What is claimed is:
1. A chamber for treating cells in a suspension in an electric field, the chamber comprising a vessel in which the suspension may be placed and at least two electrodes whose electrode surfaces face each other, wherein the suspension is between the electrode surfaces and the electrodes are connectable to different poles of a source of voltage to generate an electric field between the electrode surfaces, and the electrodes are configured such that a non-uniform field is generated, wherein the electrodes (16, 17, 18 and 19) are laminate and continuous and have electrically conductive electrode surfaces (16, 17, 18, 19), and wherein an electrode surface (16, 17, 18, 19; 36) of at least one of two electrodes (16, 17, 18, 19; 32) is shaped such that a non-uniform field with several maxima distributed over the electrode surface is generated between the two electrodes (16, 17, 18, 19; 32).
2. The chamber of claim 1, wherein the electrode surfaces (16, 17, 18, 19) are continuous.
3. The chamber of claim 1, wherein the electrode surface has elevations in several areas.
4. The chamber of claim 3, wherein the electrode surface (16, 17, 18, 19; 36) has a wavy shape.
5. The chamber of claim 4, wherein facing electrode surfaces of the two electrodes are wavy and include wave peaks and wave valleys that are oriented in the same direction and that lie opposite each other, in both surfaces.
6. The chamber of claim 5, wherein the wave valleys include an insulating material.
7. The chamber of claim 1, wherein the electrodes (16, 17, 18) are made of electrically conductive material.
8. The chamber of claim 1, wherein the electrodes have a core (22) with a coating of conductive material that forms the electrode surface (19).
9. The chamber of claim 8, wherein the electrode surface (36) is only partially on the core (22).
10. The chamber of claim 1, further comprising a cover to close the vessel (14).
11. The chamber of claim 10, wherein at least some of the electrodes are arranged on the cover.
12. The chamber according of claim 1, wherein the electrode surfaces are made of electrically conductive plastic or of semiconductor materials.
13. The chamber of claim 1, wherein the chamber is designed to be sterilized by irradiation.
14. The chamber of claim 1, wherein the chamber is designed to be centifuged.
15. The chamber of claim 1, further comprising means for feeding the suspension through the chamber in a flow-through mode.
16. The chamber of claim 1, wherein the chamber is a disposable article.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1.-23. (canceled)
24. A method for producing a component comprising:
providing a basic substrate, having paper as substrate material;
applying at least one integrated circuit to the basic substrate;
enveloping the at least one integrated circuit applied on the basic substrate with an encapsulant; and
removing at least parts of the basic substrate from the at least one enveloped integrated circuit.
25. The method of claim 24, comprising:
applying electrically conductive external contact elements to the basic substrate; and
electrically connecting the external contact elements to contact pads of the at least one integrated circuit.
26. The method of claim 25, comprising applying the external contact elements to the basic substrate by an inkjet printing method.
27. The method of claim 25, comprising reinforcing the external contact elements by electroless deposition of electrically conductive material.
28. The method of claim 25, comprising wherein, after the removal of at least parts of the basic substrate from the at least one enveloped integrated circuit, parts of the external contact elements are externally accessible.
29. The method of claim 24, comprising wherein the removal of at least parts of the basic substrate from the at least one enveloped integrated circuit by pulling off or grinding or washing away or etching is provided.
30. A method for producing a component comprising:
providing a basic substrate, having at least one electrically insulating surface;
applying electrically conductive external contact elements directly to the at least one electrically insulating surface of the basic substrate;
applying at least one integrated circuit to the basic substrate;
enveloping the at least one integrated circuit applied on the basic substrate with an encapsulant; and
removing at least parts of the basic substrate from the at least one enveloped integrated circuit.
31. The method of claim 30, comprising wherein the basic substrate has paper or plastic or an organic material as substrate material.
32. The method of claim 30, comprising wherein the at least one electrically insulating surface andor the basic substrate are non-metallic.
33. The method of claim 30, comprising applying the external contact elements to the at least one electrically insulating surface by an inkjet printing method.
34. The method of claim 30, comprising reinforcing the external contact elements by electroless deposition of electrically conductive material.
35. The method of claim 30, comprising wherein, after the removal of at least parts of the basic substrate from the at least one enveloped integrated circuit, parts of the external contact elements are externally accessible.
36. The method of claim 30, comprising wherein the removal of at least parts of the basic substrate from the at least one enveloped integrated circuit by pulling off or grinding or washing away or etching is provided.
37. A device comprising at least one component and a basic substrate, wherein the at least one component has at least one integrated circuit enveloped by an encapsulant and the at least one component is arranged on the basic substrate having paper as substrate material.
38. The device of claim 37, comprising wherein the at least one component has electrically conductive external contact elements which are applied on the basic substrate and are electrically connected to contact pads of the at least one integrated circuit.
39. The device of claim 37, comprising wherein the basic substrate is provided for being removed.
40. The device of claim 37, comprising wherein a plurality of components are arranged on the basic substrate.
41. A device comprising:
at least one component; and
a basic substrate;
wherein the at least one component has at least one integrated circuit enveloped by an encapsulant and is arranged on the basic substrate, and wherein the basic substrate has at least one electrically insulating surface on which electrically conductive external contact elements of the at least one component are applied directly.
42. The device of claim 41, comprising wherein the basic substrate has paper or plastic or an organic material as substrate material.
43. The device of claim 41, comprising wherein the at least one electrically insulating surface andor the basic substrate are non-metallic.
44. The device of claim 41, comprising wherein the basic substrate is provided for being removed.
45. The device of claim 41, comprising wherein a plurality of components are arranged on the basic substrate.