of said two electronic devices and said substrate of an intervening second electronic device of said two electronic devices oriented in a backside-to-backside configuration, said mold cavity portion of said upper mold forming a first mold cavity over at least a portion of one of said first electronic device and said second electronic device of said two electronic devices and said mold cavity portion of said lower mold plate forming a second mold cavity over at least a portion of the other of said first electronic device and said second electronic device of said two electronic devices;
at least one passageway separately introducing material into said first mold cavity and said second mold cavity to encapsulate one side of each said first electronic device and said second electronic device of said two electronic devices; and
a planar buffer member configured to be positioned between opposing backsides of said backside-to-backside substrates of said first electronic device and said second electronic device of said two electronic devices, said planar buffer member having cut-out portions for insertion therein of conductor-grid-arrays of said first electronic device and said second electronic device of said two electronic devices.
4. An apparatus for providing encapsulation material on one-sided of each of two substrates for electronic devices mounted on one side of a substrate, said apparatus comprising:
two substrate-based electronic devices, each substrate-based electronic device having electronic components mounted on a first side of a substrate, said substrate having one of an opposite second side and one of a conductor-grid-array and pads on said opposite second side of said substrate;
an upper mold plate and a mating lower mold plate, each mold plate having a mold cavity portion;
a force-applying device for applying a force for compressing said upper mold plate and said mating lower mold plate about said substrate of an intervening first substrate-based electronic device of said two substrate-based electronic devices and said substrate of an intervening second substrate-based electronic device of said two substrate-based electronic devices disposed opposite second side to opposite second side, said mold cavity portion of said upper mold plate forming a first mold cavity over at least a portion of said first substrate-based electronic device and said mold cavity portion of said lower mold plate forming a second mold cavity over at least a portion of said second substrate-based electronic device, said first mold cavity substantially isolated from said second mold cavity by said opposite second side to opposite second side substrates;
passageways introducing fluid plastic into each of said first and second mold cavities encapsulating one side of each said first substrate-based electronic device and said second substrate-based electronic device of said two substrate-based electronic devices;
and a planar buffer member positioned between said opposite second sides of said substrates of said first substrate-based electronic device and said second substrate-based electronic device of said two substrate-based electronic devices.
5. The apparatus of claim 4, wherein said planar buffer member has cut-out portions for insertion therein of conductor-grid-arrays of said first and second substrate-based electronic devices.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An element unit comprising:
a shaft;
a plurality of separation membrane elements each including a separation membrane pair having two separation membranes disposed so that permeate-side surfaces of the separation membranes face each other and a water collecting flow path provided between the separation membranes, and a sealed portion that seals the separation membranes at peripheral edge portions of the separation membranes;
a suspension portion that suspends the separation membrane elements on the shaft; and
a water collection nozzle that provides communication between the water collection flow path and an outside of the separation membrane elements,
wherein each of the separation membrane elements comprises a resin portion that adheres to both the permeate-side surfaces of the separation membrane pair facing each other via adhesion core material, and a predetermined space is secured between the separation membrane pair by the resin portion.
2. The element unit according to claim 1,
wherein the resin portion is in a dot shape, a linear shape or a grid shape.
3. The element unit according to claim 1,
wherein the shaft comprises a plurality of unit shafts.
4. The element unit according to claim 3,
wherein the shaft further comprises a shaft joint that connects mutually adjacent unit shafts.
5. The element unit according to claim 1,
wherein the shaft is provided so as to extend through the suspension portion, and
wherein the separation membrane element is attachable to and detachable from the shaft by inserting and removing the separation membrane element into and from the suspension portion for the shaft.
6. The element unit according to claim 1,
wherein the separation membranes are flat membranes, and
wherein in the separation membrane pair, an outward side that is more outward in a planer direction of the separation membranes than the water collection flow path is provided with a through-hole through which the shaft is able to extend, and
wherein the hole functions as the suspension portion.
7. The element unit according to claim 6,
wherein the separation membranes have a generally quadrangular shape, and
wherein the through-hole is provided in each of four corners of the separation membrane pair.
8. A separation membrane module comprising:
the element unit according to claim 1;
a casing that houses the element unit so as to allow the element unit to be taken out and put in; and
an aeration block that is disposed below the casing and that supplies air to the element unit.
9. The separation membrane module according to claim 8,
wherein the casing has, on at least one of an upper surface and a side surface, an opening portion which the element unit is able to be taken out from and inserted into.
10. A method for attaching and detaching the separation membrane element in the separation membrane module according to claim 8 that includes the shaft provided so as to extend through the suspension portion,
the attaching and detaching method for the separation membrane element being characterized in that the separation membrane element is attached to and detached from the separation membrane module by inserting and removing the separation membrane element into and from the suspension portion by sliding the shaft.
11. An element unit comprising:
a shaft;
a plurality of separation membrane elements each including a separation membrane pair having two separation membranes disposed so that permeate-side surfaces of the separation membranes face each other and a water collecting flow path provided between the separation membranes, and a sealed portion that seals the separation membranes at peripheral edge portions of the separation membranes;
a suspension portion that suspends the separation membrane elements on the shaft; and
a water collection nozzle that provides communication between the water collection flow path and an outside of the separation membrane elements,
an aeration block that is disposed below the element block, and
a device that supplies air to the element block from the aeration block,
wherein each of the separation membrane elements comprises a resin portion that adheres to both the permeate-side surfaces of the separation membrane pair facing each other via adhesion core material, and a predetermined space is secured between the separation membranes by the resin portion,
the separation membrane element has a structure to allow energy of the air to escape,
the separation membrane element is substantially quadrangular,
the separation membrane element is suspended by at least four suspension portions above.
12. The element unit according to claim 11,
wherein the resin portion is in a dot shape, a linear shape or a grid shape.
13. The element unit according to claim 11,
wherein the suspension portions are provided at four corners of the separation membrane element.
14. An element unit comprising:
a shaft;
a plurality of separation membrane elements each including a separation membrane pair having two separation membranes disposed so that permeate-side surfaces of the separation membranes face each other and a water collecting flow path provided between the separation membranes, and a sealed portion that seals the separation membranes at peripheral edge portions of the separation membranes;
a suspension portion that suspends the separation membrane elements on the shaft; and
a water collection nozzle that provides communication between the water collection flow path and an outside of the separation membrane elements,
an aeration block that is disposed below the element block, and
a device that supplies air to the element block from the aeration block,
wherein the water collection nozzles are located at an upper half side of the separation membrane element, and
wherein a collection nozzle group comprising a part of the water collection nozzles is arranged on at least one side of the element unit.
15. The element unit according to claim 14,
wherein each of the separation membrane elements comprises a resin portion that adheres to both the permeate-side surfaces of the separation membrane pair facing each other via adhesion core material, and
a predetermined space is secured between the separation membranes by the resin portion.
16. The element unit according to claim 15,
wherein the resin portion is in a dot shape, a linear shape or a grid shape.
17. The element unit according to claim 15,
wherein the separation membrane element is substantially quadrangular, and
wherein the suspension portions are provided at four corners of the separation membrane element.