1. A method of forming a film stack on a substrate, the method comprising:
under vacuum conditions, exposing the substrate to a plasma activated oxygen species;
converting an exposed surface of the substrate into a continuous monolayer of a first dielectric material; and
forming a second dielectric material on the continuous monolayer of the first dielectric material without exposing the substrate to an air break.
2. The method of claim 1, where converting the exposed surface into the continuous monolayer includes supplying plasma activated oxygen species to the exposed surface until domains of the first dielectric material formed by reaction of the plasma activated oxygen species with the substrate merge into the continuous monolayer
3. The method of claim 1, where forming the second dielectric material comprises depositing the second dielectric material by adsorbing a dielectric material precursor on the continuous monolayer of the first dielectric material.
4. The method of claim 1, where forming the second dielectric material without exposing the substrate to an air break comprises forming the second dielectric material without exposing the substrate to a vacuum break.
5. The method of claim 1, where exposing the substrate to the plasma activated oxygen species includes exposing the substrate to an activated nitrogen species.
6. The method of claim 1, where the substrate is selected from the set consisting of Si, Ge, SiGe, GaAs, InGaAs, and InP, and where the first dielectric material is selected from the set consisting of SiOxNy, SiOx, GeOxNy, GeOx, SiGeOxNy, SiGeOx, GaAsOxNy, GaAsOx, InGaAsOxNy, InGaAsOx, InPOxNy, and InPOx.
7. The method of claim 1, where the second dielectric material includes a high-K dielectric material.
8. The method of claim 1, where the plasma activated oxygen species is provided by one or more of an ozone source and a remote oxygen plasma source.
9. The method of claim 1, where the substrate is hydrogen terminated and where the first dielectric material is non-hydrogen terminated.
10.-16. (canceled)
17. A film stack for a gate assembly formed on a semiconducting substrate, comprising:
a continuous monolayer of a first dielectric material formed from an exposed surface of the semiconducting substrate via reaction of the exposed surface with a plasma activated oxygen species; and
a high-K dielectric material formed upon the first dielectric material without an intervening air break.
18. The gate assembly of claim 17, where the first dielectric material includes nitrogen.
19. The gate assembly of claim 17, where the semiconducting substrate is selected from the set consisting of Si, Ge, SiGe, GaAs, InGaAs, and InP, and where the first dielectric material is selected from the set consisting of SiOxNy, SiOx, GeOxNy, GeOx, SiGeOxNy, SiGeOx, GaAsOxNy, GaAsOx, InGaAsOxNy, InGaAsOx, InPOxNy, and InPOx.
20. The gate assembly of claim 17, where the high-K dielectric material is selected from the set consisting of HfOx, TiOx, SrOx, ZrOx, LaOx, SrTixOy, AlOx, MgO, BaTixOy, and SrxBa(1-x)TiyOz.
21. The method of claim 1, where the step of converting an exposed surface of the substrate into a continuous monolayer comprises exposing the substrate to a vacuum pressure between 0.5 Torr and 5 Torr.
22. The method of claim 1, where the step of forming a second dielectric material comprises exposing the substrate to a vacuum pressure between 1 Torr and 9 Torr.
23. The method of claim 1, where the second dielectric is selected from the group consisting of HfOx, TiOx, SrOx, ZrOx, LaOx, SrTixOy, AlOx, MgO, BaTixOy, and SrxBa(1-x)TiyOz.
24. The method of claim 1, where the step of converting an exposed surface of the substrate and the step of forming a second dielectric material are performed in the same processing chamber.
25. The method of claim 1, where the step of converting an exposed surface of the substrate and the step of forming a second dielectric material are performed in different processing chambers.
26. The gate assembly of claim 17, where a thickness of the first dielectric material is about 4 {acute over (\u212b)}.
27. The gate assembly of claim 17, where high-K dielectric material is formed using a process selected from the group consisting of chemical vapor deposition, plasma-enhanced chemical vapor deposition, and atomic layer deposition.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for using a surgical instrument with a robotic manipulator of a minimally invasive surgical system, the method comprising:
providing the surgical instrument, the surgical instrument including:
an elongate shaft extending along an axis between a distal end and a proximal end;
a chassis disposed at the proximal end, the chassis including a frame, an interface fitting demountably coupled with the frame via sliding engagement along the axis between the frame and the interface fitting, and a securing feature that is operable to prevent relative axial sliding between the interface fitting and the frame; and
an end effector disposed at the distal end;
mounting the chassis onto a holding fixture of the robotic manipulator by engaging a mounting feature of the interface fitting with a complementary-shaped mounting feature of the holding fixture;
articulating the end effector within a minimally invasive surgical site;
in response to binding of the surgical instrument within the surgical site so as to inhibit removal of the end effector and shaft from the surgical site, and so as to inhibit disengagement of the mounting feature of the interface fitting from the mounting feature of the holding fixture, releasing the securing feature so as to allow relative sliding between the interface fitting and the frame; and
demounting the frame, shaft, and end effector of the surgical instrument from the interface fitting of the surgical instrument and the holding fixture of the robotic manipulator by moving the interface fitting relative to the frame along the axis.
2. The method of claim 1, further comprising:
sliding the interface fitting into engagement with the frame; and
securing the interface fitting in engagement with the frame via the securing feature.
3. The method of claim 1, wherein the securing feature comprises a removable fastener.
4. The method of claim 3, wherein the securing feature comprises a plurality of removable fasteners.
5. The method of claim 1, wherein the interface fitting and the frame comprise complementary-shaped interfacing features that include a slot extending along the axis.
6. The method of claim 5, wherein the complementary-shaped interfacing features of the interface fitting and the frame comprise two slots extending along the axis, the slots disposed on opposite sides of the frame.
7. The method of claim 6, wherein the frame includes the two slots and the interface fitting includes two protruding mounting features extending along the axis.
8. The method of claim 7, wherein each of the protruding mounting features comprises a flange extending along the axis.
9. A surgical instrument for use with a robotic manipulator of a minimally invasive surgical system, the robotic manipulator having a holding fixture, the surgical instrument comprising:
an elongate shaft extending along an axis between a distal end and a proximal end;
a chassis disposed at the proximal end of the shaft, the chassis including:
a frame holding the shaft,
an interface fitting demountably coupled with the frame and the holding fixture via sliding engagement along the axis between the frame and the interface fitting, the interface fitting having a mounting feature receivable by the holding fixture of the robotic manipulator so as to mount the instrument thereon, the frame and the interface fitting together comprising complementary-shaped interfacing features that include a slot extending along the axis, and
a securing feature releasably preventing relative axial sliding between the interface fitting and the frame; and
an end effector disposed at the distal end of the shaft, the end effector articulatable relative to the shaft so as to manipulate tissue within a minimally invasive surgical site,
the securing feature configured for releasing in response to binding of the surgical instrument within the surgical site, the binding inhibiting removal of the end effector and the shaft from the surgical site and disengagement of the mounting feature of the interface fitting from the holding fixture, releasing of the securing feature allowing relative sliding between the interface fitting and the frame so as to promote demounting the frame, the shaft, and the end effector of the surgical instrument from the interface fitting of the surgical instrument and the holding fixture of the robotic manipulator by moving the interface fitting relative to the frame along the axis,
wherein, upon releasing of the securing feature, the interface fitting can be demounted before the frame is demounted from the holding fixture.
10. The surgical instrument of claim 9, wherein the securing feature comprises a removable fastener.
11. The surgical instrument of claim 10, wherein the securing feature comprises a plurality of removable fasteners.
12. The surgical instrument of claim 9, wherein the complementary-shaped interfacing features of the frame and the interface fitting comprise two slots extending along the axis, the slots disposed on opposite sides of the frame.
13. The surgical instrument of claim 12, wherein the complementary-shaped interfacing features of the frame includes the two slots and the complementary-shaped interfacing features of the interface fitting includes two protruding mounting features extending along the axis.
14. The surgical instrument of claim 13, wherein each of the protruding mounting features comprises a flange extending along the axis.
15. The surgical instrument of claim 9, wherein the interface fitting has a u-shaped configuration that interfaces with the frame on three sides of the frame.
16. The surgical instrument of claim 15, wherein the interface fitting is received within the slot extending along the axis.
17. The surgical instrument of claim 16, wherein the securing feature comprises two removable fasteners, each of the removable fasteners coupling with a nut retained by the frame.