1. A capacitor assembly, comprising:
a substrate;
a first conductive auxiliary layer on the substrate;
a capacitor dielectric, which is connected to the first conductive auxiliary layer within a first boundary area between the capacitor dielectric and the first conductive auxiliary layer;
a second conductive auxiliary layer which is connected to the capacitor dielectric within a second boundary area between the capacitor dielectric and the second conductive auxiliary layer, wherein an effective capacitor area is present where the first boundary area and the second boundary area overlap the dielectric; and
a contact electrode for contacting the first conductive auxiliary layer in a contacting area, wherein the contacting area is disposed on a surface of the first conductive auxiliary layer opposing the first boundary area and overlaps with the effective capacitor area only partly or not at all, so that at least part of the first conductive auxiliary layer, which is within the effective capacitor area, is adjacent to the substrate or not adjacent to the contact electrode.
2. The capacitor assembly according to claim 1, wherein the first conductive auxiliary layer consists of a first material and the contact electrode of a second material, wherein the first conductive auxiliary layer and the contact electrode are produced in different process steps.
3. The capacitor assembly according to claim 1, wherein the contact electrode consists of a conductive material or a semiconductor material.
4. The capacitor assembly according to claim 1, wherein the first conductive auxiliary layer is a barrier layer, which forms a diffusion barrier between the contact electrode and the capacitor dielectric.
5. The capacitor assembly according to claim 1, wherein the contact electrode is part of a conductive trace disposed in the substrate.
6. The capacitor assembly according to claim 1, wherein the contact electrode encircles or encloses in rectangular shape the effective capacitor area, or has a structure which is not solid in an area within a peripheral range.
7. The capacitor assembly according to claim 1, wherein the first contacting area does not overlap with the effective capacitor area, and wherein the first contacting area is disposed at a defined distance to the effective capacitor area.
8. The capacitor assembly according to claim 1, wherein the second conductive auxiliary layer is in contact with a via hole like the first conductive auxiliary layer.
9. A method for generating a capacitor assembly, comprising:
a) providing a substrate, a first conductive auxiliary layer on the substrate, a capacitor dielectric which is connected to the first conductive auxiliary layer within a first boundary area between the capacitor dielectric and the first conductive auxiliary layer, and a second conductive auxiliary layer which is connected to the capacitor dielectric within a second boundary area between the capacitor dielectric and the second conductive auxiliary layer, so that an effective capacitor area is present where the first boundary area and the second boundary area overlap; and
b) contacting the first conductive auxiliary layer with a contact electrode in a contacting area, so that the contacting area is disposed on a surface of the first conductive auxiliary layer opposite the first boundary area, and overlaps the effective capacitor area at most partly or not, so that at least part of the first conductive auxiliary layer within the effective capacitor area is adjacent to the substrate or not to the contact electrode.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for establishing an electrical connection between a rigid printed circuit board and a metallic contact partner, the method comprising the following steps of:
providing the rigid printed circuit board with at least a prepreg layer and a copper layer having a contact pad on the copper layer;
bringing the metallic contact partner and the printed circuit board close to each other with the metallic contact partner in contact with the contact pad on the copper layer of the printed circuit board;
forming a cutout in the printed circuit board by removing the prepreg layer in at least a subregion underneath the contact pad;
forming a welded joint between the contact partner and the contact pad by irradiating with laser light; and
providing a contacting strap forming a pretensioned spring in the rigid printed circuit board.
2. The method according to claim 1, which further comprises providing the rigid printed circuit board with at least two copper layers and at least one prepreg layer extending therebetween.
3. The method according to claim 2, which further comprises providing the copper layers of the printed circuit board with a thickness of 35 \u03bcm to 70 \u03bcm and providing the prepreg layer of the printed circuit board with a thickness of 150 \u03bcm to 350 \u03bcm.
4. The method according to claim 1, which further comprises carrying out the step of removing the prepreg layer by mechanical machining or by irradiation with laser light.
5. The method according to claim 1, which further comprises using an Nd:YAG laser as a laser light source and operating the laser light source at an average output power in a range of from 30 to 500 W.
6. The method according to claim 1, which further comprises forming the welded joint by producing at least one weld spot having a diameter of between 0.3 and 0.6 mm with an optical system located in a beam path of the laser light.
7. The method according to claim 1, which further comprises forming the welded joint by applying a welding energy of 7 to 11 J during a welding time of 3 to 10 ms.
8. The method according to claim 1, which further comprises forming the welded joint by using a pulsed Nd:YAG laser having a pulse power of 1 to 3 kW.
9. The method according to claim 1, which further comprises creating the welded joint with a plurality of laser light pulses.
10. The method according to claim 1, which further comprises creating the welded joint with a plurality of double laser light pulses.