1. A data embedding method to embed data into an image comprising:
dividing, by a predetermined length, subject data to be embedded into a plurality of pieces of partial data; and
embedding, using a processor, to generate resultant images by
a first embedding which embeds a first position information specifying divided positions of a first partial data, a first bit sequence obtained by rotating the first partial data in a certain direction by a first number of bits, and the first number of bits into a first input image,
a second embedding which embeds a second position information specifying divided positions of a second partial data, a second bit sequence obtained by rotating the second partial data in the certain direction by the first number of bits, and the first number of bits into a second input image, and
a third embedding which embeds the second position information, a third bit sequence obtained by rotating the second partial data in the certain direction by a second number of bits, and the second number of bits into a third input image.
2. A data recognition method used to extract a plurality of pieces of partial data from a display image and restore a subject image to be embedded, the display image displayed by a method to display resultant images in which a subject data is embedded as a plurality of pieces of partial data by the data embedding method according to claim 1 and to sequentially display the resultant images on a display device in a predetermined order and at predetermined display time intervals, the data recognition method comprising:
photographing the display image at predetermined photographing time intervals;
extracting, using a processor, the pieces of embedded partial data and position information from photographed images; and
integrating the pieces of partial data extracted based on the pieces of extracted position information to restore the subject data to be embedded, after repeatedly performing the photographing and the extracting until the pieces of partial data and position information are all obtained while identifying the pieces of extracted position information,
wherein the extracting extracts the first bit sequence from a first photographed image obtained by photographing the first input image after the first embedding,
the integrating obtains the first partial data by rotating the first bit sequence in an opposite direction from the certain direction by the first number of bits,
when the extracting fails to extract the second bit sequence from a second photographed image obtained by photographing the second input image after the second embedding, the extracting extracts the third bit sequence from a third photographed image obtained by photographing the third input image after the third embedding, and
the integrating obtains the second partial data by rotating the third bit sequence in the opposite direction by the second number of bits.
3. The data recognition method according to claim 2, wherein
the position information include at least information relating to an integrating order of the plurality of pieces of partial data,
the integrating determines, by identifying the integrating order indicated by the position information, that extraction of all the pieces of partial data is completed when a predetermined number of the plurality of pieces of partial data of a different integrating order are extracted, and
the integrating integrates the plurality of pieces of partial data based on the integrating order.
4. The data recognition method according to claim 2, wherein
the position information include at least information relating to a number of divisions of the subject data to be embedded and an integrating order of the plurality of pieces of partial data,
the integrating determines, by identifying the number of divisions and the integrating order indicated by the position information, that extraction of all the pieces of partial data is completed when the pieces of partial data of a different integrating order equal in number to the number of divisions are extracted, and
the integrating integrates the plurality of pieces of partial data based on the integrating order.
5. The data recognition method according to claim 2, wherein
the position information include at least information relating to an integrating order of the plurality of pieces of partial data, and a position information of a partial data that is at atop of the integrating order includes an information relating to a number of divisions of the plurality of pieces of partial data,
the integrating determines, by identifying the number of divisions and an integrating order indicated by the pieces of position information, that extraction of all the pieces of partial data is completed when the plurality of pieces of partial data of a different integrating order equal in number to the number of divisions are extracted, and
the integrating integrates the plurality of pieces of partial data based on the integrating order.
6. The data embedding method according to claim 1, wherein
the dividing cuts the subject data to be embedded by the predetermined length, and outputs a plurality of cut data as the plurality of pieces of partial data.
7. The data embedding method according to claim 1, wherein
the dividing cuts the subject data to be embedded by the predetermined length, performs a predetermined reversible data converting operation for a plurality of pieces of the cut data, and outputs a resulting plurality of pieces of converted data as the plurality of pieces of partial data.
8. The data embedding method according to claim 6, wherein
the dividing generates the plurality of pieces of partial data so that an identical portion of a plurality of the cut data is redundantly included in the plurality of pieces of partial data.
9. The data embedding method according to claim 1, wherein
the plurality of input images are identical, obtained by duplicating one still input image.
10. The data embedding method according to claim 1, wherein
the plurality of input images are a plurality of frame images composing an input moving image.
11. The data recognition method according to claim 2, wherein
the photographing time interval is shorter than the display time interval.
12. A data embedding device performing a data embedding operation by the data embedding method according to claim 1.
13. A data recognition device performing a data recognition operation by the data recognition method according to claim 2.
14. A non-transitory recording medium storing a program, the program causing a computer to execute a process to embed data into an image, the process comprising:
dividing, by a predetermined length, subject data to be embedded into a plurality of pieces of partial data; and
to generate resultant images by
a first embedding which embeds a first position information specifying divided positions of a first partial data, a first bit sequence obtained by rotating the first partial data in a certain direction by a first number of bits, and the first number of bits into a first input image,
a second embedding which embeds a second position information specifying divided positions of a second partial data, a second bit sequence obtained by rotating the second partial data in the certain direction by the first number of bits, and the first number of bits into a second input image, and
a third embedding which embeds the second position information, a third bit sequence obtained by rotating the second partial data in the certain direction by a second number of bits, and the second number of bits into a third input image.
15. A non-transitory recording medium storing a program, the program causing a computer to perform a process to extract a plurality of pieces of partial data from a display image and restore subject data to be embedded, the process comprising:
photographing the display image at predetermined photographing time intervals;
extracting, the pieces of embedded partial data and position information from the photographed images; and
integrating the pieces of partial data extracted based on the pieces of extracted position information to restore the subject data to be embedded, after repeatedly performing the photographing and the extracting until the pieces of partial data and position information are all obtained while identifying the pieces of extracted position information,
wherein the extracting extracts the first bit sequence from a first photographed image obtained by photographing the first input image after the first embedding,
the integrating obtains the first partial data by rotating the first bit sequence in an opposite direction from the certain direction by the first number of bits,
when the extracting fails to extract the second bit sequence from a second photographed image obtained by photographing the second input image after the second embedding, the extracting extracts the third bit sequence from a third photographed image obtained by photographing the third input image after the third embedding, and
the integrating obtains the second partial data by rotating the third bit sequence in the opposite direction by the second number of bits.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor device comprising:
a base material portion that includes a semiconductor substrate and an insulating film that is formed on one face of the semiconductor substrate and on which a hole is formed along a thickness direction of the semiconductor substrate;
a hole wiring portion that includes a hole electrode formed on a side wall of the base material portion that forms the hole;
a metallic film that is formed within the insulating film and that is electrically connected to the hole wiring portion;
a conductive protective film that is arranged at a position that opposes an opening portion of the hole and formed to be in physical contact with the metallic film within the insulating film,
wherein the conductive protective film is provided on the semiconductor substrate side of the metallic film; and
wherein a region of the metallic film in the vicinity of the outer circumference end portion is covered by the insulating film.
2. The semiconductor device according to claim 1,
wherein an opening area of an opening portion of the insulating film is smaller than the area of the metallic film.
3. The semiconductor device according to claim 1,
wherein the conductive protective film is arranged at a position that opposes an opening portion of the hole.
4. The semiconductor device according to claim 1, wherein the conductive protective film comprises any one of an Au film, an Ni film, and a Cu film.
5. The semiconductor device according to claim 1, wherein the conductive protective film comprises at least one of a W film, a Ti film, a laminated film of a TiN film and a Ti film, and a laminated film of a TaN film and a Ta film.
6. A semiconductor device comprising:
a base material portion that includes a semiconductor substrate and an insulating film that is formed on one face of the semiconductor substrate and on which a hole is formed along a thickness direction of the semiconductor substrate;
a hole wiring portion that includes a hole electrode formed on a side wall of the base material portion that forms the hole;
a metallic film that is formed within the insulating film and that is electrically connected to the hole wiring portion;
a conductive protective film that is arranged at a position that opposes an opening portion of the hole and formed to be in physical contact with the metallic film within the insulating film,
wherein the metallic film is provided on the semiconductor substrate side of the conductive protective film; and
wherein a region of the conductive protective film in the vicinity of the outer circumference end portion is covered by the insulating film.
7. The semiconductor device according to claim 6,
wherein an opening area of an opening portion of the insulating film is smaller than the area of the conductive protective film.
8. The semiconductor device according to claim 6,
wherein the conductive protective film is arranged at a position that opposes an opening portion of the hole.
9. The semiconductor device according to claim 6, wherein the conductive protective film comprises any one of an Au film, an Ni film, and a Cu film.
10. The semiconductor device according to claim 6, wherein the conductive protective film comprises at least one of a W film, a Ti film, a laminated film of a TiN film and a Ti film, and a laminated film of a TaN film and a Ta film.