1. A method of manufacturing a printed circuit board (PCB) having at least one conductive layer and at least one non-conductive layer and forming a first surface and a second surface, said method comprising:
disposing at least one via through the PCB to connect the surfaces wherein the at least one via includes a metallic portion having a pair of ends and defining a hole;
filling the hole of the at least one via with a solder mask to a certain level between the ends; and
coating at least a portion of one of the surfaces of the PCB with an organic solderability preservative (OSP).
2. A method as set forth in claim 1 wherein the at least one via is further defined as a plurality of vias including at least one thermal transfer via for conduction of heat between the surfaces and at least one electrical via for conduction of electrical current between the surfaces.
3. A method as set forth in claim 2 wherein said step of filling the hole of the at least one via with a solder mask is further defined as filling the hole of the at least one electrical via with a solder mask to a level of about 100 percent of the height of the electrical via.
4. A method as set forth in claim 2 wherein said step of filling the hole of the at least one via with a solder mask is further defined as filling the hole of the at least one thermal transfer via with a solder mask to a level between 45 and 95 percent of the height of the thermal transfer via.
5. A method as set forth in claim 4 wherein the level is about 70 percent of the height of the thermal transfer via.
6. A method as set forth in claim 2 wherein said step of filling the hole of the at least one via with a solder mask is further defined as filling the hole of the at least one electrical via with a solder mask to a level of about 100 percent of the height of the electrical via and filling the hole of the at least one thermal transfer via with a solder mask to a level between 45 and 95 percent of the height of the thermal transfer via.
7. A method as set forth in claim 2 further comprising the step of placing a thermal transfer material in thermal communication with the at least one thermal transfer via for transferring heat from the thermal transfer via.
8. A method as set forth in claim 2 further comprising the step of placing a heat sink in thermal communication with the at least one thermal transfer via for transferring heat from the thermal transfer via.
9. A method as set forth in claim 1 wherein said step of coating at least a portion of one the surfaces of the PCB with the OSP is performed in response to said the filling of the hole of the at least one via.
10. A method of manufacturing a printed circuit board (PCB) having a pair of conductive layers and at least one non-conductive layer sandwiched between said conductive layers and wherein said conductive layers define a first surface and a second surface, said method comprising:
disposing at least one electrical via defining a pair of ends and a hole extending between said ends through the layers to electrically connect the conductive layers;
completely filling the hole of the electrical via with a solder mask;
disposing at least one thermal transfer via defining a pair of ends and a hole extending between said ends through the layers to connect the surfaces; and
partially filling the hole of the thermal transfer via with a solder mask.
11. A method as set forth in claim 10 further comprising the step of coating at least a portion of one of the surfaces of the PCB with an organic solderability preservative (OSP).
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A cargo securing system for restraining cargo in a vehicle cargo area having a cargo bed, said vehicle cargo area having a perimeter located above said cargo bed and lying in a substantially horizontal plane, said cargo securing system comprising:
a chain assembly having a plurality of attached links, said chain assembly configured to be disposed in said substantially horizontal plane above the vehicle cargo bed of said vehicle cargo area, said chain assembly further configured to extend around substantially the entire said perimeter of said vehicle cargo area;
at least four anchoring devices;
wherein said at least four anchoring devices includes a plurality of brackets;
each bracket of said plurality of brackets comprising:
a flat central portion with a top, a bottom and a pair of parallel side edges;
a flat first side portion having at least one retaining hole therethrough, said first side portion extending at an angle from one of said parallel side edges; and
a flat second side portion having at least one retaining hole therethrough, said second side portion extending at an angle from the other of said parallel side edges;
a plurality of detachable links;
wherein said at least four anchoring devices are attached to said chain assembly by said detachable links;
wherein said at least four anchoring devices are adapted to secure said chain assembly onto a surface of a vehicle with said chain assembly disposed in said substantially horizontal plane and said chain assembly extending around substantially the entire perimeter of said vehicle cargo area;
at least one flexible restrainer configured to wrap around said cargo and secure said cargo to said vehicle cargo area;
wherein said plurality of attached links of said chain assembly provide multiple attachment points for said at least one restrainer to be fastened thereon for restraining cargo; and
said at least one flexible restrainer being attached to said plurality of attached links of said chain assembly at two or more of said attachment points.
2. The cargo securing system according to claim 1, wherein the surface of the vehicle is a sidewall.
3. The cargo securing system according to claim 1, further comprising:
a plurality of telescoping units;
each telescoping unit having a telescoping shaft and a telescoping rod;
wherein said telescoping rod is inserted within and extends vertically from said telescoping shaft;
means attaching said telescoping shafts of said telescoping units to said plurality of brackets, with each of said plurality of telescoping units attached to one of said plurality of brackets; and
wherein there is an additional chain assembly attached at the tops of said telescoping units.
4. The cargo securing system according to claim 3, wherein said means attaching said telescoping shafts of said telescoping units to said plurality of brackets comprise bolts.
5. The cargo securing system according to claim 3, wherein said means attaching said telescoping shafts of said telescoping units to said plurality of brackets comprise welding.
6. The cargo securing system according to claim 3, further comprising a plurality of fasteners, said fasteners attaching said additional chain assembly to the tops of said telescoping units.
7. The cargo securing system according to claim 3, wherein said additional chain assembly comprises a single chain structure attached to said tops of said telescoping units, and descending downwardly to be attached at the bottoms of said telescoping units.