1. A computer program product comprising:
a computer readable medium;
computer program instructions on the computer-readable medium, wherein the computer program instructions, when executed by a computer, direct the computer to perform a method of obtaining consent to electronically send information to a user, the method comprising: receiving consent from the user.
2. The computer program product of claim 1 wherein the method further comprises directing the computer to send the consent to a second computer.
3. The computer program product of claim 2 wherein the sending occurs over a computer communications link.
4. The computer program product of claim 1 wherein the computer program product further comprises instructions for providing access to the information.
5. The computer program product of claim 4 wherein providing access comprises providing instructions for obtaining the information electronically.
6. The computer program product of claim 4 wherein providing access comprises providing an address on the World Wide Web where the information is located.
7. The computer program product of claim 1, 2, 3, 4, 5 or 6 wherein the information is sensitive information.
8. The computer program product of claim 7 wherein the information is compliance information.
9. The method of claim 1 or 2 wherein the method further comprises storing the received consent.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. In combination:
a probe card for testing die on a wafer;
a shape memory alloy element connected to said probe card;
wherein said shape memory alloy utilizes thermal energy to deflect a portion of said probe card to control the geometric shape of said probe card.
2. The combination of claim 1 wherein said shape memory alloy element is located at least partially generally along a surface of said probe card.
3. The combination of claim 1 wherein said shape memory alloy element comprises and alloy of nickel and titanium.
4. The combination of claim 1 and further including at least one strain sensor located near said shape memory alloy element for monitoring strain corresponding to deflection of said probe card.
5. The combination of claim 1 comprising at least a first shape memory element and a second shape memory element oriented generally perpendicular to said first shape memory element.
6. The combination of claim 1 wherein said shape memory alloy includes at least a first shape memory element and a second shape memory element located generally on opposite top and bottom surfaces of said probe card.
7. The combination of claim 6 comprising at least a first shape memory element and a second shape memory element oriented generally perpendicular to said first shape memory element.
8. In combination:
a probe card for testing a die on a wafer; and,
at least one strain sensor on said probe card for monitoring strain corresponding to deflection of said probe card, and further comprising a first shape memory alloy element on said probe card heatable in response to output from said strain sensor.
9. The combination of claim 8 and further including at least one strain sensor located near and oriented generally parallel to said first shape memory alloy element for monitoring strain corresponding to deflection of said probe card.
10. The combination of claim 8 wherein said strain sensor is oriented generally radially outward from a center portion of said probe card.
11. The combination of claim 8 wherein said strain sensor is oriented generally parallel with a peripheral edge of said probe card.
12. The combination of claim 8 comprising at least a first shape memory element and a second shape memory element oriented generally perpendicular to said first shape memory element.
13. The combination of claim 12 comprising at least a first shape memory element and a second shape memory element located generally on opposite top and bottom surfaces of said probe card.
14. The combination of claim 8 comprising a shape memory alloy element including at least a first shape memory element and a second shape memory element located generally on opposite top and bottom surfaces of said probe card and utilizing thermal energy in response to strain sensor output to deflect a portion of said probe card to control the geometric shape of said probe card.